Abstract: A light emitting device comprises a plurality of coherent light sources, and a plurality of light scattering structures. Each light scattering structure is located in an optical path for light output from a different corresponding one of the coherent light sources. Each light scattering structure comprises an arrangement of nanoantennas embedded in an electrically responsive material and electrical contacts by which to apply a voltage to the electrically responsive material. Application of a time varying electrical signal causes the refractive index of the electrically responsive material in a light scattering structure to vary and thereby varies light scattering by the nanoantennas in the light scattering structure. This effect may be used to reduce speckle caused by interference of light output by the coherent light sources.

Abstract: A control system for an LED array relies on defining a first and a second group of separately addressed LED pixels, with the first group including pixels with an average current no less than the current at a Q point and a second group including pixels with an average current less than the current at a Q point. An amplitude signal provided to the first group of separately addressed LED pixels is selectively modulated, while providing a DC mode 100% duty cycle. An amplitude signal provided to the second group of separately addressed LED pixels is fixed, and a modulated duty cycle is provided.

Abstract: A lighting device (1) is provided comprising a support structure (13, 13?), the support structure (13, 13?) comprising a first layer (13a, 13a?) comprising metal and a second layer (13b, 13b?) comprising metal; a central mounting face (18c) formed by a portion of the first layer (13a, 13a?) and by a portion of the second layer (13b, 13b?); and at least one lateral mounting face (18a, 18b) formed by a portion of one of the first layer (13a, 13a?) and the second layer (13b, 13b?); the lighting device (1) further comprising: at least one first light emitting element (11.1, 11.2, 11.3, 11.4, 11.5) arranged on the central mounting face (18c) in contact with the first layer (13a, 13a?) and in contact with the second layer (13b, 13b?); at least one second light emitting element (12a.1, 12a.2, 12a.3, 12a.4, 12a.5, 12b.

Abstract: Lighting devices, methods of manufacturing a lighting device, automotive lighting systems including the lighting device are described. A lighting device includes at least one light guide with an elongated recess. Multiple light-emitting elements are embedded into the recess of the light guide, arranged on a flexfoil that is bendable in three different connections, and connected to one another to mimic a filament. At least one encapsulating material encapsulates, at least in part, the at least one light guide. The at least one encapsulating material includes at least one opening and at least one reference element for aligning the at least one light guide in relation o the encapsulating material so that the multiple light-emitting elements emit light exiting the opening. The at least one encapsulating aterial is flexible so that the lighting device is bendable in three different directions.

Abstract: Methods and devices are described. A device includes an optical carrier part and a heatsink bulk part. The optical carrier part has an LED mounting area configured to receive an LED and an alignment feature configured for aligning with an optical component. The heatsink bulk part is separate from the optical carrier part and joined to the optical carrier part, such that the optical carrier part and the heatsink bulk part in conjunction are configured to perform a thermal management of an LED module, including the LED, and the heatsink bulk part, in operation.

Abstract: A micro-light emitting diode (uLED) device comprises: a mesa comprising: a plurality of semiconductor layers including an n-type layer, an active layer, and a p-type layer; a p-contact layer contacting the p-type layer; a cathode contacting the first sidewall of the n-type layer; a first region of dielectric material that insulates the p-contact layer, the active layer, and a first sidewall of the p-type layer from the cathode; an anode contacting the top surface of the p-contact layer; and a second region of dielectric material that insulates the active layer, a second sidewall of the p-type layer, and the second sidewall of the n-type layer from the anode. The top surface of the p-contact layer has a different planar orientation compared to the first and second sidewalls of the n-type layer. Methods of making and using the uLED devices are also provided.

Abstract: An LED array comprises a first mesa comprising a top surface, at least a first LED including a first p-type layer, a first n-type layer and a first color active region and a tunnel junction on the first LED, a second n-type layer on the tunnel junction, the second n-type layer comprising at least one n-type III-nitride layer with >10% Al mole fraction and at least one n-type III-nitride layer with <10% Al mole fraction. The LED array further comprises an adjacent mesa comprising a top surface, the first LED, a second LED including the second n-type layer, a second p-type layer and a second color active region. A first trench separates the first mesa and the adjacent mesa, cathode metallization in the first trench and in electrical contact with the first and the second color active regions of the adjacent mesa, and anode metallization contacts on the n-type layer of the first mesa and on the anode layer of the adjacent mesa.

Abstract: A heat sink is provided having at least one receiving section configured for thermal coupling to at least one lighting module. The heat sink includes at least two connection sections on opposite sides of the at least one receiving section. Each of the at least two connection sections includes at least one reference pin protruding at least partially from a first surface of the at least one connection section and at least one alignment recess protruding into the first surface of the at least one connection section such that the heat sink is configured for thermal coupling to another heat sink via the at least two connection sections.

Abstract: An interface currents channeling circuit may be used to convert two current channels of a conventional two-channel driver into three driving currents for the three strings of LEDs. By doing so, the same two channel driver can be used for applications requiring just two LED arrays as well as three LED arrays.

Abstract: A method to produce a light-emitting device package includes mounting junctions on pads of a metalized substrate, where the junctions are at least partially electrically insulated from each other, and forming wavelength converters, where each wavelength converter is located over a different junction and separated by a gap from neighboring wavelength converters.

Abstract: Provided is a light-emitting diode (LED) device that includes a continuous non-segmented edge contact along at least one side of a semiconductor layer. A first set of independent contacts connected to a first doped layer and a set of edge contacts connected to the second doped layer. Multiple conductive vias connect the independent contacts to the first doped layer, allowing differing corresponding via currents to be applied to the first doped layer through the vias independent of one another.

Abstract: A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder laminated onto the porous glass or silicon support structure.

Abstract: In a projection display system, a light-emitting diode (LED) can generate unpolarized light. A light guide can receive the unpolarized light from a perimeter of the light guide and guide the unpolarized light between a light emission surface and an opposing surface as guided light. The light guide can include a plurality of light-extraction features that can direct a portion of the guided light out of the light guide through the light emission surface as unpolarized emitted light. A polarizing film can reflect at least some of a first polarization state of the unpolarized emitted light into the light guide through the light emission surface and can transmit at least some of a second polarization state of the unpolarized emitted light through the polarizing film to form a polarized light beam. An angular reduction film can reduce a range of propagation angles of the polarized light beam.

Abstract: Embodiments of the invention include a semiconductor structure comprising a III-nitride light emitting layer disposed between an n-type region and a p-type region. A contact disposed on the p-type region includes a transparent conductive material in direct contact with the p-type region, a reflective metal layer, and a transparent insulating material disposed between the transparent conductive layer and the reflective metal layer. In a plurality of openings in the transparent insulating material, the transparent conductive material is in direct contact with the reflective metal layer.

Abstract: An inorganic coating may be applied to bond optically scattering particles or components. Optically scattering particles bonded via the inorganic coating may form a three dimensional film which can receive a light emission, convert, and emit the light emission with one or more changed properties. The inorganic coating may be deposited using a low-pressure deposition technique such as an atomic layer deposition (ALD) technique. Two or more components, such as an LED and a ceramic phosphor layer may be bonded together by depositing an inorganic coating using the ALD technique.

Abstract: An imaging system includes multiple LED modules, a single image sensor, a controller, a processing unit and a depth map generator. Each LED module has a distinct angular emission profile and emits light having a distinct wavelength range. The image sensor detects light originating from at least two of the LED modules after reflection by an object in a field of view of the image sensor to provide an image sensor output. The controller controls the LED modules to turn on and off such that only one LED module emits light at a time. The processing unit processes the image sensor output to identify an intensity profile for the reflected light from each of the LED modules. The depth map generator determines an angular position of the object based at least on the intensity profile for the reflected light from each of the LED modules.

Abstract: The invention provides a method for providing a luminescent particle (100) with a hybrid coating, the method comprising: (i) providing a luminescent core (102) comprising a primer layer (105) on the luminescent core (102); (ii) providing a main ALD coating layer (120) onto the primer layer (105) by application of a main atomic layer deposition process, the main ALD coating layer (120) comprising a multilayer (1120) with two or more layers (1121) having different chemical compositions, and wherein in the main atomic layer deposition process a metal oxide precursor is selected from a group of metal oxide precursors comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V; (iii) providing a main sol-gel coating layer (130) onto the main ALD-coating layer (120) by application of a main sol-gel coating process, the main sol-gel coating layer (130) having a chemical composition different from one or more of the layers (1121) of the multilayer (1120).

Abstract: A system, method and device for use as a reflector for a light emitting diode (LED) are disclosed. The system, method and device include a first layer designed to reflect transverse-electric (TE) radiation emitted by the LED, a second layer designed to block transverse-magnetic (TM) radiation emitted from the LED, and a plurality of ITO layers designed to operate as a transparent conducting oxide layer. The first layer may be a one-dimension (1D) distributed Bragg reflective (DBR) layer. The second layer may be a two-dimension (2D) photonic crystal (PhC), a three-dimension (3D) PhC, and/or a hyperbolic metamaterial (HMM). The 2D PhC may include horizontal cylinder bars, vertical cylinder bars, or both. The system, method and device may include a bottom metal reflector that may be Ag free and may act as a bonding layer.

Abstract: Methods, apparatus and systems are described herein. A light source includes a first light emitting diode (LED) die configured to emit a first die color and a second LED die configured to emit a second die color. A first filling is disposed over the first LED die. The first filling has a convex surface and includes a first phosphor such that the first die color is converted to a first illuminous color. A second filling is disposed over the second LED die. The second filling includes a second phosphor such that the second die color is converted to a second illuminous color that has a higher absorption energy than an illumination energy of the first illuminous color.

Abstract: A lighting unit includes a power supply that provides a maximum voltage and multiple LED lighting circuits. Each of the LED lighting circuits includes an LED string, multiple switches, a switching sequencer and a switch controller. The LED string includes multiple series-connected emitters having a total forward voltage that exceeds the maximum voltage of the power supply. Each of the switches is coupled in parallel with a respective LED of the LED string. The switching sequencer provides a sequence of switching patterns such that a total forward voltage of simultaneously active LEDs in each switching pattern does not exceed the maximum voltage of the power supply. The switch controller actuates switches according to each of the switching patterns in the sequence. The LED string of each of the plurality of LED lighting circuits is arranged in a two-dimensional array.