Abstract: An automotive lighting control system is provided. A light-emitting diode (LED) system of an at least partially autonomous vehicle can include a first group of LEDs including cyan and amber LEDs, a second group of LEDs including cyan and at least one of red or amber LEDs, a third group of LEDs including cyan LEDs, and a controller configured to receive a first control signal indicating whether the at least partially autonomous vehicle is in autonomous drive mode or manual drive mode and cause the cyan LEDs of the first, second, and third groups LEDs to provide perceived cyan light when and only when the autonomous vehicle is in the autonomous drive mode.

Abstract: Discussed herein are systems, devices, methods, and computer-readable media for reducing a number of undriven or underdriven uLEDs of a uLED die. A method can include identifying, by a controller of a micro light emitting diode (uLED) die, a dynamic series resistance (Rd) or forward voltage (Vf) of a uLED of the uLED die, selecting, by the controller and based on the identified Rd or Vf, a current level (IPWM_0) less than a maximum current level (IPWM_MAX) supplied by a uLED driver coupled to the uLED die, and causing, by the controller, current, at the selected current level, to be supplied to the uLED driver.

Abstract: In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure.

Abstract: A control system for an LED array relies on defining a first and a second group of separately addressed LED pixels, with the first group including pixels with an average current no less than the current at a Q point and a second group including pixels with an average current less than the current at a Q point. An amplitude signal provided to the first group of separately addressed LED pixels is selectively modulated, while providing a DC mode 100% duty cycle. An amplitude signal provided to the second group of separately addressed LED pixels is fixed, and a modulated duty cycle is provided.

Abstract: A vehicle comprises a first lighting assembly disposed to the left of a longitudinal axis of the vehicle and comprising a first array of independently operable light emitting diodes and a first projection lens arranged to form a front left light beam for the vehicle from light output from the first array of light emitting diodes, a second lighting assembly disposed to the right of the longitudinal axis of the vehicle and comprising a second array of independently operable light emitting diodes and a second projection lens arranged to form a front right light beam for the vehicle from the second array of light emitting diodes, and a controller configured to control activation of the light emitting diodes in the first array of light emitting diodes to adjust an angle between the front left light beam and the longitudinal axis of the vehicle and to control activation of the light emitting diodes in the second array of light emitting diodes to adjust an angle between the front right light beam and the longitudina

Abstract: A method includes depositing a layer comprising a photoinitiator and a curable material onto a surface and applying a nanoimprint mold on the layer of curable material to form a mesh comprising intersecting walls defining cavities. After applying the nanoimprint mold, the mesh is illuminated with light causing decarboxylation of the photoinitiator to initiate curing of the curable material. After curing the curable material, the nanoimprint mold is removed and a wavelength converting material is deposited in the cavities to form an array of wavelength converting pixels.

Abstract: A method, apparatus, and system are disclosed for increasing light extraction efficiency in a light guide optical system. The light guide optical system may comprise a light emitting source. The light emitting source may be, for example, a light-emitting diode (LED) or plurality of LEDS. The light guide optical system may also comprise a light guide plate (LGP). The LGP may include light extraction features located on surfaces of the LGP. The LGP may also include a shaped injection surface on an input surface of the LGP. The shaped injection surface may be angled to deviate near-parallel light emitted from the LED to enable the near-parallel light emitted from the LED to be extracted from the LGP via the light extraction features. The shaped injection surface may be a split edge (i.e. a V-groove) or a curved edge.

Abstract: The invention describes a light conversion device having a light converter, which is adapted to convert primary light to converted light, so that a peak emission wavelength of the converted light is in a longer wavelength range than a peak emission wavelength of the primary light. The light conversion device also has a reflective structure coupled to at least a part of a coupling surface of the light converter, where the reflective structure is a narrowband reflector arranged to reflect at least some of the primary light impinging on the reflective structure and to transmit at least some of the converted light impinging on the reflective structure.

Abstract: An optical isolation material may be applied to walls of a first cavity and a second cavity in a wafer mesh. A wavelength converting layer may be deposited into the first cavity to create a first segment and into the second cavity to create a second segment. The first segment may be attached to a first light emitting device to create a first pixel and the second segment to a second light emitting device to create a second pixel. The wafer mesh may be removed.

Abstract: A light source useful for architectural lighting, general lighting, street lighting, or other lighting applications includes a plurality of light emitting diodes. A least some light emitting diodes can be sized between 30 microns and 500 microns. A plurality of micro-optics sized less than 1 millimeter are positioned over at least some of the plurality of light emitting diodes and a controller is connected to selectively power groups of the plurality of light emitting diodes to provide different light beam patterns.

Abstract: Lighting device, in particular for automotive lighting applications, comprising a plurality of lighting elements arranged in one or more rows in order to form a luminous band, wherein each lighting element comprises at least one or more light emitting diodes (LEDs). The plurality of lighting elements is divided into one or more segments, wherein the lighting elements within each segment are electrically connected in series or in parallel. The lighting device further comprises at least one contacting element providing current for the plurality of lighting elements, wherein at least a first contacting element provides current for a first group of segments such that groups of lighting elements are independently and dynamically controlled.

Abstract: An adaptive lighting system comprises an array of independently controllable LEDs, and a metalens positioned to collimate, focus, or otherwise redirect light emitted by the array of LEDs. The adaptive lighting system may optionally include a pre-collimator positioned in the optical path between the array of LEDs and the metalens.

Abstract: An LED array comprises a first mesa comprising a top surface, at least a first LED including a first p-type layer, a first n-type layer and a first color active region and a tunnel junction on the first LED, a second n-type layer on the tunnel junction, the second n-type layer comprising at least one n-type III-nitride layer with >10% Al mole fraction and at least one n-type III-nitride layer with <10% Al mole fraction. The LED array further comprises an adjacent mesa comprising a top surface, the first LED, a second LED including the second n-type layer, a second p-type layer and a second color active region. A first trench separates the first mesa and the adjacent mesa, cathode metallization in the first trench and in electrical contact with the first and the second color active regions of the adjacent mesa, and anode metallization contacts on the n-type layer of the first mesa and on the anode layer of the adjacent mesa.

Abstract: A light emitting device is disclosed and includes an emission source configured to emit a primary blue light and a wavelength-converting element configured to convert the primary blue light to a secondary light, where the wavelength-converting element including a red phosphor material having a peak emission wavelength that is less than 620 nm and a green phosphor material having a peak emission wavelength that is greater than 530 nm. The device may have a correlated color temperature (CCT) in the range of 1600K-2500K, may exhibit a melanopic/photopic ratio less than 0.25 and/or may exhibit a radiometric power fraction of light having a wavelength below 530 nm below 0.1.

Abstract: A system, method and device for collimating the output of a light emitting diode (LED) are disclosed. The system, method and device include an LED substrate including a top surface from which the light is emitted, and an array of subwavelength scattering antennas positioned within the emitted light path, the array of subwavelength scattering antennas configured to select directions of scatter of the LED emitted light to provide collimated light output from the device. The array may be aligned perpendicular to the plane of propagation of the light emitted from the LED and may be positioned adjacent to the top surface. The array may be at least partially, or completely, positioned within the LED substrate. The array may be spaced a distance from the top surface and the spacing may be achieved using a dielectric spacer adjacent to the top surface. The array may be positioned within the dielectric spacer.

Abstract: Described at light emitting diode (LED) devices emitting different colors on the same wafer, which facilitates their integration with close packing density (not requiring transfer of devices from two different wafers to a third substrate module). The LED devices and driving methods allow light of different colors and similar luminance levels to be emitted for given input current.

Abstract: Described are light emitting diode (LED) devices comprising a mesa with semiconductor layers, the semiconductor layers including an N-type layer, an active layer, and a P-type layer. The mesa has a top surface and at least one side wall, the at least one side wall defining a trench having a bottom surface. A passivation layer is on the at least one side wall and on the top surface of the mesa, the passivation layer comprises one or more a low-refractive index material and distributed Bragg reflector (DBR). A p-type contact is on the top surface of the mesa, and an n-type contact on the bottom surface of the trench.

Abstract: A light emitting device comprises a first group of one or more LEDs each configured to emit light having a blue color point in the 1931 CIE x,y Chromaticity Diagram, a second group of one or more LEDs each configured to emit light having a cyan or yellow color point in the 1931 CIE x,y Chromaticity Diagram, and a third group of one or more LEDs each configured to emit light having a red color point in the 1931 CIE x,y Chromaticity Diagram.

Abstract: Described are light emitting diode (LED) devices comprising a mesa with semiconductor layers, the semiconductor layers including an N-type layer, an active layer, and a P-type layer. A patterned transparent conductive oxide layer is on the top surface of the mesa. The patterned transparent conductive oxide layer has a first portion with a first thickness and a second portion with a second thickness, the second thickness less than the first thickness. Optical loss of the LED is reduced in the thinned region of the transparent conductive oxide layer.

Abstract: A converter layer bonding device, and methods of making and using the converter layer bonding device are disclosed. A converter layer bonding device as disclosed herein includes a release liner and an adhesive layer coating the release liner, the adhesive layer is solid and non-adhesive at room temperature, and is adhesive at an elevated temperature above room temperature.