Abstract: Embodiments of the invention include a light emitting device including a substrate and a semiconductor structure including a light emitting layer. A first reflective layer surrounds the light emitting device. A wavelength converting element is disposed over the light emitting device. A second reflective layer is disposed adjacent a first sidewall of the wavelength converting element.

Abstract: Described are arrays of light emitting diode (LED) devices and methods for their manufacture. An LED array comprises a first mesa comprising a top surface, at least a first LED including a first p-type layer, a first n-type layer and a first color active region and a tunnel junction on the first LED, the top surface comprising a second n-type layer on the tunnel junction. The LED array further comprises an adjacent mesa comprising a top surface, the first LED, a second LED including the second n-type layer, a second p-type layer and a second color active region. There is a first trench separating the first mesa and the adjacent mesa, n-type metallization in the first trench and in electrical contact with the first color active region and the second color active region of the adjacent mesa, and p-type metallization contacts on the n-type layer of the first mesa and on the p-type layer of the adjacent mesa.

Abstract: A system may include a light source. A converter may be configured to convert an AC voltage to a DC operating voltage during normal operation. A power backup device may be coupled to the converter. A current source may have a first terminal configured to receive the DC operating voltage during regular operation and a second terminal configured to provide a pulse-width modulated (PWM) signal to an anode end of the light source. A switching device may have a first connecting terminal coupled to the anode end of the light source, a second connecting terminal coupled to the power backup device, and a control terminal coupled to the converter. The switching device may be configured to open a switch between the first connecting terminal and the second connecting terminal during normal operation and close the switch upon detecting an interruption of the DC operating voltage at the control terminal.

Abstract: An array of phosphor pixels is positioned on an array of semiconductor LED pixels with thermally curable adhesive between them. Selected LED pixels of the array are electrically activated; resulting heat cures the adhesive to attach the corresponding phosphor pixel to the activated LED pixel and to release the corresponding phosphor pixel from a carrier. Removal of the carrier removes unattached phosphor pixels, leaving behind phosphor pixels attached to the LED pixels that were activated. The process can be repeated for phosphor pixels of different colors.

Abstract: An array of phosphor pixels is positioned on an array of semiconductor LED pixels with thermally curable adhesive between them. Selected LED pixels of the array are electrically activated; resulting heat cures the adhesive to attach the corresponding phosphor pixel to the activated LED pixel and to release the corresponding phosphor pixel from a carrier. Removal of the carrier removes unattached phosphor pixels, leaving behind phosphor pixels attached to the LED pixels that were activated. The process can be repeated for phosphor pixels of different colors.

Abstract: Lighting devices and methods of manufacturing lighting devices are described. A lighting devices includes at least one thermally conductive element, at least one lighting module thermally coupled to the at least one thermally conductive element, and an overmould at least partially encasing the at least one thermally conductive element, the overmould comprising at least one receiving portion. The at least one circuit board is mounted in the at least one receiving portion and is at least partially exposed from the overmould. The at least one circuit board includes at least one connector and at least two bond pads. The at least one connector includes surface accessible conduction lines.

Abstract: A lighting device includes a first LED configured to emit a first light, a second LED configured to emit a third light, a first phosphor disposed over the first LED and second LED, and arranged to absorb a portion of the first light and in response emit a second light of a longer wavelength than the first light, and a second phosphor disposed over the second LED, the second phosphor arranged to absorb a portion of the third light and in response emit a fourth light of a longer wavelength than the third light, and the fourth light exits the second phosphor into the first phosphor, and both the second light and fourth light exit the lighting device though the first phosphor.

Abstract: A converter layer bonding device, and methods of making and using the converter layer bonding device are disclosed. A converter layer bonding device as disclosed herein includes a release liner and an adhesive layer coating the release liner, the adhesive layer is solid and non-adhesive at room temperature, and is adhesive at an elevated temperature above room temperature.

Abstract: A device may include a wavelength converting layer on an epitaxial layer. The wavelength converting layer may include a first surface having a width that is equal to a width of the epitaxial layer, a second surface having a width that is less than the width of the first surface, and angled sidewalls. A conformal non-emission layer may be formed on the angled sidewalls and sidewalls of the epitaxial layer, such that the second surface of the wavelength converting layer is exposed.

Abstract: A light source useful for architectural lighting, general lighting, street lighting, or other lighting applications includes a plurality of light emitting diodes. A least some light emitting diodes can be sized between 30 microns and 500 microns. A plurality of micro-optics sized less than 1 millimeter are positioned over at least some of the plurality of light emitting diodes. A controller may be connected to selectively power groups of the plurality of light emitting diodes to provide different light beam patterns.

Abstract: A light-emitting device includes a substrate, a semiconductor diode structure, a wavelength-converting layer less than 50. microns thick with luminescent particles in an index-matched inorganic binder, optical sidewall coating, and an optical sidewall structure. The optical sidewall structure is interposed between substrate sidewalls and optical sidewall coating, and redirects side-propagating output light toward or within the wavelength-converting layer. The optical sidewall structure can be part of the wavelength-converting layer or part of an adhering layer between the substrate and the wavelength-converting layer.

Abstract: Devices, systems and methods are described. A method includes driving a first light source to generate a visible light pulse having a first intensity for a first duration to illuminate a scene. An image sensor is used to record a visible-spectrum image of the scene illuminated by the first light pulse. A second light source is driven to generate a second light pulse having a second intensity that exceeds the first intensity by at least 100% for a second duration that is at most 10% of the first duration to illuminate the scene during the first duration. An image sensor is used to record a monochrome image of the scene illuminated by the second light pulse. Image processing is performed on a visible-spectrum image and the monochrome image to obtain the digital image of the scene.

Abstract: A thin plastic light guide is formed to have cavities on one surface and TIR (total internal reflection) structures directly above the cavities. LEDs mounted on a printed circuit board are positioned hi the cavities. The cavity walls are shaped to refract the LED light and direct the LED light toward the TIR structures to most efficiently make use of the TIR structures. The TIR structures may have a cusp or cone shape. The top ceiling of the cavities may be shaped to direct light at the TIR structure so as to leak through the TIR structure and blend the light with light leaking through surrounding portions of the light guide. The LEDs may be distributed only near the edges of the light guide or over the entire back surface of the light guide. A diffuser sheet may be laminated over the light guide to further mix the light.

Abstract: Techniques and devices are provided for sensing image data from a scene and activating primary light sources based on information sensed from the scene. Subsets of a plurality of primary light sources may be activated to emit sensing spectrum of light onto a scene. Combined image data may be sensed from the scene while the subsets of the plurality of primary light sources are activated. Reflectance information for the scene may be determined based on the combined image data and combined sensing spectra. Spectrum optimization criteria for the primary light sources may be determined based on the reference information and a desired output parameter provided by a user or determined by a controller. The plurality of primary light sources may be activated to emit a lighting spectrum based on the spectrum optimization criteria.

Abstract: The invention describes a passive matrix single-color LED display assembly comprising a matrix of row conductor lines and column conductor lines; an array of direct-emitting LED packages, wherein the anode of each LED package is electrically connected to one of the row conductor lines and the cathode of that LED package is connected to one of the column conductor lines; and a driver configured to apply a bias voltage to a row conductor line and to apply a bias voltage to a column conductor line according to an image to be displayed.

Abstract: A method to make light-emitting diode (LED) units include arranging LEDs in a pattern, forming an optically transparent spacer layer over the LEDs, forming an optically reflective layer over the LEDs, and singulating the LEDs into LED units. The method may further include, after forming the optically transparent spacer layer and before singulating the LEDs, forming a secondary light-emitting layer that conforms to the LEDs, cutting the LEDs to form LED groups having a same arrangement, spacing the LED groups on a support, and forming the optically reflective layer in spaces between the LED groups.

Abstract: A LED assembly includes a baseplate and a diffuser. A circuit board connected to the baseplate has a first set of LEDs directed to emit light toward the diffuser. Additionally, a frame is attached to the baseplate and positioned to surround the circuit board. A flexible circuit with a second set of LEDs is attached to the frame, with the LEDs positioned to emit light predominantly perpendicular with respect to the first set of LEDs.

Abstract: Methods of manufacturing light-emitting devices are described herein. A method includes obtaining a packaging substrate. The packaging substrate includes an embedded metal inlay, vias in the packaging substrate and contacts on a bottom surface of the packaging substrate, each electrically coupled to a respective one of the vias. The method also includes forming a hybridized device, attaching a bottom surface of the hybridized device to a top surface of the metal inlay, and wirebonding a top surface of the hybridized device to a stop surface of the packaging substrate using a plurality of conductive connectors.

Abstract: A lighting device comprises a support comprising a mounting section having at least one mounting face. The at least one mounting face has an arrangement direction and comprising at least two contact sections along the arrangement direction. The support further comprises a body section adjacent to the mounting section. The support further comprises a plurality of layered conductors connecting the body section to the at least one mounting face. The lighting device comprises at least one light-emitting element mounted along the arrangement direction of the at least one mounting face such that the at least one light-emitting element is in electrical contact to the at least two contact sections.

Abstract: The invention refers to a lighting device (18) comprising a light-emitting module (2) and an optical system. The optical system comprises a first reference face (16), wherein the first reference face (16) is configured to accommodate the light-emitting module (2); and at least one spring element (20) is provided for fixing the light-emitting module (2) to the optical system in a clamping position, wherein the at least one spring element (20) comprises a first spring section (26) configured to exert a spring force in a first spatial direction (f1) towards the first reference face (16) in the clamping position, wherein the at least one spring element further comprises a second spring section (28) configured to exert a spring force towards a second spatial direction (f2) in the clamping position, and wherein the second spatial direction (f2) is different from the first spatial direction (f1). The invention further relates to a method for fixing a light-emitting module (2) to an optical system.