Abstract: A vehicle light assembly comprising: a flexible lighting strip with a multitude of light-emitting diodes that are bent around at least two linear independent axes; an optically passive lighting strip terminator that is coupled to an end surface of the flexible lighting strip and is arranged such that light emitted by the light emitting diodes is at least partly recycled; a light guiding structure comprising a light receiving surface that receives light emitted by the flexible lighting strip and the lighting strip terminator and surface defines a bending of the flexible lighting strip and a primary light emission surface that emits at least a part of the light received via the light receiving surface; a coupling structure that mechanically couples the flexible lighting strip and the lighting strip terminator to the light receiving surface. The vehicle light assembly can further be comprised in a front or rear vehicle light.

Abstract: An interface currents channeling circuit may be used to convert two current channels of a conventional two-channel driver into three driving currents for the three strings of LEDs. By doing so, the same two channel driver can be used for applications requiring just two LED arrays as well as three LED arrays.

Abstract: The invention describes a lighting assembly and a lighting device with improved thermal behavior and a method to manufacture such a lighting assembly comprising at least one point-like light source having a first and a second electrical contact, a lead frame having metal areas to electrically connect at least the first electrical contact and to spread heat from the point-like light sources via the metal areas, and a plastic layer arranged at least on top of the lead frame. One or more conductive traces are applied on a first surface of the plastic layer facing away from the lead frame to electrically insulate the conductive traces on the plastic layer from the metal areas of the lead frame. Additional components or the second electrical contact might be connected to the conductive traces.

Abstract: Some embodiments include a III-nitride light emitting device with a light emitting layer disposed between an n-type region and a p-type region. A glass layer is connected to the III-nitride light emitting device. A wavelength converting layer is disposed between the III-nitride light emitting device and the glass layer. The glass layer is narrower than the III-nitride light emitting device.

Abstract: An LED module includes a substrate having a high thermal conductivity and at least one LED die mounted on the substrate. A wavelength conversion material, such as phosphor or quantum dots in a binder, has a very low thermal conductivity and is formed to have a relatively high volume and low concentration over the LED die so that the phosphor or quantum dots conduct little heat from the LED die. A transparent top plate having a high thermal conductivity is positioned over the wavelength conversion material, and a hermetic seal is formed between the top plate and the substrate surrounding the wavelength conversion material. The LED die is located in a cavity in either the substrate or the top plate. In this way, the temperature of the wavelength conversion material is kept well below the temperature of the LED die. The sealing is done in a wafer level process.

Abstract: Embodiments of the invention include a luminescent structure including an InZnP core comprising an alloy including both In and Zn, and a shell disposed on a surface of the core, wherein the core has a crystal lattice constant that matches or nearly matches the lattice constant of the shell.

Abstract: Described herein are methods for using remote plasma chemical vapor deposition (RP-CVD) and sputtering deposition to grow layers for light emitting devices. A method includes growing a light emitting device structure on a growth substrate, and growing a tunnel junction on the light emitting device structure using at least one of RP-CVD and sputtering deposition. The tunnel junction includes a p++ layer in direct contact with a p-type region, where the p++ layer is grown by using at least one of RP-CVD and sputtering deposition. Another method for growing a device includes growing a p-type region over a growth substrate using at least one of RP-CVD and sputtering deposition, and growing further layers over the p-type region. Another method for growing a device includes growing a light emitting region and an n-type region using at least one of RP-CVD and sputtering deposition over a p-type region.

Abstract: A method to make light-emitting diode (LED) units include arranging LEDs in a pattern, forming an optically transparent spacer layer over the LEDs, forming an optically reflective layer over the LEDs, and singulating the LEDs into LED units. The method may further include, after forming the optically transparent spacer layer and before singulating the LEDs, forming a secondary light-emitting layer that conforms to the LEDs, cutting the LEDs to form LED groups having a same arrangement, spacing the LED groups on a support, and forming the optically reflective layer in spaces between the LED groups.

Abstract: The invention describes an LED lighting unit comprising a container with a number of partially reflective side walls; a light exit opening defined by the side walls; and a number of light-emitting diodes arranged in the container to emit light of a first color through the light exit opening during an on-state of the lighting unit; characterized in that the material properties of the partially reflective container side walls are chosen to impart a second non-white color to the container side walls, and to absorb light in at least one specific region of the visible spectrum such that light of the non-white second color exits the lighting unit through the light exit opening during an off-state of the lighting unit. The invention further describes a method of manufacturing such an LED lighting unit.

Abstract: Techniques and devices are provided for sensing image data from a scene and activating primary light sources based on information sensed from the scene. Subsets of a plurality of primary light sources may be activated to emit sensing spectrum of light onto a scene. Combined image data may be sensed from the scene while the subsets of the plurality of primary light sources are activated. Reflectance information for the scene may be determined based on the combined image data and combined sensing spectra. Spectrum optimization criteria for the primary light sources may be determined based on the reference information and a desired output parameter provided by a user or determined by a controller. The plurality of primary light sources may be activated to emit a lighting spectrum based on the spectrum optimization criteria.

Abstract: The invention describes a method of manufacturing an LED lighting assembly, which method comprises the steps of preparing a flexible carrier for a number of light-emitting diodes; mounting the light-emitting diodes onto the flexible carrier; providing a flexible shaping element made of a material that can be bent into a desired shape or form and incorporating a heat spreader; and winding the flexible carrier about the flexible shaping element in a helical manner. The invention further describes such an LED lighting assembly, and an LED lighting unit comprising such an LED lighting assembly.

Abstract: A method for manufacturing light emitting devices, comprising: providing a package body including: (i) a reflector cup defining a cavity and (ii) a plurality of metal pads disposed at a bottom surface of the cavity; performing reservoir stencil printing to deposit a respective solder pattern on each of the metal pads, the reservoir stencil printing being performed using a 3D electroform stencil that is placed over the reflector cup, the 3D electroform stencil including a lip configured to engage one or more sidewalls of the reflector cup, and a reservoir extending away from the lip and into the cavity; placing an LED die on the solder patterns that are formed on the metal pads and performing reflow soldering to attach the LED die to the metal pads.

Abstract: A lighting module and a lighting assembly provide high irradiance at long working distances. The lighting module includes at least two rows of multiple LEDs separated from each other by an intermediate area between the rows and one integral optical element on top of the at least two rows of multiple LEDs. The one integral optical element includes one collimator lens portion per row of LEDs extending along the row of LEDs. The collimator lens portions of different rows are merged together above the intermediate area. The collimator lens portions, seen in a direction perpendicular to the at least two rows, provide an off-axis focus for the one collimator lens portion, and focus light emitted from the at least two rows of multiple LEDs in a focus line extending parallel to the rows of LEDs at a focus distance above the optical element.

Abstract: A light-emitting device comprising: a light source; and a light guide that is optically coupled to the light source, the light guide including a plurality of first non-fluorescent light extraction elements and a plurality of second non-fluorescent light extraction elements that are printed on the light guide, each of the first light extraction elements having a reflectance that is higher than a reflectance of any of the second light extraction elements, each of the first light extraction elements having a light transmittance that is lower than a light transmittance of any the second light extraction elements, each of the first light extraction elements having the same shape and size as any other one of the plurality first light extraction elements, and each of the second light extraction elements having the same shape and size as any other one of the plurality of second light extraction elements.

Abstract: An elongated lens (300) is formed with a trough (310) along the long axis on the light emitting surface of the lens. The elongated lens (300) may include a curved wall (325) about its perimeter, and a smooth transition (317) between the curved wall (325) and the trough (310). The trough (310) may include a concave shape along both the long axis and the short axis, although the radius of curvature of the concave shape may differ between the long and short axes. The eccentricity of the illumination pattern may be controlled by the size of the trough (310) and these radii of curvature.

Abstract: Interlocking light emitting diode (“LED”) light guide tiles are disclosed. The tiles have interlocking edge features that provide physical interlock fitting between tiles and present a continuous appearance, both in an “on,” where LEDs are powered on and emitting light state and an “off” state, where LEDs are powered off and not emitting light. The LED light guide tiles interface with LEDs (housed in or embodied as integrated circuit LED packages) to output light through the surfaces of the light guide. The interlocking edge features of the light guide tiles are shaped to obscure or block an image of the LED packages from being seen by observers looking at the light guide tiles. Light guide tile assemblies or installations can be easily formed out of interchangeable tiles with little or no requirement for relative directional alignment of the tiles.

Abstract: A structure according to embodiments of the invention includes a light emitting device for emitting light having a first peak wavelength. A wavelength converting layer is disposed in a path of light emitted by the light emitting device. The wavelength converting layer absorbs light emitted by the light emitting device and emits light having a second peak wavelength. The wavelength converting layer includes a mixture of a wavelength converting material, a transparent material, and an adhesive material, wherein the adhesive material is no more than 15% of the weight of the wavelength converting layer.

Abstract: Lighting systems are described. A lighting system includes a first lead frame portion and a second lead frame portion. The first lead frame portion has at least a top surface, a bottom surface, and an opening. The second lead frame portion is within the opening of the first lead frame portion and has at least a top surface and a bottom surface. Light-emitting diode (LED) devices are each mechanically and electrically coupled to the top surface of the first lead frame portion and the top surface of the second lead frame portion. An electrically insulating and optically reflective material is disposed over exposed regions of the top surfaces of the first and second lead frame portions.

Abstract: Described herein is a method and system for dual stretching of wafers to create isolated segmented chip scale packages. A wafer having an array of light-emitting diodes (LEDs) is scribed into LED segments, where each LED segment includes a predetermined number of LEDs. The scribed wafer is placed on a stretchable substrate or tape. The tape is stretched and a layer of optically material is placed in the separation gaps. The stretched wafer is scribed on a LED level. The tape is stretched and another layer of optically opaque material is placed in the separation gaps. The same or different optically opaque material can be used for the layers. The two layers of optically opaque material are formed to provide electrical connectivity between the LEDs in each LED segment. In an implementation, each segment or LED is individually addressable.

Abstract: Chip-on-board (COB) modular lighting systems and methods of manufacture are described herein. A system includes a COB assembly including a thermally conductive plate and a COB light-emitting diode (LED) device thermally coupled to the thermally conductive plate. The COB LED device includes multiple LED chips disposed on a surface of a substrate. The substrate includes first electrical power contacts exposed from at least the surface. The system further includes an electronics board that has second electrical power contacts. The electronics board is attached to the COB assembly such that the first and second electrical contacts are electrically coupled and the thermally conductive plate is attached to the electronics board.