Abstract: The invention relates to a charged particle beam lithography system comprising: a charged particle optical column arranged in a vacuum chamber for projecting a charged particle beam onto a target, wherein the column comprises deflecting means for deflecting the charged particle beam in a deflection direction, a target positioning device comprising a carrier for carrying the target, and a stage for carrying and moving the carrier along a first direction, wherein the first direction is different from the deflection direction, wherein the target positioning device comprises a first actuator for moving the stage in the first direction relative to the charged particle optical column, wherein the carrier is displaceably arranged on the stage and wherein the target positioning device comprises retaining means for retaining the carrier with respect to the stage in a first relative position.

Abstract: The invention relates to a differential interferometer module adapted for measuring a direction of displacement between a reference mirror and a measurement mirror. In an embodiment the differential interferometer module is adapted for emitting three reference beams towards a first mirror and three measurement beams towards a second mirror for determining a displacement between said first and second mirror. In a preferred embodiment the same module is adapted for measuring a relative rotation around two perpendicular axes as well. The present invention further relates to a lithography system comprising such a interferometer module and a method for measuring such a displacement and rotations.

Abstract: The invention relates to a method for determining a beamlet position in a charged particle multi-beamlet exposure apparatus. The apparatus is provided with a sensor comprising a conversion element for converting charged particle energy into light and a light sensitive detector. The conversion element is provided with a sensor surface area provided with a 2D-pattern of beamlet blocking and non-blocking regions. The method comprises taking a plurality of measurements and determining the position of the beamlet with respect to the 2D-pattern on the basis of a 2D-image created by means of the measurements. Each measurement comprises exposing a feature onto a portion of the 2D-pattern with a beamlet, wherein the feature position differs for each measurement, receiving light transmitted through the non-blocking regions, converting the received light into a light intensity value, and assigning the light intensity value to the position at which the measurement was taken.

Abstract: A target processing machine (100), such as a lithography or inspection machine, comprising a rigid base plate (150), a projection column (101) for projecting one or more optical or particle beams on to a target (130), a support frame (102) supporting the projection column, the support frame being supported by and fixed to the base plate, a stage comprising a movable part (128) for carrying the target and a fixed part (132, 133) being supported by and fixed to the base plate, a beam sensor (160) for detecting one or more of the beams projected by the column, the beam sensor at least in part being supported by and fixed to the base plate, and a vacuum chamber (110) enclosing the support frame and the column, for maintaining a vacuum environment in the interior space of the chamber, the vacuum chamber formed with the base plate forming part thereof and supporting a plurality of wall panels (171, 172) including a plurality of side wall panels (171) supported by and fixed thereto.

Abstract: A method of forming an optical fiber array. The method comprises providing a substrate having a first surface and an opposing second surface. The substrate is provided with a plurality of apertures extending through the substrate from the first surface to the second surface. Additionally, a plurality of fibers is provided. The fibers have fiber ends with a diameter smaller than the smallest diameter of the apertures. For each fiber, from the first surface side of the substrate, the fiber is inserted in a corresponding aperture such that the fiber end is positioned in close proximity of the second surface. Then the fiber is bent in a predetermined direction such that the fiber abuts a side wall of the aperture at a predetermined position. Finally, the bent fibers are bonded together using an adhesive material.

Abstract: A target positioning device, in particular for a lithography system, comprising a carrier for carrying a target, and a stage for carrying and moving the carrier along a first direction (X). The stage comprising two X-stage bases, both arranged on top of a common base plate, each X-stage base carries an X-stage carriage, and a Y-beam comprising a Y-stage for carrying said carrier and moving the carrier said carrier in a second direction (Y). The Y-beam bridges the space between the X-stage carriages and is connected to the X-stage carriages via a flexible coupling. The device further comprises two motors each for driving a corresponding X-stage carriage along its corresponding X-stage base. The two motors are arranged at least substantially below the stage. Each motor of said two motors is coupled to an eccentric cam or crank which is connected to the corresponding X-stage carriage via a crank shaft.

Abstract: The invention relates to a method for determining a distance between charged particle beamlets in a multi-beamlet exposure apparatus. The apparatus is provided with a sensor comprising a converter element for converting charged particle energy into light and a light sensitive detector provided with a two-dimensional pattern of beamlet blocking and non-blocking regions. The method comprises scanning a first beamlet over the pattern, receiving light generated by the converter element, and converting the received light into a first signal. Then the two-dimensional pattern and the first beamlet are moved relatively with respect to each other over a predetermined distance. Subsequently, the method comprises scanning a second beamlet over the pattern, receiving light generated by the converter element, and converting the received light into a second signal. Finally, the distance between the first beamlet and second beamlet is determined based on the first signal, the second signal and the predetermined distance.

Abstract: A substrate support structure for clamping a substrate by means of a capillary force created by a liquid clamping layer having a lower pressure than its surroundings. The substrate support structure comprises a surface provided with a plurality of substrate supporting elements for holding the substrate, and the surface further comprises portions with different capillary potential for inducing, during clamping, a predetermined capillary flow within the liquid clamping layer.

Abstract: The present invention relates to a projection lens assembly module for directing a multitude of charged particle beamlets onto an image plane located in a downstream direction, and a method for assembling such a projection lens assembly. In particular the present invention discloses a modular projection lens assembly with enhanced structural integrity and/or increased placement precision of its most downstream electrode.

Abstract: The invention relates to a modulation device for use in a charged particle multi-beamlet lithography system. The device includes a body comprising an interconnect structure provided with a plurality of modulators and interconnects at different levels within the interconnect structure for enabling connection of the modulators to one or more pattern data receiving elements. A modulator includes a first electrode, a second electrode, and an aperture extending through the body. The electrodes are located on opposing sides of the aperture for generating an electric field across the aperture. At least one of the first electrode and the second electrode includes a first conductive element formed at a first level of the interconnect structure and a second conductive element formed at a second level of the interconnect structure. The first and second conductive elements are electrically connected with each other.

Abstract: The invention relates to a charged particle beam lithography system comprising: a charged particle optical column arranged in a vacuum chamber for projecting a charged particle beam onto a target, wherein the column comprises deflecting means for deflecting the charged particle beam in a deflection direction, a target positioning device comprising a carrier for carrying the target, and a stage for carrying and moving the carrier along a first direction, wherein the first direction is different from the deflection direction, wherein the target positioning device comprises a first actuator for moving the stage in the first direction relative to the charged particle optical column, wherein the carrier is displaceably arranged on the stage and wherein the target positioning device comprises retaining means for retaining the carrier with respect to the stage in a first relative position.

Abstract: The invention relates to a charged particle system provided with a support and positioning structure for supporting and positioning a target on a table, the support and positioning structure comprising a first member and a second member and at least one motor so as to move the first member relative to the second member, wherein a shield is present to shield at least one charged particle beam from electromagnetic fields generated by said at least one motor, the support and positioning structure further comprising a spring mechanically coupling the first member and the second member for at least partially bearing the weight of the first member, table and target.

Abstract: A method of processing substrates in a lithography system unit, the lithography system unit comprising at least two substrate preparation units, a load lock unit comprising at least first and second substrate positions, and a substrate handling robot for transferring substrates between the substrate preparation units and the load lock unit. The method comprises providing a sequence of substrates to be exposed to the robot, including an Nth substrate, an N?1th substrate, and an N+1th substrate; transferring the Nth substrate to a first one of the substrate preparation units; clamping the Nth substrate on a first substrate support structure in the first substrate preparation unit to form a clamped Nth substrate; transferring the clamped Nth substrate from the first substrate preparation unit to an unoccupied one of the first and second positions in the load lock unit; and exposing the clamped Nth substrate in the lithography system unit.

Abstract: The invention relates to a device for spot size measurement at wafer level in a multi charged particle beam lithography system. The device comprises a knife edge structure on top of a scintillating material, such a YAG material. The knife edge structure is arranged in a Si wafer which has a top plane at a sharp angle to a (1 1 0) plane of the Si. In an embodiment the angle is in the range from 2 to 4 degrees, preferably in the range from 2.9-3.1 degrees. The invention relates in addition to a method for manufacturing a device for spot size measurement at wafer level in a multi charged particle beam lithography system.

Abstract: The invention relates to a charged-particle multi-beamlet lithography system. The system comprises a beam generator for generating a plurality of beamlets, a beamlet blanker array for patterning the plurality of beamlets, an optical fiber arrangement, and a projection system. The beamlet blanker array comprises a substrate provided with a first area comprising one or more modulators and a second area free of modulators. The beamlet blanker array comprises one or more light sensitive elements, electrically connected to the one or more modulators, and arranged to receive light beams carrying pattern data. The optical fiber arrangement comprises a plurality of optical fibers for guiding the light beams carrying pattern data towards the one or more light sensitive elements. The projection of the optical fiber arrangement onto a surface of the beamlet blanker array in a direction perpendicular to the surface falls entirely within the second area.

Abstract: A charged particle lithography system for transferring a pattern onto the surface of a target, comprising a source for generating a charged particle beam, a first chamber housing the source, a collimating system for collimating the charged particle beam, a second chamber housing the collimating system, and a first aperture array element for generating a plurality of charged particle subbeams from the collimated charged particle beam.

Abstract: The invention relates to a vibration isolation module (101) for a lithographic apparatus or an inspection apparatus. The module comprises a support frame (102), an intermediate body (103) and a support body (104) for accommodating the lithographic apparatus. The intermediate body is connected to the support frame by means of at least one spring element such that the intermediate body is a hanging body. The support body is connected to the intermediate body by means of at least one pendulum rod (108) such that the support body is a hanging body. The invention further relates to a substrate processing system comprising such vibration isolation module.

Abstract: The invention relates to a lithography system comprising a plurality of lithography system units. Each lithography system unit comprises a lithography apparatus arranged in a vacuum chamber for patterning a substrate; a load lock system for transferring substrates into and out of the vacuum chamber; and a door for enabling entry into the vacuum chamber for servicing purposes. The load lock system and the door of each lithography system unit are provided at the same side and face a free area at a side of the lithography system, in particular the service area.

Abstract: A projection lens arrangement for a charged particle multi-beamlet system, the projection lens arrangement including one or more plates and one or more arrays of projection lenses. Each plate has an array of apertures formed in it, with projection lenses formed at the locations of the apertures. The arrays of projection lenses form an array of projection lens systems, each projection lens system comprising one or more of the projection lenses formed at corresponding points of the one or more arrays of projection lenses.

Abstract: The present invention relates a probe forming lithography system for generating a pattern on to a target surface such as a wafer, using a black and white writing strategy, i.e. writing or not writing a grid cell, thereby dividing said pattern over a grid comprising grid cells, said pattern comprising features of a size larger than that of a grid cell, in each of which cells said probe is switched “on” or “off, wherein a probe on said target covers a significantly larger surface area than a grid cell, and wherein within a feature a position dependent distribution of black and white writings is effected within the range of the probe size as well as to a method upon which such system may be based.