Abstract: A hypertext displaying apparatus is provided. When a link destination indicated in stored data is designated, a processing section instructs a transmission/reception section to download hypertext data at the link destination, and instructs a history storage section to register an identifier of the currently-displayed stored data. If a user gives a “previous content” instruction, the processing section reads from a stored information storage section the stored data corresponding to the identifier registered in the history information storage section, so that the stored data is displayed on a screen.

Abstract: A video transmission system, a video transmitting apparatus, a video receiving apparatus, and a video transmission method whereby, when a plurality of terminals whose characteristics differ receive video simultaneously, each terminal can receive video with quality appropriate for that terminal. In this system, a video transmitting apparatus (100) divides layered-coded data by quality and bit rate by means of a channel division section (106), and transmits data on separate channels from a video transmitting section (108) after adding priorities calculated by a priority calculation section (112). Video transmitting apparatus (100) also groups channels by quality and calculates a group list by means of a group list calculation section (114), and transmits this group list from a group list transmitting section (116).

Abstract: A ceramic laminated board is provided which has thermal via holes penetrating the inside from the main face of the board. In the thermal via hole, a heat transfer body is placed which has a metallic body and a composite material provided entirely or partially between the metallic body and the ceramic laminated board. The composite material is higher in thermal conductivity than air and is lower in thermal expansion coefficient than the metallic body.

Abstract: In order to realize a plasma doping method capable of carrying out a stable low-density doping, exhaustion is carried out with a pump while introducing a predetermined gas into a vacuum chamber from a gas supplying apparatus, the pressure of the vacuum chamber is held at a predetermined pressure and a high frequency power is supplied to a coil from a high frequency power source. After the generation of plasma in the vacuum chamber, the pressure of the vacuum chamber is lowered, and the low-density plasma doping is performed to a substrate placed on a substrate electrode. Moreover, the pressure of the vacuum chamber is gradually lowered, and the high frequency power is gradually increased, thereby the low-density plasma doping is carried out to the substrate placed on the substrate electrode.

Abstract: A MIS-type semiconductor device includes a p-type semiconductor substrate, a gate insulating film formed on the semiconductor substrate, a gate electrode formed on the gate insulating film, and n-type diffused source and drain layers formed in regions of the semiconductor substrate located below both sides of the gate electrode. Insides of the n-type diffused source and drain layers are formed with p-type impurity implanted regions having a lower p-type impurity concentration than the impurity concentration of the n-type diffused source and drain layer.

Abstract: A semiconductor device (51) for controlling a switching power supply, includes a switching element (1) and a switching control circuit. During an intermittent switching operation of the switching element (1), when a return signal is outputted from a light load detection circuit (32) before the counting of a counter circuit (14), the switching operation of the switching element (1) is restarted at the timing of a transformer reset signal from a transformer reset detection circuit (13) after the return signal is outputted. When the return signal is outputted from the light load detection circuit (32) after the counting of the counter circuit (14), the switching operation of the switching element (1) is restarted, regardless of the transformer reset signal, only when the return signal is outputted.

Abstract: An image of the shape of a semiconductor wafer is displayed on a display apparatus for displaying an inspection result of a semiconductor device, and a different color or pattern is displayed for each inspection result as display information indicating the inspection result of a semiconductor device in a region corresponding to the semiconductor device on the image of the semiconductor wafer.

Abstract: A strain sensor includes a metal plate, a first glass layer on the metal plate, a second glass layer provided on the first glass layer and having a color different from that of the first glass layer, an electrode on the second glass layer, a strain-sensitive resistor on the second glass layer, a circuit pattern on the second glass layer for connecting the electrode to the strain-sensitive resistor, and an overcoat glass layer for covering the strain-sensitive resistor and the circuit pattern. The strain sensor allows the layers to be identified while being manufactured, hence being controlled easily in its manufacturing processes.

Abstract: An information recording medium including a plurality of sectors of the present invention includes: a first spare area including a spare sector for replacing a defective sector among the plurality of sectors; a defect management information area for managing the replacement of the defective sector by the spare sector; and a volume space in which user data can be recorded. The volume space is configured so that a second spare area including a spare sector for replacing a defective sector among the plurality of sectors can be additionally allocated. Location information indicating a location of the second spare area is recorded in the defect management information area.

Abstract: A circuit board for surface mounting by solder flow an electronic component having narrow lead pitches, the board having a first solder leading land having a first side and located on the circuit board adjacent to a land for mounting an electronic component, and a second solder leading land located next to the first solder leading land and opposite the first side of the first solder leading land. A method for flow soldering a surface mounted electronic component on such a circuit board, wherein the second solder leading land is positioned at a rear end of the circuit board against a direction of a movement of the circuit board when the circuit board moves toward a solder flow.

Abstract: A pressure sensitive sensor provided in at least one of an opening section and an opening and closing section for opening and closing the opening section and serving to detect pinching of an object between the opening section and the opening and closing section based on an output signal generated by deformation upon receipt of external force, comprising pressure sensitive means 33 for generating an output signal corresponding to deformation and support means 35 for supporting the pressure sensitive means 33 on at least one of the opening section and the opening and closing section, the support means 35 including at least a first deformation section 37 having a first elastic modulus and serving to increase deformation of the pressure sensitive sensor 17, and a second deformation section 39 having a second elastic modulus which is higher than the first elastic modulus.

Abstract: A tape loading apparatus comprises a base, a tape guide post for guiding running of a tape, a carrier for carrying the tape guide post and conveying the tape for tape loading, a post engagement member provided on the base for fixing the position in the plane of an end portion of the tape guide post by being engaged with the end portion of the tape guide post, and an inclination adjusting portion for continuously and variably shifting the post engagement member in the plane to adjust the inclination of the tape guide post.

Abstract: A surface acoustic wave filter has a piezoelectric substrate; at least an input IDT electrod arranged on a piezoelectric substrate; and at least an output IDT electrod arranged on the piezoelectric substrate. A pitch of electrode fingers of the input IDT electrode and a pitch of electrode fingers of the output IDT electrode are different from each other.

Abstract: A novel structure comprising two substrates disposed closely each other, in which an organic molecular layer is formed on the surface of at least one substrate wherein the gap between the surface of the organic molecular layer on one substrate and the surface of the other substrate or the surface of the organic molecular layer on the other substrate is maintained to be usually less than 1000 &mgr;m, preferably less than 1 &mgr;m is provided. A motor, actuator, and vibration-absorbing table comprising such structure are also provided.

Abstract: Spiral tracks are formed on a recording surface of an information disk such as an optical disk, and data is recorded by interleaving technique as well as adding error correction information. A disk driver rotates the information disk at a specified speed. Plural tracks are read simultaneously by a reading device. Analog data of the plural lines are converted into digital data by an A/D converter, and stored in a frame data buffer memory by each line. The data are respectively decoded sequentially in a decoder. When the disk makes one rotation, the data of next track is read in duplicate as much as the portion of the interleaving length of the tail data of each one of the plural tracks being read on the information disk. By data aligning means, according to a command from a controller, the data—corresponding to the number of tracks that can be read simultaneously—being output in parallel from the decoder are aligned sequentially from the head data on the information disk.

Abstract: A method of design for testability using scan FF identification of this invention eases generation of test sequences as compared with conventional technique. An FF relation graph is generated from an integrated circuit, FFs having self loops are recognized in the FF relation graph, and all FFs are replaced with scan FFs. FFs not having self loops are sorted in accordance with a predetermined evaluation function indicating the degree of relation with difficulty in generating test sequences. For example, a function indicating the degree of relation with a balanced reconvergence structure is used as the evaluation function. In a sort order thus obtained, with regard to each FF not having self loops, it is determined whether or not the integrated circuit has an n-fold line-up structure in assuming the FF is replaced with a non-scan FF, thereby identifying scan FFs.

Abstract: After an insulating film, serving as a gate insulating film, is formed on a semiconductor layer formed on a substrate, a target made of tungsten is sputtered in an ambient of a gas mixture of an argon gas and a nitrogen gas. In the sputtering process, a surface region of the insulating film serving as the gate insulating film is nitrided, while a crystal mixture film composed of a mixture of a tungsten crystal and a tungsten nitride crystal is deposited on the insulating film. The crystal mixture film serves to compose at least a part of a gate electrode.

Abstract: An A/D converter guarantees high conversion precision and reduces power consumption not only in a standby state but in any other states. Therefore, a subtraction circuit is added to the A/D converter obtain a difference between a reference voltage and an analog signal, and an analog signal stored as a reference voltage is used. The difference is converted only by an A/D conversion unit for converting lower bits, and an operation mode for stopping the operation of an idle conversion unit is designed, thereby to perform an analog-to-digital converting operation.

Abstract: A filter device includes a first section for receiving data of a desired cutoff frequency. A second section operates for deciding whether the desired cutoff frequency is in a predetermined low frequency band or a predetermined high frequency band. The predetermined low frequency band is lower in frequency than the predetermined high frequency band. A third section stores data of filter coefficients corresponding to different cutoff frequencies in the predetermined low frequency band. A fourth section stores data of precalculated basic coefficients corresponding to different cutoff frequencies in the predetermined high frequency band. The precalculated basic coefficients are equal to values resulting from a part of calculation to provide final filter coefficients. A fifth section operates for calculating final filter coefficients from precalculated basic coefficients through a coefficient expanding process.