Patents Assigned to Microchip Technology Incorporated
  • Patent number: 11913989
    Abstract: A burn-in board for burn-in testing of semiconductor devices includes a strip socket mounted to a PCB. The strip socket includes a socket base configured to receive a device strip including an array of semiconductor devices, and a socket lid including at least one heating block. The socket lid is movable moved between (a) an open position allowing the device strip to be mounted on the socket base and (b) a closed position in which the socket lid including the heating block(s) is closed down on the mounted device strip. The strip socket includes conductive contacts configured to contact individual semiconductor devices on the device strip to allow selective monitoring of individual semiconductor devices during a burn-in test process. The burn-in board may also include heating control circuitry to control the heating block(s) during the burn-in test process.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: February 27, 2024
    Assignee: Microchip Technology Incorporated
    Inventors: Joseph Rascon, Aaron Moreno, Alberto Aguilera
  • Patent number: 11914899
    Abstract: A system (e.g., NVMe controller) for managing access to a memory resource by multiple users may include memory storing function queue categorizations for function queues associated with each user, and circuitry to store and execute a multi-user arbitration algorithm that arbitrates access to the memory resource by the multiple users. The function queue categorizations assign a function category to each function queue associated with each user.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: February 27, 2024
    Assignee: Microchip Technology Incorporated
    Inventors: Kwok Kong, William Brent Wilson, Ihab Jaser, Donia Sebastian, Dan McLeran
  • Patent number: 11916582
    Abstract: Systems and methods of determining a noise-robust acquisition configuration for a sensor or communication system are disclosed. An exemplary method comprises a noise scan with: obtaining a sensor receive signal from the sensor system; determining a digital receive signal from the sensor receive signal by A/D conversion of the sensor receive signal at a predefined noise scan frequency; determining a plurality of decimated digital receive signals by integer decimation of the digital receive signal using two or more decimation rates that differ from each other, wherein each of the two or more decimation rates is associated with a respective candidate acquisition configuration; determining one or more noise measures for multiple of the candidate acquisition configurations using one or more of the plurality of decimated digital receive signals; and using the one or more noise measures, determining the acquisition configuration for operation of the sensor system from the candidate acquisition configurations.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: February 27, 2024
    Assignee: Microchip Technology Incorporated
    Inventor: Axel Heim
  • Patent number: 11906559
    Abstract: A method and apparatus for measuring an unknown impedance. The apparatus comprises a first input to receive a first signal generated by a first portion of a sensor circuit, the first portion comprising an unknown impedance and a first known resistance, the unknown impedance to vary based upon a phenomenon to be measured by the sensor circuit. The apparatus also comprises a second input to receive a second signal generated by a second portion of the sensor circuit, the second portion of the sensor circuit comprising a known impedance and a second known resistance. And the apparatus comprises control logic to, based on a difference in time at which each of the first input and the second input reach a reference voltage, determine a measurement of the sensor circuit.
    Type: Grant
    Filed: June 14, 2022
    Date of Patent: February 20, 2024
    Assignee: Microchip Technology Incorporated
    Inventors: Bogdan Bolocan, Ezana Haile, Pat Richards
  • Publication number: 20240053839
    Abstract: A system includes a base unit associated with an object, and a mobile unit carriable by a person. The base unit includes a base unit capacitive coupling element providing a base unit-human capacitive coupling between the base unit and the person, and the mobile unit includes a mobile unit capacitive coupling element providing a mobile unit-human capacitive coupling between the mobile unit and the person. The base unit-human capacitive coupling and mobile unit-human capacitive coupling enable a data transmission connection between the base unit and mobile unit that passes through the person's body. Base unit transmitter circuitry of the base unit transmits object related data via the data transmission connection passing through the person's body, mobile unit receiver circuitry of the mobile unit receives the object related data, and an output device of the mobile unit outputs human-perceptible signals based on the received object related data.
    Type: Application
    Filed: July 31, 2023
    Publication date: February 15, 2024
    Applicant: Microchip Technology Incorporated
    Inventor: Valentin Stoia
  • Patent number: 11902057
    Abstract: Decision feedback equalization (DFE) taps and related apparatuses and methods are disclosed. An apparatus includes a first electrically controllable switch, a second electrically controllable switch, and one or more delay elements. The first electrically controllable switch receives a history bit and selectively provides the history bit to gate terminals of first transistors of a DFE tap circuitry. The second electrically controllable switch receives a complementary history bit and selectively provides the complementary history bit to second gate terminals of second transistors of the DFE tap circuitry. The one or more delay elements provide one or more delayed data integration clock signals responsive to one or more data integration clock signals. A complementary delayed data integration clock signal controls switching of the first electrically controllable switch and the second electrically controllable switch.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: February 13, 2024
    Assignee: Microchip Technology Incorporated
    Inventor: Ravish Soni
  • Patent number: 11898887
    Abstract: An apparatus for inductive rotational-position sensing is disclosed. An apparatus may include an electrically conductive material defining a continuous path for electrical current to flow between a first and a second location. The continuous path may include a first path portion, defined as a generally clockwise path for the electrical current to flow around a geometric center of the continuous path, and a second path portion, defined as a generally counter-clockwise path for the electrical current to flow around the geometric center. The continuous path may also include a radial-direction-reversal region at which one of the first path portion or the second path portion changes from being defined as a generally outward path for the electrical current to flow away from the geometric center to being defined as a generally inward path for the electrical current to flow toward the geometric center. Related systems, devices, and methods are also disclosed.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: February 13, 2024
    Assignee: Microchip Technology Incorporated
    Inventors: Ganesh Shaga, Sudheer Puttapudi, Surendra Akkina
  • Patent number: 11893175
    Abstract: One or more examples of the present disclosure relate generally to systems and methods for canceling mutual capacitive effects in a capacitance measurement. Some examples relate to providing a driven shield during capacitance measurement. Some examples relate to providing such a driven shield using rail-to-rail voltage.
    Type: Grant
    Filed: September 13, 2022
    Date of Patent: February 6, 2024
    Assignee: Microchip Technology Incorporated
    Inventor: Anders Vinje
  • Publication number: 20240036625
    Abstract: An apparatus includes a power-over-Ethernet (POE) interface to be connected to a powered device (PD) over an Ethernet cable and a control circuit. The control circuit is to measure a voltage provided by the apparatus through the Ethernet cable, determine that the voltage has dropped by at least a given voltage change, based on a determination that the voltage has dropped by at least the given voltage change, determine whether or not a predetermined quantity of Maintain Power Signature (MPS) signals have been missed within a given time frame, and, based on a determination that the predetermined quantity of MPS signals has not been missed within the given time frame, determine that the PD is still connected to the apparatus.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 1, 2024
    Applicant: Microchip Technology Incorporated
    Inventors: Tamir Langer, Arkadiy Peker
  • Publication number: 20240037047
    Abstract: A peripheral device for matrix multiplication including a weight memory, an input memory, a multiplier, an accumulator, an output memory and a sequencer to generate signals to drive the input memory and the output memory and to generate an interrupt signal. The weight memory may be loaded with weights and biases for a matrix multiplication operation, and the multiplier and accumulator may implement the multiply and accumulator operations for a matrix multiplication operation. Data may be swapped between the input memory and output memory to reduce the memory required for matrix multiplication operations.
    Type: Application
    Filed: January 18, 2023
    Publication date: February 1, 2024
    Applicant: Microchip Technology Incorporated
    Inventor: Keith Curtis
  • Publication number: 20240039438
    Abstract: An apparatus and method for determining electrical characteristics has an acquisition circuit and a control circuit. The control circuit causes a first modulation circuit to issue a first set of modulated signals to a first source of alternating current energy, wherein the first set of modulated signals has a first deadtime and wherein a high side switch and a low side switch of the first modulation circuit are turned off. The control circuit further causes the acquisition circuit to acquire a first electrical characteristic of the first source of alternating current energy from the first source of alternating current energy during the first deadtime.
    Type: Application
    Filed: May 26, 2023
    Publication date: February 1, 2024
    Applicant: Microchip Technology Incorporated
    Inventors: Gheorghe Turcan, Grig Barbulescu
  • Patent number: 11887864
    Abstract: Flat no-leads integrated circuit (IC) packages are formed with solder wettable leadframe terminals. Dies are mounted on die attach pads, bonded to adjacent leadframe terminal structures, and encapsulated in a mold compound. A laser grooving process removes mold compound from a leadframe terminal groove extending along a row of leadframe terminal structures. A saw step cut along the leadframe terminal groove extends partially through the leadframe thickness to define a saw step cut groove. Exposed leadframe surfaces, including surfaces exposed by the saw step cut, are plated with a solder-enhancing material. A singulation cut is performed along the saw step cut groove to define leadframe terminals with end surfaces plated with the solder-enhancing material. The laser grooving process may improve the results of the saw step cut, and the saw step cut may remove mold compound not removed by the laser grooving process.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: January 30, 2024
    Assignee: Microchip Technology Incorporated
    Inventors: Wichai Kovitsophon, Rangsun Kitnarong, Ekgachai Kenganantanon, Pattarapon Poolsup, Watcharapong Nokde, Chanyuth Junjuewong
  • Publication number: 20240022257
    Abstract: A device including an input to receive a clock signal, a ramp start program register, a ramp start active register, a ramp stop program register, a ramp stop active register, a ramp slope program register, a ramp slope active register, an update controller, the update controller to update, based on a programmable condition, respectively, the ramp start active register contents, the ramp stop active register contents and the ramp slope active register contents, and a ramp controller to generate a ramp signal, the ramp signal to begin at the value reflective of the ramp start active register contents, the ramp signal to change value at each cycle of the clock signal based on the value reflective of the ramp slope active register contents, and the ramp signal to stop at the value reflective of the ramp stop active register contents.
    Type: Application
    Filed: January 11, 2023
    Publication date: January 18, 2024
    Applicant: Microchip Technology Incorporated
    Inventors: Andreas Reiter, Yong Yuenyongsgool, Stephen Bowling, John Day, Alex Dumais, Justin Oshea
  • Patent number: 11877244
    Abstract: A communication device for connection with a power source and a host device is provided. The communication device comprises a device controller and a converter circuit. The device controller is adapted for data communication with the host device and the converter circuit is configured to provide a virtual device ground at least to the device controller, so as to compensate a ground potential difference between the host device and the communication device.
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: January 16, 2024
    Assignee: Microchip Technology Incorporated
    Inventor: Stefan Weiers
  • Patent number: 11876616
    Abstract: Various examples relate to a wired local area network (WLAN) including a shared transmission medium. An apparatus includes a beacon counter and an operational mode controller. The beacon counter is operably coupled to a line of a shared transmission medium of a wired local area network. The beacon counter is to count beacon signals on the line and determine a beacon count over a predetermined time period, or a beacon rate of the beacon signals. The operational mode controller is to control the apparatus to take over operation as a master node of the wired local area network based, at least in part, on a maximum bus cycle length of bus cycles on the line and responsive to the beacon count or the beacon rate.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: January 16, 2024
    Assignee: Microchip Technology Incorporated
    Inventors: Michael Rentschler, Martin Miller, Thorben Link, Venkat Iyer
  • Publication number: 20240006982
    Abstract: An inductor-inductor-capacitor (LLC) power converter includes a current input interface to receive a current input indication. The current input indication includes a voltage to represent a current passing through of a primary side of the LLC power converter. The LLC power converter includes voltage input interface to receive a voltage input. The voltage input is to include a representative voltage to be provided from a secondary side of the LLC power converter. The LLC power converter includes a control circuit to generate pulsed-width modulation (PWM) control signals for the LLC power converter. The control circuit is to match an on-time period of a first leg and a second leg of the LLC power converter and based upon the current input indication and the voltage input.
    Type: Application
    Filed: June 30, 2023
    Publication date: January 4, 2024
    Applicant: Microchip Technology Incorporated
    Inventors: Alex Dumais, Andreas Reiter, Yong Yuenyongsgool, Stephen Bowling, Timothy Phoenix, Justin Oshea
  • Publication number: 20240006472
    Abstract: A multi-capacitor module includes a stacked metal-insulator-metal (MIM) structure including a cup-shaped first electrode, a cup-shaped first insulator formed over the cup-shaped first electrode, a cup-shaped second electrode formed over the cup-shaped first insulator, a cup-shaped second insulator formed over the cup-shaped second electrode, a third electrode formed over the cup-shaped second insulator. The stacked MIM structure also includes a first sidewall spacer located between the cup-shaped first electrode and the cup-shaped second electrode, and a second sidewall spacer located between the cup-shaped second electrode and the third electrode. The cup-shaped first electrode, the cup-shaped second electrode, and the cup-shaped first insulator define a first capacitor, and the cup-shaped second electrode, the third electrode, and the cup-shaped second insulator define a second capacitor.
    Type: Application
    Filed: August 4, 2022
    Publication date: January 4, 2024
    Applicant: Microchip Technology Incorporated
    Inventor: Yaojian Leng
  • Publication number: 20230420495
    Abstract: A multi-capacitor module includes a nested metal-insulator-metal (MIM) structure including a cup-shaped first electrode, a cup-shaped first insulator formed over the cup-shaped first electrode, a cup-shaped second electrode formed over the cup-shaped first insulator, a cup-shaped second insulator formed over the cup-shaped second electrode, and a third electrode formed over the cup-shaped second insulator. The cup-shaped first electrode, the cup-shaped second electrode, and the cup-shaped first insulator define a first capacitor, and the cup-shaped second electrode, the third electrode, and the cup-shaped second insulator define a second capacitor physically nested in the first capacitor.
    Type: Application
    Filed: July 27, 2022
    Publication date: December 28, 2023
    Applicant: Microchip Technology Incorporated
    Inventor: Yaojian Leng
  • Patent number: 11853096
    Abstract: A curvature compensated bandgap circuit that is capable of matching best-in-class two (2) parts-per-million performance without over-temperature trimming. This improves performance metrics for precision voltage reference products without requiring individual device tuning during production thereof. A core bandgap circuit comprises a main operational amplifier having a second order bowed voltage response over temperature. A ptat circuit is coupled to the core bandgap circuit to provide a sigmoidal third order shape for the bandgap voltage.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: December 26, 2023
    Assignee: Microchip Technology Incorporated
    Inventors: Michael Harris, Daniel Meacham
  • Publication number: 20230409793
    Abstract: An article of manufacture includes a medium with instructions that when read and executed by a processor, cause the processor to identify a code stream to be executed by a system-on-a-chip (SoC). The SoC is to include an open standard processor and hardware accelerators implemented in reprogrammable hardware. The processor is to, from the code stream, identify a first portion of the code stream to be executed as software by the open standard processor and a second portion to be executed in the accelerators, compile the first portion into a binary for execution by the open standard processor, and generate a hardware description for the second portion to be implemented by the hardware accelerators. The hardware description and the binary are to exchange data during execution of the code stream.
    Type: Application
    Filed: June 12, 2023
    Publication date: December 21, 2023
    Applicant: Microchip Technology Incorporated
    Inventors: Jongsok Choi, David Ma, Ruolong Lian