Abstract: A method and system for generating dynamic, interactive visual representations of information structures within a computer which enable humans to efficiently process vast amounts of information. The boundaries of the information system containing the information to be processed are established and a set of mathematical relationships is provided which indicates the degree of correlation between parameters of interest to a user and segments of information contained within the boundaries. A visual display is generated for the user which has a plurality of different iconic representations and visual features corresponding to the parameters defined by the mathematical relationships.

Abstract: A method and apparatus for dispensing a thin coating of a highly viscous encapsulant liquid on to the top surface of a semiconductor device having been inner lead bonded. The coating is dispensed with a controlled thickness and is substantially planar. A liquid encapsulant having optimum thermal, chemical and mechanical properties is selected for protecting the electrical device and which is suitably controlled in an automated liquid dispensed process. The process is directed to various parameters which are required for achieving the desired quality, reliability, and automatic processing capability.

Abstract: A method of reworking an electrical multilayer interconnect in which the electrical lines can be protected by an overcoat. The method includes removing a defective metallization layer from the top of an interconnect substrate, depositing an electrically conductive layer on the substrate, forming a base plating mask on the electrically conductive layer, plating a copper base into an opening in the base plating mask onto the electrically conductive layer, stripping the base plating mask, forming a pillar plating mask on top of the copper base, plating an electrically conductive metal pillar into an opening in the pillar plating mask onto the top of the copper base, stripping the plating mask, and stripping the electrically conductive layer below the stripped base plating mask. Additionally, a protective overcoat layer can be deposited on the exposed copper surfaces.

Abstract: A method is disclosed for laser bonding two highly reflective electrical members. The first electrical member is coated with a material that is well absorbent of laser energy at the laser beam wavelength, has a lower melting point than either the first or second electrical members, and has a low solubility in a solid alloy of the electrical members. The laser characteristics are selected so that as bonding occurs an alloy of the electrical members solidifies and a solidification front drives the molten coating and molten compounds containing the coating away from the bond interface towards the exterior periphery of the bond, and substantially all of the solidified bond interface consists of an alloy of the first and second members. The coating can also aid in wetting the bond interface. In one example a copper electrical member coated with tin is bonded to a gold electrical member using a pulsed YAG laser with a beam diameter of 0.002 inches, a wavelength of 1.

Abstract: A fluid heat exchanger for cooling an electronic component having a housing for receiving heat from the electronic component in which the housing has a fluid inlet and an outlet at opposite ends of the housing. The cross-sectional area of the housing for conveying fluid from the inlet to the outlet decreases from the inlet to the outlet thereby reducing pressure drop without sacrificing thermal performance. The cross-sectional area may be decreased by tilting a top of the housing relative to a bottom, or providing a plurality of fins separated by channels in which the cross-sectional area of the channels decreases from the inlet to the outlet.

Abstract: Bonding a plurality of TAB tape leads to electrical pads in and aligned with the surface of a die by covering the pads with a plurality of electrically conductive particles, aligning the electrical leads with the particles and the pads, and simultaneously bonding the particles to the pads and the electrical leads to the particles. Preferably the particles are solid spheres and may be applied in various ways such as covering the entire surface with the spheres, covering the pads with an adhesive material prior to the spheres, or covering the pads with a mixture of adhesive and spheres. The method is particularly well suited for flip chip bonding.

Abstract: A thermally conductive coiled spring laid on its side provides a compliant, high conductive, low force thermal path between a heat source and a heat sink. Each spring contact provides two parallel heat conduction paths via each coil in the spring. The spring can be canted to permit slidable contact with a surface. In one embodiment a plurality of copper springs arranged in parallel can provide a thermal path between an electronic component and a heat sink in close proximity. The springs may be permanently attached to at least one surface at the points of contact.

Abstract: A method of replacing a defective electronic component having a plurality of electrical leads bonded to electrical contacts on a support by cutting leads adjacent the bond site, rebonding the stubs to the contacts, replacing the defective component and bonding the leads of the replacement component to the electrical contacts. Preferably, the leads are cut simultaneously with the rebonding of the stubs. The leads may be bonded to the top of the stub or to the side of the stub. A bonding tool is provided for simultaneously cutting a lead and rebonding the resultant stub.

Abstract: Integrated circuit dies, while still in wafer form, are prepared for stacking without requiring packaging. Holes are made through a wafer having a plurality of integrated circuit dies and are placed between the dies and adjacent the die pads. A layer of insulating material is placed on the wafer and in the outer periphery of the holes. An electrically conductive connection is made between the top of each pad and the inside of the insulating material in an adjacent hole. The insulating layer and the electrically conductive layer can be further extended to the backside of the dies if desired. The dies are separated from each other and can be assembled in a stack and/or surface mounted to a substrate.

Abstract: A method is described for patterning electroless plated metal on a polymer substrate. A substrate is first coated with a polymer suitable for complexing noble metal compounds. The substrate is then complexed with a noble metal compound, such as containing palladium, selectively irradiated to form the desired conductor pattern, and then etched so that the desired pattern remains. The substrate is subsequently placed in an electroless plating bath to form a metal pattern. Alternatively, before applying the noble metal compound, a substrate immersed in a polymer solution suitable for complexing a noble metal compound can be selectively irradiated to selectively deposit polymer on the substrate, followed by applying a noble metal compound and an electroless plating bath.

Abstract: A low-voltage CMOS interconnection circuit utilizing high-Tc superconducting tunnel junctions and interconnects for a very high speed interchip communication at low temperatures (4-77K). An improved driver produces very small current transients and has good immunity to noise from input voltage fluctuations, cross talk and simultaneous switching of drivers. An improved receiver includes a common gate CMOS receiver having a biasing stage and at least one amplifier stage and has the advantage of a large amplification and is self biasing.

Abstract: A method of bonding a first plurality of electrical contacts to a second plurality of electrical contacts by aligning the first and second contacts, placing a diaphragm member against the first contacts and applying a differential pressure, such as a vacuum, to the diaphragm in a direction to pull the first contact toward the second contact. Thereafter, the first contacts are bonded to the second contacts with a laser. The diaphragm or a coating on the diaphragm can be a material that absorbs energy from the laser to transfer laser energy to the bond. The diaphragm may be a glass plate or a transparent membrane, may have a support bonded to the first contacts, and may include openings through which the contacts are bonded.

Abstract: A flexible liquid ribbon cooler for use with electronic components which includes a plurality of elongate thermo-conductive members, which are circular in cross-section, and which are positioned side by side. A bottom and a top layer of thermo-conductive material enclose the bottom and tops of the elongate members and form a plurality of liquid coolant passageways between the elongate members within the layers. The elongate members may be solid cylinders or tubes. A plurality of microcapillaries may be formed in the bottom layer to provide additional thermocoupling, adhesion, and detachability.

Abstract: A fluid heat exchanger for cooling an electronic component having a housing for receiving heat from the electronic component in which the housing has a fluid inlet and an outlet at opposite ends of the housing. The cross-sectional area of the housing for conveying fluid from the inlet to the outlet decreases from the inlet to the outlet thereby reducing pressure drop without sacrificing thermal performance. The cross-sectional area may be decreased by tilting a top of the housing relative to a bottom, or providing a plurality of fins separated by channels in which the cross-sectional area of the channels decreases from the inlet to the outlet.

Abstract: A method for promoting enhanced nondestructive reconstruction of holograms recorded in photorefractive media involves control of the polarization states of the reconstruction beam and the recording beams, control of the cummulative recording energy, and use of a relatively high external field applied across the media during recording which is subsequently reduced during reconstruction. The resulting reconstruction history characteristics are selectively tailored by adjusting the polarization and intensity of the reconstruction beam, the recording geometry, and the applied voltage during reconstruction and recording, and various other parameters. In general, the reconstruction efficiency starts at a relatively high level, initially reduces, and then subsequently grows above the starting value, and can be made substantially nondestructive over a typical reconstruction cycle, with erasure times exceeding forty-five minutes.

Abstract: A process and solution for selectively etching copper. The etching is effected by a nonaqueous solution of dimethyl sulfoxide and a halocarbon compound.

Abstract: The effects of random polarization of a laser beam is reduced by separating the polarized laser beam into first and second polarized components that are orthogonal to each other, and measuring the energy in each of the first and second components. The total energy in both of the first and second components are compared with a predetermined energy level. The energy output of the laser beam is controlled in response to the measured comparison.

Abstract: A method and apparatus for aligning two mating tools is provided by a plurality of alignment members extending upward from the surface of one mating tool so that the alignment members engage in slidable contact with alignment tracks formed in the edges of the second mating tool. The alignment members and tracks can be formed in the four corners of rectangular mating tools, and the alignment members can be cylindrical rods with dome shaped tops. The alignment is useful both for tooling set-up as well as tooling usage. The alignment means can be used on a punch and lead form anvil for forming the outer leads of an integrated circuit bonded to a TAB tape.

Abstract: A high performance fluid heat exchanger for cooling an electronic component which includes a housing having a base, a plurality of parallel fins in the housing, a center fed inlet connected to the housing opposite the base for supplying cooling fluid towards the base and toward the ends of the fins. A plate is positioned between the tops and bottoms of the fins and extends generally parallel to the base and extends towards but is spaced from the ends of the fins for providing a double cooling pass against the fins.

Abstract: A method and apparatus are described for the removal of solder mounted surface mount electronic components which includes the removal of old solder, broken leads, and the electronic component without damaging other devices on the substrate. A desoldering braid is shaped to cover each of the electronic component's outer lead bonds without contacting the component's base. The desoldering braid is heated and brought in contact with the bonds until the solder flows into the desoldering braid and any broken outer leads attach to the desoldering braid. Upon removal of the desoldering braid the electronic component can be lifted off the surface. The desoldered solder joints will contain a thin uniform coating of solder less than approximately 50 micro inches thick. This allows for removal and replacement of solder mounted electronic components with leads on center lines spaced less than 0.020 inches.