Abstract: Implementations described herein relate to resource allocation for a memory built-in self-test. A memory device may read one or more bits, associated with a memory built-in self-test, that are stored in a mode register of the memory device. The memory device may identify one or more memory resources of the memory device, based on reading the one or more bits, that are to be used for performing the memory built-in self-test. The one or more memory resources of the memory device may be addressable memory resources configured for performing standard memory operations of the memory device. The memory device may perform the memory built-in self-test for the memory device using the one or more memory resources of the memory device.

Abstract: Methods, systems, and apparatuses include receiving a write command including user data. The write command is directed to a portion of memory including a first and second block and a first and second user data portion are directed to the first and second block. Temporary parity data is generated using the first and second user data portions. The temporary parity data and the first and second user data portions are stored in a buffer. Portions of the first and second block are programmed with two programming passes. The first and second user data portions in the buffer are invalidated in response to a completion of the second programming pass of the portions of the first and second blocks. The temporary parity data is maintained in the buffer until a second programming pass of the first and second block.

Abstract: An apparatus includes a voltage regulator coupled with a first voltage source, which supplies core memory circuitry. A first transistor is coupled between an output of the voltage regulator and input/output (I/O) circuitry. A second transistor is coupled between a second voltage source and the I/O circuitry, the second voltage source to power a set of I/O buffers. Control logic coupled with gates of the first and second transistors is to perform operations including: causing the second transistor to be activated to permit current to flow from the second voltage source to the I/O circuitry; in response to detecting a current draw from the I/O circuitry that satisfies a first threshold criterion, causing the first transistor to be activated; and causing the second transistor to be deactivated over a time interval during which the I/O circuitry is powered by the first voltage source and the second voltage source.

Abstract: Methods, systems, and devices for in-memory associative processing for vectors are described. A device may perform a computational operation on a first set of contiguous bits of a first vector and a first set of contiguous bits of a second vector. The first sets of contiguous bits may be stored in a first plane of a memory die and the computational operation may be based on a truth table for the computational operation. The device may perform a second computational operation on a second set of contiguous bits of the first vector and a second set of contiguous bits of the second vector. The second sets of contiguous bits may be stored in a second plane of the memory die and the computational operation based on the truth table for the computational operation.

Abstract: Methods, systems, and devices for full multi-plane operation enablement are described. A flash controller can determine that a first plane of a set of planes of a memory die is an invalid plane. The flash controller can issue a single descriptor associated with a multi-plane operation for the set of planes of the memory die. The single descriptor can include a plurality of commands for the multi-plane operation in which the first command of the plurality of commands can be a duplicate of a second command of the plurality of commands based on the first plane being the invalid plane. In some cases, a negative-and (NAND) controller can receive the single descriptor associated with the multi-plane operation for the set of planes of a memory die. The NAND controller can issue a plurality of commands for the multi-plane operation based on receiving the single descriptor.

Abstract: Methods, systems, and devices for managing memory based on access duration are described. A memory device may include a first set of memory cells resilient against access durations of a first duration and a second set of memory cells resilient against access durations of a shorter duration. A command for accessing the memory device may be received. The command may be associated with an access duration. Whether to access, as part of executing the command, the first set of memory cells or the second set of memory cells may be determined based on the access duration. The first set of memory cells may be accessed, as part of executing the command, based on the access duration being greater than a threshold duration. Or the second set of memory cells may be accessed based on the access duration being less than or equal to the threshold duration.

Abstract: A memory device includes a page buffer with a cache register and data registers, a memory array with a set of sub-blocks of memory cells configured as single-level cell (SLC) memory, and control logic. The control logic performs operations including: causing a first page of SLC data to be stored in the cache register; causing the first page of the SLC data to be moved from the cache register to a first data register; causing a subsequent page of the SLC data to be stored in the cache register; causing the SLC data stored in the cache register and in the data registers to be concurrently programmed to the set of sub-blocks, where the first page is programmed to a first sub-block and the subsequent page is programmed to a subsequent sub-block; and causing a subset of the operations for programming the set of sub-blocks to be performed in parallel.

Abstract: A memory device includes a memory array comprising a plurality of wordlines and a regulator circuit selectively coupled to the plurality of wordlines, wherein the regulator circuit is configured to perform a detection routine to sample a load current from a selected wordline of the plurality of wordlines and generate a measured output voltage, wherein the measured output voltage modulates with respect to the load current. The memory device further includes a comparator circuit coupled to the regulator circuit, wherein the comparator circuit is configured to generate a comparison result based on a difference between the measured output voltage and a reference voltage and a local media controller coupled to the comparator circuit, wherein the local media controller is configured to identify a presence of a defect on the selected wordline in response to the comparison result satisfying a threshold condition.

Abstract: Systems, methods, and apparatus related to memory devices. In one approach, a vertical three-dimensional cross-point memory device uses digit line decoders that include, on the digit line side of memory cells, a current limiter and sensing circuit configured to control program current in either of positive or negative program polarities, as selected by a controller. Two current limiters are each used on the digit line side of each memory cell. A negative polarity current limiter is used for pull-up, and a positive polarity current limiter is used for pull-down. A negative polarity sensing circuit is used between the respective digit line decoder and a positive supply voltage. A positive polarity sensing circuit is used between the respective digit line decoder and a negative supply voltage. The current limiter and sensing circuit pair of the same polarity is coupled to each digit line decoder based on the selected program polarity.

Abstract: Bake temperatures for memory blocks can be determined as part of an operation to allocate memory blocks for us by a memory device. If a temperature of a particular memory block among the plurality of memory blocks meets or exceeds a threshold operational temperature corresponding to a memory device containing the plurality of memory blocks, the particular memory block can be allocated for receipt and/or storage of data.

Abstract: Secure communication in accessing a network is described herein. An example apparatus can include a memory and a processor coupled to the memory. The processor can be configured to receive an identity public key from the identity device. The identity public key can be received in response to providing, to the identity device, a request to modify content of the identity device. The processor can be further configured to encrypt data corresponding to subscriber information using the identity public key, provide (to the identity device) the encrypted data to store the subscriber information in the identity device, and access a network operated by a network operator via the data stored in the identity device.

Abstract: A memory device may include memory cells configured to establish multiple levels of charge distributions; and a memory controller configured to perform operations on the memory cells. The operations may include recording a bit count number for a highest level of charge distributions within a set of memory cells, recording a bit count number for a lowest level of charge distributions within the set of memory cells, counting bits for the highest level of charge distributions within the set of memory cells, counting bits in the lowest level of charge distributions within the set of memory cells, comparing the counted bits for the highest level to the recorded bit count number for the highest level, and comparing the counted bits for the lowest level to the recorded bit count number for the lowest level.

Abstract: The present disclosure includes apparatuses, methods, and systems for pre-decoder circuitry. An embodiment includes a memory array including a plurality of memory cells, decoder circuitry coupled to the memory array, wherein the decoder circuitry comprises a first n-type transistor having a first gate and a second n-type transistor having a second gate, and pre-decoder circuitry configured to provide a bias condition for the first gate and second gate to provide a selection signal to one of the plurality of memory cells, wherein the bias condition comprises: a positive voltage for the first gate and a negative voltage for the second gate for a positive configuration for the memory cells, and zero volts for the first gate and the negative voltage for the second gate for a negative configuration for the memory cells.

Abstract: Implementations described herein relate to various structures, integrated assemblies, and memory devices. In some implementations, an integrated assembly includes a pillar having an upper source/drain, a middle source/drain, a lower source/drain, an upper channel between the upper source/drain and the middle source/drain, and a lower channel between the middle source/drain and the lower source/drain. The integrated assembly includes a gate pair that includes a first gate and a second gate. The first gate is positioned on a first side of the pillar at a first height, and the second gate is positioned on a second side of the pillar, that is opposite the first side, at a second height that is different from the first height. The integrated assembly includes a capacitor that is electrically coupled with the upper source/drain. Some implementations include methods of forming the various structures, integrated assemblies, and memory devices.

Abstract: A memory device includes a memory array including a plurality of wordline groups, each wordline group of the plurality of wordline groups including a set of even wordlines and a set of odd wordlines, and control logic, operatively coupled with the memory array, to perform operations including identifying a set of failing wordline groups from the plurality of wordline groups, the set of failing wordline groups including at least one failing wordline group determined to have failed a first erase verify of an erase verify process, and causing a second erase verify of the erase verify process to be performed sequentially with respect to each failing wordline group of the set of failing wordline groups.

Abstract: Memory devices, systems including memory devices, and methods of operating memory devices are described, in which memory devices are configured to poison data based on an indication provided by a host device coupled with the memory devices. The indication may include which one or more bits to poison (invert) at which stages of performing write or read operations. In some embodiments, the memory device may invert one or more bits according to the indication and then correct one or more errors associated with inverting the one or more bit to verify its on-die ECC functionality. In some embodiments, the memory device may provide the host device with poisoned data including one or more bits inverted according to the indication such that the host device may test system-level ECC functionality using the poisoned data.

Abstract: A memory array comprises vertically-alternating tiers of insulative material and memory cells, with the memory cells individually comprising a transistor comprising first and second source/drain regions having a channel region there-between and a gate operatively proximate the channel region. At least a portion of the channel region is horizontally-oriented for horizontal current flow in the portion between the first and second source/drain regions. A capacitor of the memory cell comprises first and second electrodes having a capacitor insulator there-between. The first electrode is electrically coupled to the first source/drain region. A horizontal longitudinally-elongated sense line is in individual of the memory-cell tiers. Individual of the second source/drain regions of individual of the transistors that are in the same memory-cell tier are electrically coupled to the horizontal longitudinally-elongated sense line in that individual tier of memory cells.

Abstract: Methods, systems, and devices for techniques for retiring blocks of a memory system are described. In some examples, aspects of a memory system or memory device may be configured to determine an error for a block of memory cells. Upon determining the occurrence of the error, the memory system may identify one or more operating conditions associated with the block. For example, the memory system may determine a temperature of the block, a cycle count of the block, a quantity of times the block has experienced an error, a bit error rate of the block, and/or a quantity of available blocks in the associated system. Depending on whether a criteria associated with a respective operating condition is satisfied, the block may be enabled or retired.

Abstract: This disclosure relates generally to interfaces between memory modules and circuit boards. More specifically, this disclosure relates to interfaces for coupling a memory module to a circuit board such that the memory module is arranged in a plane that is substantially parallel with a plane of the circuit board. Various embodiments disclosed herein include interfaces, memory modules including interfaces or portions of interfaces, and/or circuit boards including interfaces and/or portions of interfaces. Associated devices and systems are also disclosed.

Abstract: A method of forming a microelectronic device comprises forming a stack structure comprising a vertically alternating sequence of insulative structures and additional insulative structures, at least some of the additional insulative structures comprising silicon nitride having a ratio of nitrogen atoms to silicon atoms greater than about 1.58:1.00, forming openings through the stack structure, and forming cell pillar structures within the openings, the cell pillar structures individually comprising a semiconductor channel material vertically extending through the stack structure. Related methods, microelectronic devices, memory devices, and electronic systems are also described.