Abstract: A structure for discharging an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for discharging an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and bottom. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUU mask is grounded.

Abstract: This invention provides a charged particle source, which comprises an emitter and means for generating a magnetic field distribution. The magnetic field distribution is minimum, about zero, or preferred zero at the tip of the emitter, and along the optical axis is maximum away from the tip immediately. In a preferred embodiment, the magnetic field distribution is provided by dual magnetic lens which provides an anti-symmetric magnetic field at the tip, such that magnetic field at the tip is zero.

Abstract: The present invention provides apparatuses to inspect small particles on the surface of a sample such as wafer and mask. The apparatuses provide both high detection efficiency and high throughput by forming Dark-field BSE images. The apparatuses can additionally inspect physical and electrical defects on the sample surface by form SE images and Bright-field BSE images simultaneously. The apparatuses can be designed to do single-beam or even multiple single-beam inspection for achieving a high throughput.

Abstract: Briefly, in accordance with one or more embodiments, a MEMS scanned beam projector includes a light source to emit a light beam, a scanning platform to redirect the light beam impinging on the platform, and a display controller to control the light source and the scanning platform to cause the scanning platform to scan the light beam in a vertical direction and a horizontal direction in a scan pattern to project an image onto a projection surface. The display controller is configured to correct for image distortion in the projected image by providing a compensated drive signal to the scanning platform to compensate for the image distortion.

Abstract: The device includes a beam source for generating an electron beam, a beam guiding tube passed through an objective lens, an objective lens for generating a magnetic field in the vicinity of the specimen to focus the particles of the particle beam on the specimen, a control electrode having a potential for providing a retarding field to the particle beam near the specimen to reduce the energy of the particle beam when the beam collides with the specimen, a deflection system including a plurality of deflection units situated along the optical axis for deflecting the particle beam to allow scanning on the specimen with large area, at least one of the deflection units located in the retarding field of the beam, the remainder of the deflection units located within the central bore of the objective lens, and a detection unit to capture secondary electron (SE) and backscattered electrons (BSE).

Abstract: Devices and methods are described herein that use a first solid figure element, a polarizing beam splitter, and a second solid figure element to reduce speckle in projected images. Specifically, laser light is generated and split into two portions having orthogonal polarizations. The first portion of laser light is internally reflected off at least three internal faces of the second solid figure element and is then spatially recombined with the second portion of laser light in the first solid figure element. The difference in path length followed by the two portions generates a temporal incoherence in the recombined laser light beam, and that temporal incoherence reduces speckle in the projected image.

Abstract: A wafer grounding apparatus and method adaptable to a charged particle beam apparatus is disclosed. A wafer substrate is supported by a wafer mount. A pulse current pin is arranged to be in contact with a backside film formed on a backside of the wafer substrate. A grounding pulse generator provides at least one pulse to drive the pulse current pin such that dielectric breakdown occurring at the backside film leads to establishment of a current path through the backside films. Accordingly, a current flows in the wafer substrate through this current path and then flows out of the wafer substrate via at least one current return path formed from capacitive coupling between the wafer substrate and the wafer mount.

Abstract: An inspection method includes the following steps: identifying a plurality of patterns within an image; and comparing the plurality of patterns with each other for measurement values thereof. The above-mentioned inspection method uses the pattern within the image as a basis for comparison; therefore, measurement values of the plurality of pixels constructing the pattern can be processed with statistical methods and then compared, and the false rate caused by variation of a few pixels is decreased significantly. An inspection system implementing the above-mentioned method is also disclosed.

Abstract: A calibration method for calibrating the position error in the point of interest induced from the stage of the defect inspection tool is achieved by controlling the deflectors directly. The position error in the point of interest is obtained from the design layout database.

Abstract: The embodiments described herein provide microelectromechanical system (MEMS) scanners with increased resistance to distortion in the mirror surface. Such MEMS scanners, when incorporated into laser scanning devices, are used to reflect laser light into a pattern of scan lines. Thus, by reducing distortion in the scanning surface these MEMS scanners can provide improved performance in scanning laser devices, including scanning laser projectors and laser depth scanners. In general, this is accomplished by providing a MEMS scanner where the connection to the scan plate is made at an intermediate support structure, and at a point on that intermediate support structure that is offset from the scanning surface. Providing the connection to the scan plate at points offset from the scanning surface can reduce the distortion that occurs in the scanning surface as a result of rotational forces in the MEMS scanner.

Abstract: Devices and methods are described that provide for scanning surfaces and generating 3-dimensional point clouds that describe the depth of the measured surface at each point. In general, the devices and methods utilize scanning mirror(s) that reflect a laser beam into a pattern of scan lines. When the raster pattern of scan lines is directed at a surface, reflections of the laser beam from the surface are received and used to the generate 3-dimensional point clouds that describe the measured surface depth at each point. The motion of the scanning mirror(s) can be dynamically adjusted to modify the characteristics of the resulting 3-dimensional point cloud of the surface. For example, the adjustment of the scanning mirror motion can modify the resolution or data density of the resulting 3-dimensional point cloud that describes the measured depths of the surface.

Abstract: A multi-beam apparatus for observing a sample with high resolution and high throughput and in flexibly varying observing conditions is proposed. The apparatus uses a movable collimating lens to flexibly vary the currents of the plural probe spots without influencing the intervals thereof, a new source-conversion unit to form the plural images of the single electron source and compensate off-axis aberrations of the plural probe spots with respect to observing conditions, and a pre-beamlet-forming means to reduce the strong Coulomb effect due to the primary-electron beam.

Abstract: A scanning display system includes hybrid data acquisition. Data can be acquired in a time-of-flight mode, or in a non-time-of-flight mode. Infrared light pulses may be used in both modes. The infrared light pulses may have different characteristics. Time-of-flight data acquisition and non-time-of-flight data acquisition may be used sequentially or simultaneously.

Abstract: A structure for grounding an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for grounding an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and back side. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUV mask is grounded. The reflective surface of the EUV mask on a continuously moving stage is scanned by using the electron beam simultaneously. The moving direction of the stage is perpendicular to the scanning direction of the electron beam.

Abstract: This invention provides a charged particle source, which comprises an emitter and means of generating a magnetic field distribution. The magnetic field distribution is minimum, about zero, or preferred zero at the tip of the emitter, and along the optical axis is maximum away from the tip immediately. In a preferred embodiment, the magnetic field distribution is provided by dual magnetic lens which provides an anti-symmetric magnetic field at the tip, such that magnetic field at the tip is zero.

Abstract: This invention provides a charged particle source, which comprises an emitter and means of generating a magnetic field distribution. The magnetic field distribution is minimum, about zero, or preferred zero at the tip of the emitter, and along the optical axis is maximum away from the tip immediately. In a preferred embodiment, the magnetic field distribution is provided by dual magnetic lens which provides an anti-symmetric magnetic field at the tip, such that magnetic field at the tip is zero.

Abstract: Devices and methods are described herein to measure optical power in scanning laser projectors. In general, the devices and methods utilize a filter component and photodiode to measure optical power being generated by at least one laser light source, with the filter component configured to at least partially compensate for the non-uniform electric current response of the photodiode. Such a configuration facilitates accurate optical power measurement using only one photodiode, and thus can facilitate accurate optical power measurement in a relatively compact device and with relatively low cost.

Abstract: Method and machine utilizes the real-time recipe to perform weak point inspection on a series of wafers during the fabrication of integrated circuits. Each real-time recipe essentially corresponds to a practical fabrication history of a wafer to be examined and/or the examination results of at least one examined wafer of same “lot”. Therefore, different wafers can be examined by using different recipes where each recipe corresponds to a specific condition of a wafer to be examined, even these wafers are received by a machine for examining at the same time.

Abstract: Devices and methods are described that provide for scanning surfaces and generating 3-dimensional point clouds that describe the depth of the measured surface at each point. In general, the devices and methods utilize scanning mirror(s) that reflect a laser beam into a pattern of scan lines. When the raster pattern of scan lines is directed at a surface, reflections of the laser beam from the surface are received and used to the generate 3-dimensional point clouds that describe the measured surface depth at each point. The motion of the scanning mirror(s) can be dynamically adjusted to modify the characteristics of the resulting 3-dimensional point cloud of the surface. For example, the adjustment of the scanning mirror motion can modify the resolution or data density of the resulting 3-dimensional point cloud that describes the measured depths of the surface.

Abstract: Scanning platforms for use in scanning laser devices are described herein. These scanning platforms are particularly applicable to scanning laser devices that use microelectromechanical system (MEMS) structures to facilitate mirror motion. The scanning platforms include a centrally located stationary mount portion and a movable portion that surrounds the stationary portion. The movable portion is configured to be coupled to a mirror and to facilitate motion of that mirror. Such a scanning platform can facilitate reduced size in scanning mirror assembly, and thus can facilitate a more compact scanning laser device.