Abstract: There is disclosed a carrier module capable of accurately fixing IC device when the producted IC device is tested on the performance thereof. The carrier module includes a body having an insertion groove formed therein in a predetermined direction and holes, an elastic unit inserted and fixed to the insertion groove, for being elastically moved upward and downward, a latch installed on upper portion of the elastic means, for fixing an IC device, and a pin for fixing the latch by being inserted and fixed into the body, wherein the IC device is fixed or released by operation of the latch. The carrier module has a structure permitting the latches to be pressed at both sides thereof, and therefore the present invention provides an easy machining and assembling of the carrier module, and lowers the production cost by reducing the number of parts.

Abstract: A contact light emitting device embodying the invention includes a transparent electrode layer and a luminescence layer. The electrode layer and the luminescence layer are configured such that an electric field can be generated between the electrode layer and an object to be imaged. When the object to be imaged is brought adjacent the luminescence layer, the luminescence layer emits light, which is then converted into an electrical signal.

Abstract: A planar motor moved in the X-Y direction on a plane includes a mover having an armature coil part installed at the bottom of an armature frame, for receiving an electric signal, and a stator with a first permanent magnet part installed having S-pole permanent magnets and N-pole permanent magnets arranged in a manner that a corner of the N-pole permanent magnets contacts four corners of the S-pole permanent magnets on the surface of a stator frame installed facing the armature coil part of the mover, and inserted permanent magnets arranged at spaces formed as the corners of the S-pole permanent magnets contact the corners of N-pole permanent magnets. Since the inserted permanent magnets are arranged at the first or the second permanent magnet part, the packing density of the permanent magnets can be increased, and accordingly, as the leakage flux is reduced, more stronger thrust can be attained.

Abstract: An apparatus for controlling cooling of a linear motor includes: a stator having a first temperature sensor, a heat sink and at least one cooling fan installed at a predetermined portion thereof; a mover having a second temperature sensor and a heat sink installed at the upper surface thereof; an encoder for sensing a position of the mover and generating a position signal; an A/D converter for receiving and converting signals from the first and the second temperature sensors and outputting a first and a second temperature sensing signals; a controller for generating a plurality of cooling fan control signals and an air valve control signal to cool the heat generated from the stator and the mover; a D/A converter for converting the plurality of cooling fan control signals and the air valve control signal and transmitting a plurality of drive signals to the plurality of cooling fans and to the air valve; and a mover driver for providing a drive signal to a coil block.

Abstract: The present invention relates to a loading/unloading control apparatus of a semiconductor device and a control method thereof in which a time for loading/unloading a semiconductor device can be saved when a produced semiconductor device is loaded and unloaded to be tested. The present invention provides a loading/unloading control method of a semiconductor device including the steps of: determining whether a semiconductor device for being sorted to an unloading buffer exists by a microprocessor; determining whether a sorting tray has been prepared when the semiconductor device exists to be sorted to the unloading buffer; requiring the sorting tray to be replaced by the microprocessor when the sorting tray has not been prepared; and feeding the semiconductor device served at the unloading buffer to the sorting buffer by a X-Y axis picker during the replacing of sorting tray.

Abstract: The present invention relates to a linear motor with an improved cooling structure for cooling heat generated from a coil block of the motor. The linear motor includes a stator element having a stator element frame, a movable element having a movable element frame, adapted to linearly move along the stator, and a heat dissipation plate mounted on the stator element frame and the movable element frame, for externally dissipating heat generated from a coil block. Such a structure can prevent over-heating of the linear motor by dissipating heat generated from the motor coil to thereby cool the motor.

Abstract: There is disclosed a system for preventing malfunction of a switching circuit for a linear motor capable of preventing malfunction of the switching circuit due to magnet flux from the permanent magnet mounted on the movable element, the system including sensing magnets provided at a longitudinal one side of a movable element having a plurality of permanent magnets mounted thereon, a plurality of Hall sensors mounted on the stator element and used for controlling current flow into a plurality of armature coils by turning on/off a switching circuit, based upon the sensing of magnet flux generated from the sensing magnets, and dummy sensing magnet provided at one side end of the sensing magnet in such a manner that its polarity is opposite to that of the sensing magnet, and for preventing magnets flux generated from the plural permanent magnets from introducing into the plural Hall sensors.

Abstract: Device for loading/unloading a modular IC (1) to/from a socket in a modular IC handler which facilitates an automatic, quick, and accurate loading/unloading of a modular IC to be tested to/from a socket, including a base plate, sliders (12) mounted at opposite sides of the base plate for moving in forward or backward directions, at least one socket base (16) between the sliders, a socket (17) fixed to each of the socket bases for inserting a modular IC thereto, a pusher (25) each fitted to the slider to move in up and down directions for inserting the modular IC transported thereto by a known pick up means (20) into the socket, and a take out means (31,32,33) for removing the modular IC inserted in the socket.

Abstract: Modular IC holding device in a modular IC handler, is disclosed, for holding a modular IC when loading or unloading the modular IC, including a lifting block having both ends and a central isolation wall and adapted to move for a certain stroke in up and down directions, a guide bar coupled to the lifting block in a horizontal direction, one pair of horizontal movement cylinders each in one of the ends of the lifting block unitary therewith, one pair of sliders coupled to the guide bar for horizontal movement in opposite directions to each other according to operation of the cylinders, one pair of fingers respectively coupled to the one pair of sliders, and a sensor provided to the lifting block for sensing presence of the modular IC.

Abstract: Device for adjusting a space between chips in a semiconductor chip tester, is disclosed, including a carrier plate mounted movable along a horizontal guide rail, a mounting plate fixed to the carrier plate, an elevating plate mounted on the mounting plate movable in up and down direction by a vertical LM (linear motion) guider, a cam shaft rotatably mounted on the elevating plate, the cam shaft having a plurality of cam grooves formed in a radial direction in an outer circumferential surface, a driving mechanism for rotating the cam shaft, and a plurality of pick-up members each fitted movable in a horizontal direction by a horizontal LM guider in a state a top of each of the pick-up members is inserted in one of the cam grooves.

Abstract: A metallic tray unit for testing a semiconductor device is disclosed including: a unit body on the bottom having a cavity in which a semiconductor device for testing is placed; and fixing equipment for holding the semiconductor device in the cavity when the semiconductor device is moved to the lower part of the unit body. The unit body has rectangular openings, one of which is opened in the direction of the upper part of the cavity and another which is opened toward the cavity. The fixing equipment includes plate springs that are installed on side walls of the openings in parallel thereto. The plate springs are opened as the device is inserted into the cavity, and then are returned to their former condition after insertion of the device thereto, whereby their ends exposed to the cavity catch the device.

Abstract: A device loading/unloading apparatus for a device handler is disclosed including a customer tray containing a finished device; a test tray having a plurality of carrier modules, the carrier modules forming a space on its bottom so that the device's bottom is mounted to be exposed downward, the carrier modules having a stop member for supporting the device not to fall freely from the space; bottom loading assembly for picking up the device of the customer tray, moving it under the test tray, and loading it to a bottom space of the carrier module; and stop member spreading assembly installed above the test tray to be conveyable in the same direction as the bottom loading assembly and then spreading the stop member by a predetermined interval when the bottom loading assembly loads/unloads the device on/from the space of the carrier module.