Abstract: A surface mounting device comprising: multiple transfers being moved in the X and Y axis directions by an X-Y gantry installed on a base frame and supplying a printed circuit board(PCB) for mounting parts or loading the discharged PCB by a head unit for sucking parts supplied from a parts supply unit and mounting the sucked parts on the PCB and multiple conveyers installed to be moved horizontally in a predetermined direction at a predetermined position on the base frame for carrying the PCB supplied from the multiple transfers to a parts mounting work position and discharging the same to the multiple transfers when the mounting of the parts is finished.

Abstract: A feeder for a surface mounting device includes: a main frame; a parts feeding unit including a forward/backward rotation force generating unit for carrying a tape by forwardly/backwardly rotating a circular permanent magnetic unit by a mutual magnetic force with armature coils, a driving gear for receiving the forward/backward rotation force and simultaneously carrying the tape at a constant distance and a position sensing unit for sensing the position of the permanent magnetic unit; a vinyl separation unit being for carrying the vinyl removed from the tape by the forward rotating force or re-carrying the vinyl by the backward rotating force; and a vinyl recovery unit for recovering the vinyl by winding the same by the forward rotating force unit or discharging the vinyl.

Abstract: The surface mounting device includes: multiple conveyers installed at a predetermined position of a base frame and carrying a printed circuit board(PCB) to a parts mounting work position or discharging the PCB on which parts have been mounted, so that they can be moved in the X and Y-axis directions by a X-Y gantry installed on the base frame and can absorb parts supplied from a parts supply unit and the parts can be mounted by a head unit mounting the adsorbed parts on the PCB; and multiple multi-layer transfer units each installed at both ends of the conveyers and carrying the PCB to the PCB conveyers or loading the discharged PCB. The transfer speed of PCB is improved.

Abstract: The surface mounting method includes: transferring the PCB to one conveyer among multiple conveyers capable of moving from a first transfer; transferring the PCB to another conveyer; transferring the PCB to one conveyer, while electronic parts from a parts feeder are mounted onto the transferred PCB; mounting the electronic parts from the parts feeder again onto the transferred PCB, while the PCB onto which the parts have been mounted is transferred to the second transfer; and transferring the PCB onto which the parts have been mounted again to the second transfer, while a new PCB is transferred to one conveyer of the conveyers from the first transfer.

Abstract: A fingerprint recognizing device having patterned floating electrodes is disclosed. The fingerprint recognizing device includes a transparent electrode layer to which one terminal of an AC power source is connected; a light emitting layer for forming an electric field between the transparent electrode layer and a finger forming a ground contact when being contacted with the finger and emitting light by this electric filed for generating an optical fingerprint image according to ridge lines of a fingerprint image; a plurality of patterned floating electrodes arranged on the light emitting layer at a predetermined interval and turned on/off to output the optical fingerprint image; and a transparent insulating layer for transmitting the optical image generated from the light emitting layer.

Abstract: A picker for a module IC handler includes a plurality of grippers. Each gripper includes first and second jaws, and one or more cylinders or other actuators for driving the first and second jaws. Each gripper also includes a damping device that damps movements of the jaws to reduce an impact that can occur as the jaws grip a module IC. The grippers may also include one or more sensors for sensing when the jaws have grasped a module IC, or for sensing the position of the gripper relative to the module IC.

Abstract: A position control apparatus of a feeder stage is disclosed, at which a tape reel for feeding parts to be mounted on a PCB is mounted in a surface mount device(SMD). The position control apparatus includes a feeder stage disposed inside a base frame of a SMD, a height/rotation power transmission device for controlling a height (Z) and a rotation angle (&thgr;) of the feeder stage, a first power transmission device for controlling the X-axis position of the feeder stage, and a second power transmission device for controlling the Y-axis position of the feeder stage. Therefore, the apparatus can be easily controlled the mounting position of the tape reel by controlling the position of the feeder stage at which the tape reel is mounted in the SMD.

Abstract: A nozzle apparatus of a surface mounting device is disclosed. The nozzle apparatus includes a socket portion in which a connection block is fixedly installed by an assembly block formed on the bottom of a hollow shaft, socket shafts are installed at both sides of the connection block and both ends of the socket shaft are connected by a plurality of elastic members, and a nozzle portion inserted into the socket portion and slidably mounted to the inside of the socket portion in a state of contacting with the socket shaft. The nozzle portion can be stably replaced with another to be mounted on the socket portion regardless of a repetitive error and an overshoot.

Abstract: An apparatus for controlling cooling of a gantry having a linear motor includes: a stator provided with a first temperature sensor, having a heat sink and a cooling fan at predetermined portions of an X-axis and an Y-axis linear motors; a mover provided with a second temperature sensor, having a heat sink installed on the upper surface of an X-axis and a Y-axis linear motors; an encoder for sensing a position and velocity of the mover; an encoder periphery sensor part for measuring surroundings (a temperature, a humidity and a pressure) of the encoder; an A/D converter for receiving a first and a second temperature signals and converting them from an analog signal to a digital signal and outputting the same; a controller for controlling a drive signal outputted from a mover driver unit to control the velocity of the Y-axis linear motor and the X-axis linear motor; a D/V converter for converting digital signals, that is, a cooling fan control signal and an air valve control signal to a plurality of drive signa

Abstract: A linear motor having an air bearing integrally is disclosed. The linear motor includes a “U” shaped frame having permanent magnets spaced from each other on its inner walls, an inverted “U” shaped frame spaced from outer walls of the “U” shaped frame at interval, having an extension frame for protecting the “U” shaped frame and having air injection openings for injecting air into both ends of a center frame, and an armature coil portion installed on the bottom surface of center frame and spaced from the permanent magnets at interval. Accordingly, a step difference between heights generated when the air bearing and the linear motor are installed, can be removed, and the linear motor can be cooled using the air applied to the air bearing.

Abstract: A device test handler and a method for operating the same provide a significant reduction of the picking up and placing time periods, and reduce possible damage to the devices being tested. Devices and methods embodying the invention facilitate room temperature and high temperature testing within one device test handler to maximize testing efficiency. A test handler embodying the invention may include a pre-heater for pre-heating the devices on a loading shuttle as the loading shuttle passes to a test chamber. An indexing device in a test chamber of the device is used for successively transferring the devices from a loading shuttle to the test socket, and tested devices from the test socket to an unloading shuttle. Heat supply means may be provided for supplying a high temperature heat to the test chamber when the devices are required to be tested in a hot state.

Abstract: The present invention relates to an apparatus for automatic loading of a sleeve on a device testing apparatus, for automatic lining up and loading of a sleeve having a device held therein on a device testing apparatus for carrying out device test, including a sloped loading plate for putting sleeves each having devices held therein thereon, vertical fixation plates at both sides of the sloped loading plate, carrier means fitted so as to be in contact with a lower edge of the sloped loading plate, for holding the sleeves put on, and slid down to the lower edge of, the sloped loading part, and transporting to a loading part in the device testing apparatus one by one in succession, driver means fitted to the fixation plate for driving the carrier means, and return means for, when a plurality of sleeves on the sloped loading plate are loaded on, and transported by the step, returning the sleeves back to the sloped loading plate again, leaving only one of the sleeves.

Abstract: A parts suction apparatus of a module head in a surface mount device is disclosed. The parts suction apparatus includes: a socket having a first through hole in an inner direction and a fixing member inside the first through hole, one end of the inside of the first through hole being mounted to a hollow shaft by using the fixing member, a nozzle having a second through hole for forming an air passage when sucking parts in the inner direction, a coupling member having a third through hole in the inner direction and plate spring members installed inside the third through hole for supporting the nozzle and for alleviating impact when the nozzle sucks parts, and a holder for fixing the nozzle so that it is not removed from the coupling member.

Abstract: A method for manufacturing a fingerprint recognition sensor includes the steps of: providing a CMOS image sensor; depositing a transparent electrode layer as a thin film on the upper portion of the CMOS image sensor, to which a terminal of an AC power source is connected, the transparent electrode layer being made of a transparent insulating material and a transparent conductive material; forming a luminescent layer at the upper portion of the transparent electrode layer to generate a light image; forming a dielectric layer at the upper portion of the luminescent layer; and forming a contamination-resistance film at the upper portion of the dielectric layer. With this method, since the CMOS image sensor is utilized, circuit construction can be simplified. In addition, a fingerprint image having a good contrast can be obtained.

Abstract: An apparatus for adjusting a pitch of a picker using a single actuator is provided. The apparatus includes a picker base, a plurality of pickers adapted for varying the pitch of the pickers by use of a linear guide device provided at one side of the picker base. The apparatus includes an actuator for driving the plurality of pickers, and a bevel gear unit coupled to the actuator by upper and lower racks for transmitting the driving force to the plurality of pickers.

Abstract: A gripper for the picking apparatus of a module IC handler including a gripper body, first to third supports vertically formed at a lower part of the gripper body, a cylinder for driving a jaw located between first and second supports and second and third supports, a pair of jaws movably connected at a lower part of the cylinder, for picking the module IC, a damping mechanism for reducing an impact occurred upon picking the module IC by the jaw, and a module IC sensor for sensing the module IC upon moving the jaw. The present invention reduces damage of the module ICs with the damping mechanism upon picking the module ICs. Also, the gripper easily and exactly grips the module ICs, thus accomplishing the working performance.

Abstract: The present invention relates to a printed circuit board(PCB) flat level compensating unit of a surface mounting apparatus in which when a PCB is stopped at its working position and is firstly pushed up from the lower portion thereof, the PCB is secondly pushed to be raised thereby to be compensated its flat level and the mounting height for the PCB according the thickness is adjusted thereby to be increased a mounting efficient and a precision.

Abstract: The contact imaging system allows the contact area of an object impressed upon the surface of the contact imaging system to emit light in a pattern corresponding to the contact area making it possible to render an image of the contact area. The contact imaging system has a luminescence layer on top of a transparent electrode. When the object to be imaged contacts the luminescence layer and is held at ground potential relative to the transparent electrode, an electric field is created in the luminescence layer in a pattern corresponding to the contact pattern. The electric field causes the luminescence layer to emit a light image of the contact pattern. The luminescence layer and the transparent electrode are adjacent to a light sensing layer. The light sensing layer receives the light generated at the luminescence layer, and converts that light into a corresponding electric signal.

Abstract: A nozzle exchanging or mounting apparatus is provided for use in exchanging nozzles utilized for vacuum sucking a semiconductor device and various electric components in a surface mounting apparatus. The nozzle exchanging or mounting apparatus includes a nozzle installation body having a nozzle installation portion in which a plurality of nozzles can be disposed at a predetermined interval therebetween, a locking unit, the locking unit being longitudinally inserted into and installed at one side of the nozzle installation body, a bracket for inserting one side of the locking unit thereinto to fix the locking unit in place, and a driving unit for selectively moving the locking unit backward and forward. The apparatus provides the advantage that the time taken to exchange nozzle(s) can be reduced due to the stable and prompt exchange of the nozzle(s).

Abstract: A gripper for a surface mounting apparatus is provided. The gripper includes a gripper holder having an air through hole formed in a central portion of the gripper holder, a gripper adapter positioned below the gripper holder to which one end of a tension spring is fixed, a gripper piston rod provided inside the gripper holder and configured to be upwardly and downwardly moved by air supplied through the air through hole, a pair of jaws provided inside the gripper adapter, the jaws being movably disposed with respect to each other, the other end of the tension spring being fixed to the pair of jaws, a gripper tooth adapter fixed at an upper portion of the jaws by way of a fixing device, a gripper tooth assembly attached to an upper portion of the gripper tooth adapter, the gripper tooth assembly being configured to hold an electronic component, a shaft provided between the pair of jaws and fixed to the gripper piston rod, and a roller coupled to the shaft.