Abstract: The present invention relates to a rotation sensing device of a fan apparatus adapted to a chamber in a handler which can sense whether the fan apparatus is rotated or not by using a sensor dog and an optical sensor. The rotation sensing device includes: a sensor dog being installed at the outer circumferential surface of a shaft installed inside a case and being configured to be spread a predetermined length larger than the diameter of the stop state when a centrifugal force is generated by the rotation of the shaft; an optical sensor receiving light reflected from the surface of the sensor dog and producing a sensing signal of the light if the sensor dog is spread the predetermined length by scanning the light to the sensor dog; and a main controller judging that the fan apparatus is rotated upon receipt of the sensing signal of the light from the optical sensor.

Abstract: Disclosed is a device picker in a handler. The present invention picks up to transport at least four devices backward or forward simultaneously as well as maintains a simple structure of the device picker, thereby enabling to improve test efficiency.

Abstract: A surface mounting device having a coplanarity inspection system is disclosed. The surface mounting device includes: a vision apparatus including a camera for picking an electronic component from a head and inspecting a position and an alignment state of the electronic components; a laser sensor including a light receiving part and a light emitting part for inspecting the coplanarity of the electronic components; a controller for controlling data obtained by the laser sensor; and a computer for computing the coplanarity by receiving the data outputted from the controller.

Abstract: The present invention discloses an apparatus for transferring a printed circuit board in which printed circuit boards having various sizes can be transferred by using one transfer apparatus.

Abstract: The present invention discloses a back-up plate up/down apparatus in which a back-up plate is ascended or descended without rocking, maint aining a parallel state. The back-up plate up/down apparatus includes a base plate; guide blocks installed with a constant distance to the base pl ate; a first driving cylinder installed between the guid e blocks; fixed blocks installed with a constant distanc e to both ends of the base plate and having rotating sha fts inserted to both ends thereof; rotating links, in wh ich the rotating shaft is inserted to an end thereof and a connecting member is connected to the other end there of; a second driving cylinder connected to the connectin g members by means of a rod; holders fixed at rods of ot her connecting members slidably and for fixing the back-up plate; and sensors installed to the holders with a co nstant distance.

Abstract: The present invention relates to a carrier module for micro-BGA(&mgr;-BGA) type device which is capable of testing a produced device without damaging to a solder ball thereunder after being rapidly connected to a test socket. A carrier module for a &mgr;-BGA type device according to the present invention comprises: an upper and lower carrier module body formed with protrusions at the upper and lower portions thereof; a device receiving unit inserted to the upper carrier module body for receiving a &mgr;-BGA type device; and a spring secured elastically to the upper and lower protrusions by being inserted thereto.

Abstract: The present invention relates to a wafer formed with a CSP device and a test socket of a BGA device in which a test socket has a contact member to perform a wiping action for increasing an electric conductivity between a wafer formed with a CSP device and a solder ball formed at a BGA device and a test socket. The present invention provides a test socket including: a contact member block having a slanting face to apply an uniform pressing force to the surface of a solder ball when a BGA device is contacted with the solder ball, formed with a two-dimensionally arranged long hole, the long hole being formed at its central portion with a through hole, the slanting face of the long hole and the surface of the through hole being coated with a conductive material; and a housing formed with a contact member block groove for mounting the contact member block and formed at the upper portion of the groove with a mounting portion for receiving a BGA device.

Abstract: The present invention relates to a surface mounting apparatus installed with a tray feeder in which a mounter is, at its one side, installed with a tape reel feeder and is, at its other side, installed with a tray feeder so that various semiconductor device can be, easily and rapidly, supplied.

Abstract: A planar motor moved in the X-Y direction on a plane includes a mover having an armature coil part installed at the bottom of an armature frame, for receiving an electric signal, and a stator with a first permanent magnet part installed having S-pole permanent magnets and N-pole permanent magnets arranged in a manner that a corner of the N-pole permanent magnets contacts four corners of the S-pole permanent magnets on the surface of a stator frame installed facing the armature coil part of the mover, and inserted permanent magnets arranged at spaces formed as the corners of the S-pole permanent magnets contact the corners of N-pole permanent magnets. Since the inserted permanent magnets are arranged at the first or the second permanent magnet part, the packing density of the permanent magnets can be increased, and accordingly, as the leakage flux is reduced, more stronger thrust can be attained.

Abstract: The present invention relates to a cooling apparatus for an XY gantray, and more particularly to a cooling apparatus which cools an X-axis and Y-axis linear motors used when linear motors are employed for the XY gantry adapted to travel on the plane to perform works. The cooling apparatus for the XY gantry comprises: the X-axis and Y-axis linear motors having respective stator element and moving element, the stator element and moving element having through-holes formed in one side thereof so that external air is introduced therethrough to flow along surface of coil blocks included in the respective moving element of the X-axis and Y-axis linear motors, thereby cooling heat generated from the coil blocks. An advantage is provided in that heat generated from each of the coil blocks can be cooled by air flowing through the air passages provided by respective through-holes of the X- and Y-axis linear motors applied to the XY gantry.

Abstract: A linear motor capable of effectively cooling heat generated when the linear motor is driven is provided where the motor includes a moving element having the lower portion with a plurality of field magnets. The motor includes a stator element having an upper portion with a my plurality or coil units arranged at a constant spacing, and heat dissipating members coupled to the stator element at constant spacing, for externally dissipating heat generated by the stator. An improved cooling effect can be achieved by the provision of heat pipes having heat dissipating fins formed thereon, or by use of thermoelectric semiconductor cooling modules.

Abstract: There is disclosed a printed circuit transferring apparatus of a surface mounter, enabling to accurately control the positions where the electronic components are to be mounted on the printed circuit board (PCB), to make it possible the work at arbitrary positions, and to further provide an easy compensation for any errors possibly occurring in mounting the electronic components.

Abstract: A cooling system for a module IC handler is provided. The cooling system includes an air jet for cooling heat generated from the module IC where the IC is tested. The cooling system includes a base plate, an air jet body mounted on the base plate and having one or more coupling portions, a plurality of plates provided at one side of the air jet body, and a cover provided at the other side of the air jet body. Since the cooling system rapidly cools the heated module IC, the number of module ICs that fail can be reduced, thus resulting in an improvement in the reliability of the products.

Abstract: A chamber for a module IC handler is disclosed which consists of a pre-heater for suitably heating a carrier containing a plurality of module IC at a preset temperature (which may be generated at the driving of the module IC) before the tests for the module IC are performed, and a test site for performing the tests with a external tester while pushing the carrier by using the pusher.

Abstract: A device test handler and a method for operating the same provide a significant reduction of the picking up and placing time periods, and reduce possible damage to the devices being tested. Devices and methods embodying the invention facilitate room temperature and high temperature testing within one device test handler to maximize testing efficiency. A test handler embodying the invention may include a pre-heater for pre-heating the devices on a loading shuttle as the loading shuttle passes to a test chamber. An indexing device in a test chamber of the device is used for successively transferring the devices from a loading shuttle to the test socket, and tested devices from the test socket to an unloading shuttle. Heat supply means may be provided for supplying a high temperature heat to the test chamber when the devices are required to be tested in a hot state.

Abstract: A picker for a module IC handler includes a plurality of grippers. Each gripper includes first and second jaws, and one or more cylinders or other actuators for driving the first and second jaws. Each gripper also includes a damping device that damps movements of the jaws to reduce an impact that can occur as the jaws grip a module IC. The grippers may also include one or more sensors for sensing when the jaws have grasped a module IC, or for sensing the position of the gripper relative to the module IC.

Abstract: The present invention discloses a stacker for a tray feeder including: a plurality of frames for forming an outer portion of the stacker; an elevator capable of moving upwardly and downwardly and positioned at a side of an auxiliary frame of the plurality of frames; a driving means for driving the elevator; and a magazine for receiving the tray plates and mounted to the elevator. According to the present invention, the tray plate on which the electronic parts is positioned is precisely mounted by the magazine having the alignment bars due to operation of the stacker, and safely transferred to a predetermined position, to improve productivity and reliability.

Abstract: The present invention discloses a transfer for a tray feeder comprising: a base frame; a support frame installed at both sides of the base frame; first and second linear motion guiders installed oppositely and longitudinally to the inside of the support frame and having a plurality of first and second linear motion guide rails; first and second plates installed to an upper portion of the first and second linear guides and having a cylinder block capable of supporting a side of the tray received an electronic parts and the like; and a driving unit installed to a side portion of the support frame and for making the movement of the first and second plates; wherein the first and second plates can move along the first and second guide rails, crossing with each other.

Abstract: The present invention discloses an exchanger for a tray feeder for transferring and exchanging a tray plate comprising: first and second support frames; a guide support unit including a support frame installed between the first and second support frames; a vacuum generator provided with a side of the first support frame; a nozzle support unit including a pitting unit for transferring a vacuum suction force by connecting it to the vacuum generator, a plurality of vacuum pad for performing a grasp of the tray plate with the vacuum suction force transferred from the pitting unit, and a plurality of stopper capable of supporting the tray plate; a head block connected to a side of the nozzle support unit; a guide block installed to a second belt as a state connected to the head block, thereby capable of guiding the nozzle support unit; a transfer means for transferring the guide block; a driving means for driving the transfer means.

Abstract: A gripper for parts having different shapes is disclosed. The gripper includes a holder having one end mounted and moved in a socket unit, and having a penetration groove forming a passage of air flown through the socket unit; a piston mounted in the penetration groove, and lifted or lowered due to a pressure of the air flown through the penetration groove; a movement unit having a slanted surface to be horizontally moved in a direction of increasing or decreasing an interval by the piston lifted or lowered; and grip tips for picking up or putting the parts. The grip tips are moved to pick up the parts having the different shape and easily mount the parts on the PCB.