Abstract: A semiconductor device handler is provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing is compensated for, allowing a test of the semiconductor device to be carried out at an exact temperature, or within an exact temperature range.

Abstract: A carrier module for a semiconductor device handler, in which grooves for flow of cooling fluid are formed in a seating surface of the carrier module for the semiconductor device. The grooves improve cooling efficiency by forcing the cooling fluid sprayed from a test temperature deviation compensating system onto the carrier module to spread throughout substantially an entire surface of the semiconductor device, and to remain in the carrier module for a period of time before being discharged.

Abstract: There is disclosed an apparatus for adjusting the origins of module heads of a surface mounting apparatus for a dual gantry, the adjusting apparatus, and method therefor.

Abstract: The present invention relates to a carrier module for micro-BGA (&mgr;-BGA) type device which is capable of testing a produced device without damaging to a solder ball thereunder after being rapidly connected to a test socket. A carrier module for a BGA type device according to the present invention comprises: an upper and lower carrier module body formed with protrusions at the upper and lower portions thereof; a device receiving unit inserted to the upper carrier module body for receiving a &mgr;-BGA type device; and a spring secured elastically to the upper and lower protrusions by being inserted thereto.

Abstract: A mounter head is provided for a surface mounting apparatus which is capable of easily controlling a pitch of a mounting device as well as preventing backlash when the device is mounted on a printed circuit board. The mounter head includes a rack block having a rack for moving up and down by means of a pinion rotated by a driving source; a nozzle shaft installed at one side of the moving unit; a nozzle secured to the lower end of the nozzle shaft for sucking a device to be mounted; and a driving source installed corresponding to each nozzle shaft for rotating each nozzle.

Abstract: A method and apparatus for picking up module ICs from customer trays utilizes a rotating table. In the apparatus and method, the customer tray is placed on the rotating table, and the rotating table is inclined a predetermined amount. The inclination of the rotating table causes the customer tray, and the module ICs held in the tray, to also be inclined. A grasping apparatus is then used to pick up the module ICs from the customer tray. The pick up apparatus may also be configured to incline the same amount as the rotating table. Once the module ICs have been picked up from the customer tray, they can be delivered to an unloading station, or to a module IC carrier.

Abstract: A module IC handler used for testing module Ics is disclosed in which the handler enables loading and unloading operations for module ICs, without further elevating pallet over an installation plate, and provides sequential transferring operations for the pallet on which test or customer tray is placed. To this end, after all module Ics 1 are loaded from the test tray 6 exposed to the loading or unloading position 19 or 26 by the loading and unloading elevator units 18a, 18b, or the test-finished module Ics are filled in the customer tray 17, the pallet 5 is moved to a rotation position 30 by a transfer 31, and then can be circulated to an upper side of the loading or unloading elevation plate 36 by the downer 32.

Abstract: A method for assembling an armature of a moving coil type linear motor is provided comprising the steps of mounting a plurality of coils on to a coil alignment block; covering a top surface of the coil alignment block with an upper cover; wiring the coils with each other in a predetermined sequence; assembling an armature frame, a fixing cover and the coil alignment block to fix the coils, covering a bottom surface of the coil alignment block with a lower cover, and applying an epoxy adhesive to thereby fix the coils.

Abstract: A nozzle device of a surface mounting device including a holder mounted and adhered closely to socket shafts by an elastic force of elastic members connected to both ends of the socket shafts, and a holder shaft formed on the bottom surface of the holder is disclosed. The nozzle device further includes a nozzle having a moving member assembled to the inside of the holder shaft, and moved in an upward or downward direction due to a pressure of air flown through the holder shaft, for picking up or placing a parts.

Abstract: Disclosed are an apparatus and method for recognizing a working height of a carrier in a semiconductor device test handler enabling to measure the working height of the carrier fast and precisely to reset with a simplified structure of the apparatus. In a device transfer system for picking up to transfer semiconductor devices, the device transfer system installed on a handler body to move horizontally and vertically and having pickers absorbing the semiconductor devices, the present invention includes an elevating block installed at one side of the device transfer system to move upward and downward, a touch probe installed vertical to the elevating block to move upward and downward in accordance with a contact with an under target object, a detecting means for detecting ascendance of the touch probe, and a driving means for driving the elevating block upward and downward.

Abstract: The present invention discloses a cooling apparatus for a linear motor comprising: a ‘U’ shaped stator back iron; a stator having a plurality of permanent magnets installed on inner facing surfaces of the stator back iron; a coil unit positioned between the stator and the permanent magnets with a predetermined gap; a movable unit having a movable unit back iron fixed on the coil unit, the movable back iron having at least one first air hole formed therein in a longitudinal direction and a first air nozzle linked to the first air hole for injecting cooling air from the top portion of the coil unit to the bottom portion; and a frame aligned at the lower portion of the coil unit having a second air hole formed in a longitudinal direction thereof for receiving the cooling air and a second air nozzle linked to the second air hole for injecting the cooling air from the bottom portion of the coil unit to the top portion.

Abstract: A parts suction head having a non-contact sealing head is disclosed. The head includes: a moving block having first air passages on its upper surface and having a first hollow unit in a longitudinal direction; a spacer having second air passage connected to the first air passage for air flow, and having a second hollow unit in a longitudinal direction; a rotation shaft being inserted into the second hollow unit of the spacer at interval and having third air passage connected to the second air passage for air flow, and having a third hollow unit in a longitudinal direction; and flanges for sealing up an interval between the spacer and the rotation shaft. The rotation shaft is installed in the moving block in a non-contact type by using the spacer to prevent the non-linear frictional force.

Abstract: The present invention relates to an improved chamber for a module IC handler including a pre-heater for heating module ICs to a set temperature. A receiving piece is installed in a heating chamber and is formed with a plurality of receiving grooves for receiving a carrier holding module ICs. An operating piece is disposed the chamber adjacent the receiving piece. An upper surface the operating piece includes a plurality of receiving grooves of the same interval as the receiving grooves of the receiving piece. In operation, the operating piece raises a module IC carrier from a first groove on the receiving piece and translates the module IC carrier by a distance roughly equivalent to the thickness of the module IC carrier. After translating the module IC carrier, the operating piece lowers the module IC carrier into an adjacent second groove on the receiving piece.

Abstract: There is provided a picking apparatus for transferring semiconductor devices in a test handler to increase the number of devices transferred at one time and suitable for devices having different pitches.

Abstract: Disclosed are an apparatus and method for recognizing a working position of a device transfer system in a semiconductor device test handler enabling to recognize to reset the working positions of the transfer unit for a tray and a change kit as replacing components fast and precisely when various kinds of semiconductor devices are tested in the handler. A laser sensor detecting a color change of an object is installed at a transfer unit, and scans corners of the tray and change kits to be replaced in horizontal and vertical directions to acquire the position information of the corners of the tray and change kits. The present invention calculates the working position of the transfer unit precisely for rest using the basic information inputted previously to the control unit of the handler and the acquired information.

Abstract: A surface mounting device is provided on which work can be performed more efficiently and correctly by providing one or more moving means movable together or independently to a predetermined portion of a X-Y gantry. The surface mounting device includes one or more X frames configured to be driven in a predetermined direction together or independently; main driving means for driving the one or more X frames; one or more moving means disposed on a selected portion of the X frames and having one or more manipulators movable in a predetermined direction together or independently; sub driving means configured to drive the one or more manipulators together or independently; one or more head and vision portions disposed on the one or more moving means; and a component supplying portion configured to supply a component to the head.

Abstract: A method for recognizing working position in a semiconductor test handler is disclosed. The method includes the steps of: (a) obtaining necessary information through image input unit while moving device transfer unit to upper portion of tray and in horizontal and vertical directions; (b) obtaining image information of identifiers attached to respective change kits through the image input unit while moving the device transfer unit to the respective change kits and moving the device transfer unit in one direction, and simultaneously obtaining origin of the change kit; (c) comparing kinds of semiconductor devices inputted into control unit of the handler with information of the identifiers which are obtained in the step of (b), and determining whether or not the kinds of the semiconductor devices accords with those of the change kits; and (d) calculating the working position of the device transfer unit using the image information obtained through the steps a) to c) in the image processor and the control unit.

Abstract: Disclosed is an apparatus for transferring semiconductor devices in a semiconductor device enabling to simplify the structure for varying pickers for picking up semiconductor devices as well as accomplish fast and precise variation, of the pickers, and includes rectangular frames installed movably on a handler body, stators of two linear motors installed on inner sides of two of the frames adjacent, respectively, movers of the two linear motors installed to move along the stators, respectively, a reference pickup member fixed to an inner corner between the frames to pick up the semiconductor device, first and second pickup members coupled with the movers of the linear motors to move along the frames, respectively, a first guide member fixed to the first pickup member to be in parallel with the frame, a second guide member fixed to the second pickup member to be vertical the first guide member, and a third pickup member coupled with both of the first and second guide members to move along the second and first

Abstract: Disclosed is an aligning apparatus in a semiconductor device test handler enabling to reduce a time taken for loading semiconductor devices on a test tray by means of an aligner and a lower pushing unit which are driven to operate independently to align the semiconductor devices.

Abstract: An apparatus for heating and cooling a semiconductor device in a handler for testing the semiconductor device is provided. The apparatus includes: a thermal conductive mounting plate having a plurality of seating recesses on which the semiconductor devices are mounted; a thermal conductive heating plate installed adjacent to a lower side of the mounting plate and having at least one heater installed therein, for transferring heat to the mounting plate; a thermal conductive cooling plate installed adjacent to a lower side of the heating plate on a main body of the handler and having a flow groove such that a cooling fluid fed from an external cooling fluid supply source flows and then is exhausted to an outside; a heating control means for controlling heat irradiated from the heater of the heating plate to control heating temperature of the mounting plate; and a cooling control means for controlling amount of the cooling fluid fed to the cooling plate to control cooling temperature of the mounting plate.