Abstract: There are provided an apparatus and a method for manufacturing a copper-base alloy. The apparatus includes an alloying spout, at least one feeder and a tundish. The tundish is inclined downwardly from one end toward the other end for flowing a molten copper therethrough. The feeder is connected to the alloying spout for introducing at least one solid solute constituent into the alloying spout. The method includes the steps of providing the above apparatus, continuously introducing the molten copper from the inlet into the passageway of the alloying spout and causing the molten copper to flow downwardly through the passageway to the outlet, and continuously introducing the solid state constituent into the passageway of the alloying spout through the feeder to mix the solute constituent with the molten copper to produce the copper-base alloy.

Abstract: A cathode for an electron tube comprises a base (1) including nickel as a major element and including at least silicon as a reducing element, and it further comprises an electron-emissive layer (5) coated on the base, including not only alkaline earth metal oxide (8) containing at least barium but also scandium oxide. The scandium oxide (4) is in the form of dodecahedral or prismatic polyhedral crystals and dispersed in the electron-emissive layer in the range from 0.1 to 20 wt. %.

Abstract: Hexagonal-bipyramid crystalline scandium oxide powder and a process for preparing the same are disclosed. The process comprises forming scandium oxalate from an acid aqueous solution containing scandium in the presence of chloride ions and ammonium ions, collecting the precipitate and heating the collected precipitate. Hexagonal-bipyramid crystalline scandium oxide is useful for making electron gun for cathode ray tubes.

Abstract: An apparatus for collecting wafers sliced from a semiconductor crystal rod, and the apparatus includes a primary mobile member, a secondary mobile member and a wafer collecting assembly. The primary mobile member is movable toward and away the crystal rod, and the secondary mobile member is mounted on the primary mobile means and is movable relative to the primary mobile member in a direction toward and away from the semiconductor crystal rod. The wafer collecting assembly is mounted on the second mobile member for collecting the wafers sliced from the semiconductor crystal rod.

Abstract: A monocrystal rod utilized for producing the semiconductor device or solar cell includes a neck section, a main rod section and a shoulder section. The neck section is smaller in diameter than a seed crystal. The main rod section is formed integrally with the neck section and is larger in diameter than the neck section. The shoulder section is tapered for linking the neck section to the main rod section. The main rod section has a stopper section at the top portion of the main rod section, and the stopper section is larger than the main rod section.Also, an apparatus for preparing the monocrystal rod has a safety member for supporting upwards the stopper section of the falling monocrystal rod.Further, a method of preparing the monocrystal rod includes the steps as follows. The seed crystal is pulled out from a melt in a crucible while rotating it.

Abstract: An apparatus for cutting a semiconductor crystal ingot into wafers includes a rotary blade, a first sensor, a second sensor and a computing unit. The blade is of a generally disk shape having a mark put thereon. The first sensor is stationarily located in opposed relation to the blade for sensing a distance between the blade and the first sensor to produce a first signal representative of the distance. The second sensor is stationarily disposed in opposed relation to the blade for detecting the mark of the blade to produce a second signal representative of a position of the mark. The computing unit is connected to the first and second sensors for receiving the first signal from the first sensor in synchronization with the second signal from the second sensor, and computing an amount of warp of the blade as to a fixed position thereof by using the received first signal.

Abstract: In a face milling cutter, a plurality of cutter inserts are detachably mounted to an outer periphery of a forward end portion of a cutter body. The cutter inserts are arranged in peripherally spaced relation to each other about a rotary axis of the cutter body. Each of the cutter inserts has opposite faces one of which, first face being generally in the form of an octagon having eight ridgelines or a hexagon having six ridgelines, which are formed respectively into cutting edges. Each pair of adjacent cutting edges as a major edge are intersected with each other at an obtuse angle.

Abstract: A combination of a cutter and a fastener unit for fastening the cutter to a tool attachment shaft. The cutter includes a cutter body formed therein with a threaded bore. The fastener unit includes a fastener element having one axial end portion provided on its outer peripheral surface with first threads threadedly engageable with a threaded bore in the tool attachment shaft. The other axial end portion of the fastener element is provided on its outer peripheral surface with second threads threadedly engageable with the threaded bore in the cutter body. The first threads are reverse in a direction of helix to the second treads. An end face of the other axial end portion has a size at most equal to an inner diameter of the threaded bore in the cutter body. If the fastener unit includes a clamper in addition to the fastener element, the cutter body is formed therein with a through bore in place of the threaded bore, and the clamper is received in the through bore.

Abstract: A method of fabricating uranium dioxide (UO.sub.2) powder from uranium hexafluoride (UF.sub.6) is disclosed, which comprises(1) reacting UF.sub.6 gas with steam with controlling the temperature of reaction between said UF.sub.6 gas and said steam at a predetermined temperature within the range of 200.degree. to 700.degree. C., to form solid uranyl fluoride (UO.sub.2 F.sub.2) and/or uranium oxide with an O/U ratio (oxygen-to-uranium atomic ratio) of 2.7 to 3,(2) dissolving said UO.sub.2 F.sub.2 and/or uranium oxide in water or nitric acid to form an aqueous uranyl solution containing UO.sub.2 F.sub.2 and/or uranyl nitrate (UO.sub.2 (NO.sub.3).sub.2),(3) reacting said aqueous uranyl solution with ammonia to precipitate ammonium diuranate (ADU),(4) filtering said precipitate,(5) drying said precipitate,(6) calcining said dry precipitate, and(7) reducing said calcined precipitate, whereby controlling the characteristics of said UO.sub.2 powder.

Abstract: A corrosion resistant zirconium alloy for use as a nuclear reactor cladding material. This alloy consists essentially of, on a weight % basis 0.02-1.15% Sn, 0.19-0.6% Fe, 0.07-0.4% Cr, and optionally 0.05 to not more than 0.5% Nb, the balance being Zr and incidental impurities, provided that the content of the nitrogen in the form of incidental impurities is no more than 60 ppm.

Abstract: A roll for a mill includes a roll shaft of a circular cross-section having an axis of rotation therethrough and having an outer peripheral surface. A ring of a wear-resistant material having an outer peripheral surface adapted to engage with a metal material to be rolled is disposed around the roll shaft. A tubular sleeve having an inner peripheral surface is disposed between the roll shaft and the ring with the inner peripheral surface mated with the outer peripheral surface of the roll shaft. A layer of adhesive is interposed between the ring and the sleeve for adhesively securing the ring and the sleeve together. The adhesive layer is compressed by the ring and the sleeve so as to be brought into frictional engagement therewith.

Abstract: Gallium-containing waste is chlorinated in the presence of gallium trichloride from the beginning. By this procedure, gallium is more efficiently chlorinated and gallium trichloride is more easily separated from other chlorides and recovered.

Abstract: An intermetallic compound type alloy consisting essentially of:Ni or Co or both 45-60%;Si 0.01-1%;Re 0-2%;Hf 0-2%;C 0-2%;one or more elements selected from a group consisting of Zr, Fe, V, Nb, Ta, Cr, Mo, W and Mn 0-5%;one or more elements selected from a group consisting of P, Cu, Zn, Ga, Ge, Cd, In, Sn, Sb, Pb and Bi 0-2%; andthe balance Ti and incidental impurities, andhaving excellent toughness, machinability and wear resistance, the % being atomic %.

Abstract: This invention discloses a method for contactless evaluation of characteristics of semiconductor wafers and devices. The method includes the steps of (a) continuously irradiating focused microwaves on a surface of a semiconductor specimen; (b) continuously receiving reflected microwaves reflected from said surface; (c) irradiating a focused laser beam pulse on the specimen, energy of the pulse being in excess of the band-gap energy of the semiconductor material; (d) measuring lifetime .tau..sub.m from the time-history of the characteristics of the reflected microwaves; and (e) calculating the surface recombination velocity S and bulk lifetime .tau..sub.b. The focused microwaves and focused laser beam can improve the resolution during measurement.

Abstract: An apparatus for detecting an orientation flat of a wafer and centering the wafer includes a hand base, a pair of guide rollers mounted on the hand base, and a stopper mechanism mounted on the hand base. The hand base is operable to be located in opposed relation to one of opposite faces of the wafer, and has an axis therealong. The guide rollers serve to support the wafer located in opposed relation to the hand base, and are symmetrically disposed with respect to the axis of the hand base. The stopper mechanism cooperates with the pair of guide rollers to center the wafer, and are movable along the axis of the hand base and engageable with the orientation flat of the wafer.

Abstract: A coolant supply nozzle apparatus for a slicing machine includes a body, a first mobile member, a second mobile member, a nozzle tube, a first positioner and a second positioner. The body has a pivot shaft disposed so as to extend axially of the blade. The first mobile member is pivotally mounted on the shaft. The second mobile member is mounted on the first mobile member so as to be movable in a direction parallel to the shaft. The nozzle tube is mounted on the second mobile member and has an opening end adapted to be directed toward the cutting edge of the shaft. The opening end is shifted from the pivot shaft radially of the blade. The first positioner serves to position the first mobile member in place while the second positioner serves to position the second mobile member in place.

Abstract: A novel synchronizer ring for use in speed variators that is made of an iron-base sintered alloy and which has high strength and wear resistance while exhibiting good accommodation by the mating surface is disclosed. This synchronizer ring is made of an iron-base sintered alloy that contains 0.1-0.9 wt % C., and at least one optional element selected from among 0.1-6 wt % of at least one of Mn, Cr and Mo, 0.1-6 wt % of at least one of Ni and Cu, and 0.02-0.5 wt % B, the balance being Fe and incidental impurities (Si, S and P as incidental impurities being present in a total amount not exceeding 0.5 wt %), and which has a porosity of 0.05-5 vol %. The properties of this ring, notably its wear resistance, can be further improved by forming either a hard Ni-P compound layer or a nitrided layer on at least the surface of the above-specified sintered alloy which is to make sliding contact with a tapered cone.

Abstract: An apparatus for melting a semiconductor material and growing a semiconductor crystal from the melted material includes a susceptor having a peripheral rim, a quartz crucible assembly for receiving the semiconductor material therein. The crucible assembly includes an outer crucible housed in and supported by the susceptor and an inner crucible adapted to be so placed within the outer crucible as to define a multi-wall structure.