Patents Assigned to Mitsubishi Kinzoku Kabushiki Kaisha
  • Patent number: 4932389
    Abstract: A slicing apparatus includes: an annular plate-like rotary blade adapted to be rotated about an axle thereof and having an inner peripheral cutting edge; a table for carrying a work; a first work-feeding mechanism for moving the work on the table in a direction parallel to the axis of the rotary blade; and a second work-feeding mechanism for moving the table in a direction parallel to the opposite side of the blade so as to cause the work on the table to be sliced by the blade.
    Type: Grant
    Filed: October 20, 1988
    Date of Patent: June 12, 1990
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Yukihiro Saeki, Masatoshi Tagami
  • Patent number: 4929220
    Abstract: A pulley with plural fillets disposed on an outer peripheral surface thereof, which includes a plurality of recesses for lightening the weight thereof. The recesses are circumferentially formed in an inner cylindrical surface of a ring-shaped rim at equal angular intervals about an axis of the rim. Each of the recesses is disposed at a position of the inner surface of the rim opposite that of the fillet.The pulley can be cheaply manufactured to be lightweight without reducing the mechanical strength thereof, and thereby can be exactly rotated at a high speed without vibrating and creating noise even if its center of gravity is displaced from its axis. Therefore, the pulley is adapted to be used for power transmission in an automobile.
    Type: Grant
    Filed: August 18, 1988
    Date of Patent: May 29, 1990
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Katsuaki Hosono, Kenji Kushita
  • Patent number: 4926836
    Abstract: A dressing apparatus includes: a first body extending parallel to the axis of the cut-off wheel, the first body having a slider member slidable along the longitudinal axis of the first body, the slider member being urged by an urging member so as to be normally retained in an initial position thereof; a second body, slidably connected to the slider member, for movement in a direction perpendicular to both the cut-off wheel's axis and the first body's axis; a drive motor for rotating a pair of grinding wheels connected to the head member, the axes of the grinding wheels being perpendicular to a plane parallel to both the cut-off wheel's axis and the first body's axis, a line which is perpendicular to both of the axes of the grinding wheels being parallel to the first body's axis; and a drive mechanism, interposed between the first and second bodies, for moving the second body so that either of the grinding wheels is brought into contact with the peripheral cutting edge formed on the cut-off wheel to apply a dr
    Type: Grant
    Filed: April 13, 1988
    Date of Patent: May 22, 1990
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventor: Seiichi Abe
  • Patent number: 4919573
    Abstract: A ball end mill includes an end mill body, an indexable cutter insert, a clamp screw and shift preventing mechanism. The body has an insert receiving recess formed in a forward end portion thereof. The insert has a front face, a rear face and at least two convexly curved side faces, and has at least two convexly curved main cutting edges each defined by the intersection of a respective one of the convexly curved side faces with the front face. The insert is received in the insert receiving recess with the rear face mated with the bottom face of the recess in such a manner that one of the main cutting edges is indexed in a cutting position.
    Type: Grant
    Filed: September 20, 1988
    Date of Patent: April 24, 1990
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Osamu Tsujimura, Tatsuo Arai, Masayuki Okawa
  • Patent number: 4911895
    Abstract: An apparatus for growing a semiconductor crystal from a melt includes a susceptor, a quartz crucible, at least one reinforcing ring, and a heater. The crucible is housed in the susceptor for receiving a semiconductor material therein. The reinforcing ring is provided on the quartz crucible for enhancing the strength of the crucible. The heater is disposed so as to surround the susceptor for heating the semiconductor material contained in the crucible.
    Type: Grant
    Filed: June 1, 1988
    Date of Patent: March 27, 1990
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Michio Kida, Kensho Sahira
  • Patent number: 4906438
    Abstract: An Ni base alloy for use in spark plug electrodes for internal combustion engines which consists essentially by weight of:0.5 through 1.5% Si;0.7 through 2.8% Mn;0.25 through 4.5% Al; andoptionally 0.005-1% of one or more elements selected from the group consisting of Y and rare earth elements; and the remainder Ni and incidental impurities.
    Type: Grant
    Filed: September 23, 1988
    Date of Patent: March 6, 1990
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Kensho Sahira, Hideo Kitamura, Akira Mimura, Nobuyoshi Kurauchi
  • Patent number: 4903437
    Abstract: Slicing machine having a handle to be driven manually to generate command pulses. By revolving the handle, a feedtable is moved at the operator's command, enabling the positioning of a semiconductor material at the right position to start slicing. The thickness of the first wafer cut off from the material as well as other wafers, has a predetermined thickness, so that no wafer is wasted.
    Type: Grant
    Filed: July 25, 1988
    Date of Patent: February 27, 1990
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Yutaka Kubotera, Kazunari Akiyama
  • Patent number: 4901550
    Abstract: In a method of manufacturing an extra fine wire, a blank wire cooled to a low temperature is caused to pass through a high humidity atmosphere and, immediately thereafter, is drawn to a diameter such that wire breakage due to the drawing does not occur. Alternatively, a blank wire is caused to pass through a die assembly so arranged as to be immersed in refrigerant, and is drawn within the refrigerant of low temperature, to a diameter with which wire breakage due to the drawing does not occur. The drawn wire material is heated rapidly and is annealed and, thereafter, is cooled rapidly to form an intermediate blank wire. Subsequently, the intermediate wire is drawn at the ordinary temperature.
    Type: Grant
    Filed: December 28, 1988
    Date of Patent: February 20, 1990
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Masato Koide, Takuro Iwamura, Tsugio Koya
  • Patent number: 4899910
    Abstract: A sealant injector for use in repair is provided with a sealant nozzle formed in a forward end of an injector body. A piston is slidably fitted in the injector body, and cooperates with the forward end of the injector body to define therebetween a sealant chamber capable of being filled with sealant. A coil spring is arranged within the injector body, and is provided with such a shape memory effect that when heated, the coil spring biases the piston toward the forward end of the injector body to inject the sealant through the sealant nozzle. A heating unit is associated with the injector body, for heating the coil spring.
    Type: Grant
    Filed: March 15, 1989
    Date of Patent: February 13, 1990
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Kazuhiko Tabei, Sadao Saito, Shunichi Kai
  • Patent number: 4898499
    Abstract: A ball end mill includes an end mill body having an axis of rotation therethrough and an indexable cutter insert releasably attached to a forward end portion of the body. The insert includes a plate having front and rear faces. The front face has at least one generally arcuate first marginal ridge with the first marginal ridge serving as a respective generally arcuate main cutting edge. The front face has at least one short second marginal ridge with the second marginal ridge serving as a respective short cutting edge. The main cutting edge has a leading end portion disposed at one end thereof and intersecting the short cutting edge in such a manner that an angle defined by the leading end portion and the short cutting edge is obtuse. The front face serves as a rake surface for the cutting edges and has a marginal surface portion disposed adjacent to the short cutting edge and the leading end portion.
    Type: Grant
    Filed: March 4, 1988
    Date of Patent: February 6, 1990
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Osamu Tsujimura, Tatsuo Arai, Masaaki Nakayama, Masayuki Okawa
  • Patent number: 4897966
    Abstract: An apparatus for polishing one of opposite faces of a slab member includes a surface plate, a mounting member, an urging shaft and a pressure transmitting member. The surface plate has a flat upper surface and is rotatable about an axis perpendicular to the upper surface. The mounting member has an upper face and a lower face to which the other face of the slab member is fixedly secured, and is disposed above the surface plate in such a manner that the one face of the slab member to be polished is held in contact with the upper surface of the surface plate. The urging shaft is connected to the mounting member for urging the mounting member toward the surface plate at a prescribed urging pressure to bring the one face of the slab member into pressure contact with the upper surface of the surface plate. The pressure transmitting member is interposed between the mounting member and the urging shaft for causing the urging pressure of the urging shaft to exert on the upper face of the mounting member.
    Type: Grant
    Filed: August 18, 1987
    Date of Patent: February 6, 1990
    Assignees: Japan Silicon Co., Ltd., Mitsubishi Kinzoku Kabushiki Kaisha
    Inventor: Yutaka Takahashi
  • Patent number: 4894092
    Abstract: A heat-resistant pigment can be produced by forming a dense and uniform coating on the surface of the pigment by contacting said pigment with a metal alkoxide diluted with a water-miscible or semi-water-miscible solvent.
    Type: Grant
    Filed: April 14, 1987
    Date of Patent: January 16, 1990
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Akira Nishihara, Makoto Tsunashima
  • Patent number: 4889170
    Abstract: Herein disclosed are a high-strength Ti alloy material having improved workability which contains 2-5% Al, 5-12% V and 0.5-8% Mo (the percents being on a weight basis) and which satisfies the relation: 14%.ltoreq.1.5.times.(V content)+(Mo content).ltoreq.21%, with the balance being Ti and incidental impurities, and a process for producing such high -strength Ti alloy material.The process comprises: preparing a Ti alloy ingot having the above specified composition; hot working the ingot at a temperature wihtin the range of 600.degree.-950.degree. C.; subjecting the work to solid solution treatment at a temperature in the range of 700.degree.-800.degree. C.; and age-hardening the work at a temperatrue between 300.degree. and 600.degree. C. The reesulting Ti alloy material is suitable for use in the fabrication of parts of aircraft where high specific strength and heat resistance are required.
    Type: Grant
    Filed: June 13, 1986
    Date of Patent: December 26, 1989
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Yoshiharu Mae, Tsutomu Oka, Atsushi Hirano
  • Patent number: 4888153
    Abstract: An Fe-base build-up alloy excellent in resistance to corrosion and wear is disclosed. This alloy comprises in weight percent:C: from 0.005 to 1.6%,Mn: from 4 to 28%,Cr: from 12 to 36%,Mo: from 0.01 to 9%,Hf: from 0.005 to 15%,N: from 0.01 to 0.9%, andoptionally contained:Si: from 0 to 5%,Ni: from 0 to 30%, andone or both of:Nb and W: from 0 to 6%, andthe balance being Fe and incidental impurities.
    Type: Grant
    Filed: July 7, 1988
    Date of Patent: December 19, 1989
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Ritsue Yabuki, Saburo Wakita
  • Patent number: 4886777
    Abstract: A process for preparing compound metal oxides, a superconductive compound oxides for instance, is disclosed. The process comprises preparing an aqueous solution containing a predetermined content ratio of chloride, nitrate or acetate of a rare earth metal, an alkaline earth metal and copper, slightly basifying the solution to form hydroxides of the rare earth metal and copper and then introducing carbon dioxide to form carbonate of the alkaline earth metal, collecting the thus formed mixed precipitate of hydroxides and carbonate and firing it.
    Type: Grant
    Filed: August 1, 1988
    Date of Patent: December 12, 1989
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Etsuji Kimura, Nozomu Hasegawa, Yutaka Nishiyama
  • Patent number: 4886641
    Abstract: A novel electrical contact spring material made of a copper base alloy is disclosed. This spring material has high strength and toughness, as well as good adhesion of solder. It also has reduced anisotropy in its characteristics in two directions, i.e., the working direction and the direction perpendicular to it. A very thin-walled member can be produced from this spring material since its anisotropy in characteristics is small and will not increase even if the amount of working is increased.The copper base alloy of which this spring material is made consists essentially of 2.2-5% Ti, 0.1-0.8% Co, 0.02-0.5% Cr, 0-0.6% of Ni and/or Fe, 0-0.5% of at least one of Ca, Mg, Zn, Cd, Li, Zr, Si, Mn, Sn and Al, and the balance being Cu and incidental impurities.
    Type: Grant
    Filed: April 20, 1988
    Date of Patent: December 12, 1989
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Takuro Iwamura, Masao Kobayashi
  • Patent number: 4885135
    Abstract: A fine gold alloy wire of high tensile strength for bonding semiconductor elements is disclosed. The wire consists essentially of 0.0003 to 0.010 wt % of at least one rare earth element selected from the group consisting of La, Ce, Pr, Nd, Sm, Eu,Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sc and Y, the balance being Au and incidental impurities. The wire does not present a deformed loop and has greater bond strength if it contains 0.0003 to 0.010 wt % of at least one rare earth element of the Cerium Group selected from the group consisting of La, Ce, Pr, Nd and Sm and 0.0001 to 0.0060 wt % of at least one element selected from among Ge, Be and Ca.
    Type: Grant
    Filed: January 9, 1989
    Date of Patent: December 5, 1989
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Naoyuki Hosoda, Masayuki Tanaka, Tamotsu Mori
  • Patent number: 4883391
    Abstract: A ball end mill includes a body, an indexable cutter insert and a clamp screw. The body has a recess formed in a forward end portion thereof and a bore formed therein and opening to a bottom face of the recess. The bore includes a cylindrical portion disposed adjacent the bottom face and an internally threaded portion greater in diameter than the internally threaded portion. The insert includes a front face, a rear face and at least two convexly curved side faces. The front face has at least two convexly curved main cutting edges each defined by the intersection of a respective one of the curved side faces with the front face. The insert has an aperture formed therethrough and extending generally perpendicular to the rear face. The insert is releasably mounted in the recess with the rear face held in contact with the bottom face in such a manner that one of the main cutting edges is indexed in a cutting position.
    Type: Grant
    Filed: September 21, 1988
    Date of Patent: November 28, 1989
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Osamu Tsujimura, Tatsuo Arai, Masayuki Okawa
  • Patent number: 4882100
    Abstract: A process of fabricating UO.sub.2 pellets comprising the steps of filtering and drying a slurry of ammonium diuranate (ADU) including ammonium fluoride (NH.sub.4 F), in order to form ADU powder, and then subjecting the ADU powder to calcining, reducing, compacting and sintering treatments, to form UO.sub.2 pellets.
    Type: Grant
    Filed: January 13, 1989
    Date of Patent: November 21, 1989
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Tadao Yato, Takeshi Onoue, Hiroshi Tanaka
  • Patent number: 4882117
    Abstract: An injection molding process in which an injection of a molten resin into a cavity is performed under such a condition that an internal resin pressure upon filling of the cavity with the molten resin is lower than a maximum internal resin pressure required upon pressure holding after the filling.
    Type: Grant
    Filed: June 28, 1988
    Date of Patent: November 21, 1989
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Yoshinobu Takeda, Kunio Yamamoto