Patents Assigned to Mitsubishi Materials Corporation
  • Publication number: 20210363612
    Abstract: This copper alloy for electronic or electric devices includes: Mg: 0.15 mass % or greater and less than 0.35 mass %; and P: 0.0005 mass % or greater and less than 0.01 mass %, with a remainder being Cu and unavoidable impurities, wherein an amount of Mg [Mg] and an amount of P [P] in terms of mass ratio satisfy [Mg]+20×[P]<0.5, and 0.20<(NFJ2/(1?NFJ3))0.5?0.45 is satisfied in a case where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to total grain boundary triple junctions is represented by NFJ3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is represented by NFJ2.
    Type: Application
    Filed: March 28, 2019
    Publication date: November 25, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka MATSUNAGA, Kenichiro KAWASAKI, Hiroyuki MORI, Kazunari MAKI, Yoshiteru AKISAKA
  • Patent number: 11174565
    Abstract: This plating liquid contains (A) a soluble salt that contains at least a stannous salt, (B) an acid selected from organic acids and inorganic acids or a salt thereof, and (C) two kinds of surfactants of an amine-based surfactant (C1) and a nonionic surfactant(s) (C2 and/or C3). The amine-based surfactant (C1) is a polyoxyethylene alkyl amine represented by general formula (1); and the nonionic surfactant(s) (C2 and/or C3) is a condensation product of a polyoxyethylene and a polyoxypropviene represented by general formula (2) or general formula (3). In formula (1), x is 12-18 and y is 4-12. In formula (2), m is 15-30 and (n1+n2) is 40-50. In formula (3), (m1+m2) is 15-30 and n is 40-50.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: November 16, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Mami Watanabe, Kiyotaka Nakaya, Yasushi Konno
  • Patent number: 11177186
    Abstract: A bonded body is formed by bonding a ceramic member formed of an Al-based ceramic and a copper member formed of copper or a copper alloy, in which, in a bonding layer formed between the ceramic member and the copper member, a crystalline active metal compound layer formed of a compound including an active metal is formed on a ceramic member side, and, the Al concentration is 0.15 at % or less in a thickness range of 0.5 ?m to 3 ?m from an interface of the active metal compound layer on a copper member side toward the copper member.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: November 16, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Nobuyuki Terasaki
  • Publication number: 20210352828
    Abstract: A carbonaceous member contains graphene aggregates formed by deposition of a single layer or multiple layers of graphene, and flat graphite particles, and has a structure in which the flat graphite particles are laminated with the graphene aggregate as a binder so that basal surfaces of the graphite particles overlap with one another, and the basal surfaces of the flat graphite particles are oriented in one direction. A metal layer includes a metal plating layer directly formed on a surface (edge lamination surface) to which edge surfaces of the graphite particles laminated in the carbonaceous member are directed, and the metal plating layer is made of a metal having a thermal conductivity of 50 W/(m·k) or greater.
    Type: Application
    Filed: October 31, 2019
    Publication date: November 11, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koichi Kita, Toshiyuki Nagase, Kiyotaka Nakaya, Kotaro Iwata
  • Publication number: 20210343453
    Abstract: In this treatment method of a coated wire, a coated wire, which is a metal wire coated with a resin, is subjected to low-temperature heating in a non-combustion atmosphere in coexistence with an alkali to embrittle the coating resin, the embrittled coating resin is crushed, and the coating resin and the metal wire are separated.
    Type: Application
    Filed: October 18, 2019
    Publication date: November 4, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenshi Takahashi, Shu Muraoka, Hiroshi Hayashi
  • Publication number: 20210339321
    Abstract: A cutting insert includes first and second polygonal surfaces and a plurality of side surfaces. A corner edge that has a corner rake surface on the first polygonal surface is formed at a first corner portion, and a main cutting edge is formed from the corner edge to a second corner portion. The main cutting edge includes, at least on a corner edge side, a rake angle gradual increase region where a rake angle of a main rake surface gradually increases to a positive angle side as going from a first end portion of the corner edge toward a second corner portion side.
    Type: Application
    Filed: August 27, 2019
    Publication date: November 4, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Masashi Kanbara, Jun Kitajima, Chinami Sakamoto, Shota Watanabe
  • Patent number: 11162182
    Abstract: A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a phenyl-based surfactant formed of polyoxyethylene bisphenol ether represented by the General Formula (1); and (D) a leveling agent, here, in the Formula (1), X is CaH2a (a is 1 or 3) and m is 2 to 12.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: November 2, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Mami Watanabe, Kyoka Susuki, Kiyotaka Nakaya
  • Publication number: 20210331880
    Abstract: A continuous concentrate feeding equipment of the present invention includes a plurality of concentrate supply mechanisms (50) each including a pressure-adjusting tank that temporarily accumulates granular concentrate; a lift tank that receives the concentrate from the pressure-adjusting tank (50) and discharges the concentrate to a smelting furnace; and a pressure control system that controls pressures of the pressure-adjusting tank (50) and the lift tank (51) such that the concentrate is continuously supplied from the lift tank to the smelting furnace throughout a time when the concentrate is received in the pressure-adjusting tank (50) and a time when the concentrate is discharged into the lift tank (51). The plurality of concentrate supply mechanisms (100) to (103) are connected in parallel to a conveyor for carrying in concentrate from an upstream side of the conveyor to a downstream side thereof.
    Type: Application
    Filed: August 6, 2020
    Publication date: October 28, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenta Kusunose, Masakazu Kitani, Yosuke Unno, Dadang Sundana, Ahmad Munib Fikry, Heri Budi Nurwibowo
  • Patent number: 11158766
    Abstract: This lid material for packages is a lid material for packages which is bonded to a package substrate, and the lid material for packages includes: a glass member including a bonding portion provided in a planar frame shape and a light transmitting portion provided inside the bonding portion; one or more metallized layers formed in a frame shape at the bonding portion of the glass member; and one or more Au—Sn layers provided on the metallized layers and having a frame shape having a width of 250 ?m or less.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: October 26, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Satoru Daido, Hironori Uno
  • Patent number: 11155909
    Abstract: This high-strength free-cutting copper alloy comprises 75.4-78.0% Cu, 3.05-3.55% Si, 0.05-0.13% P and 0.005-0.070% Pb, with the remainder comprising Zn and inevitable impurities, wherein the amount of Sn existing as inevitable impurities is at most 0.05%, the amount of Al is at most 0.05%, and the total amount of Sn and Al is at most 0.06%. The composition satisfies the following relations: 78.0?f1=Cu+0.8×Si+P+Pb?80.8; and 60.2?f2=Cu?4.7×Si?P+0.5×Pb?61.5. The area percentage (%) of respective constituent phases satisfies the following relations: 29???60; 0???0.3; ?=0; 0???1.0; 98.6?f3=?+?; 99.7?f4=?+?+?+?; 0?f5=?+??1.2; and 30?f6=?+6×?1/2+0.5×??62. The long side of the ? phase is at most 25 ?m, the long side of the ? phase is at most 20 ?m, and the ? phase is present within the ? phase.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: October 26, 2021
    Assignee: Mitsubishi Materials Corporation
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
  • Patent number: 11149329
    Abstract: This stabilizer material for superconductor includes a copper material, wherein the copper material contains one kind or two kinds or more of additive elements selected from Ca, La, and Ce for a total amount of 3 ppm by mass or more and 400 ppm by mass or less, with the remainder being Cu and unavoidable impurities, and the total concentration of the unavoidable impurities other than O, H, C, N, and S, which are gas components, is 5 ppm by mass or more and 100 ppm by mass or less, and compounds including one kind or two kinds or more selected from CaS, CaSO4, LaS, La2SO2, CeS, and Ce2SO2 are present in the matrix.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: October 19, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kosei Fukuoka, Yuki Ito, Kazunari Maki
  • Patent number: 11152554
    Abstract: A thermoelectric conversion element includes an element body formed of a thermoelectric conversion material of a silicide-based compound, and electrodes each formed on one surface of the element body and the other surface opposite the one surface. The electrodes are formed of a sintered body of a copper silicide, and the electrodes and the element body are directly joined.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: October 19, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Yoshinobu Nakada
  • Patent number: 11141803
    Abstract: This broach includes a broach body having a shaft shape and a cutting edge section in which cutting edges protrude and are arranged in a longitudinal direction on an outer circumference of the broach body. The cutting edge section includes, in the order from a front side of the broach body, an circumference cutting section in which an outer diameter of each of the cutting edges sequentially increases rearward, and a tooth thickness cutting section in which a thickness of each of the cutting edges sequentially increases from the cutting edges at a rear end of the circumference cutting section toward the rear side. At least a rear end portion of the circumference cutting section is a high-feed cutting section in which the cutting depth per cutting edge is set in a range of 0.15 mm or more and 0.30 mm or less.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: October 12, 2021
    Assignees: MITSUBISHI MATERIALS CORPORATION, TOYOTA MOTOR HOKKAIDO, INC.
    Inventors: You Tanaka, Kensuke Kohno, Toru Yamazaki
  • Publication number: 20210310113
    Abstract: A multilayer film includes: an Ag alloy film; and a transparent dielectric film laminated on both surfaces of the Ag alloy film, and in the Ag alloy film, at least one of Sn or Ge is contained in a range of 0.5 atom % to 8.0 atom % in total, a total content of Na, K, Ba, and Te is 50 ppm by mass or less, a carbon content is 50 ppm by mass or less, and a remainder contains Ag and unavoidable impurities.
    Type: Application
    Filed: October 3, 2018
    Publication date: October 7, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yuto Toshimori, Hideharu Matsuzaki, Ichiro Shiono
  • Patent number: 11136648
    Abstract: This free-cutting copper alloy contains 76.0%-79.0% Cu, 3.1%-3.6% Si, 0.36%-0.84% Sn, 0.06%-0.14% P, 0.022%-0.10% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 74.4?f1=Cu+0.8×Si?8.5×Sn+P+0.5×Pb?78.2, 61.2?f2=Cu?4.4×Si?0.7×Sn?P+0.5×Pb?62.8, 0.09?f3=P/Sn?0.35. The area ratio (%) of the constituent phases satisfies the following relations: 30???65, 0???2.0, 0???0.3, 0???2.0, 96.5?f4=?+?, 99.4?f5=?+?+?+?, 0?f6=?+??3.0, 36?f7=1.05×?+6×?1/2+0.5×??72. The ? phase is present within the ? phase, the long side of the ? phase does not exceed 50 ?m, and the long side of the ? phase does not exceed 25 ?m.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: October 5, 2021
    Assignee: Mitsubishi Materials Corporation
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Shinji Tanaka, Yoshiyuki Goto
  • Patent number: 11139218
    Abstract: A bonded body is formed by bonding a ceramic member formed of an Al-based ceramic and a copper member formed of copper or a copper alloy, in which, in a bonding layer formed between the ceramic member and the copper member, a crystalline active metal compound layer formed of a compound including an active metal is formed on a ceramic member side, and, the Al concentration is 0.15 at % or less in a thickness range of 0.5 ?m to 3 ?m from an interface of the active metal compound layer on a copper member side toward the copper member.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: October 5, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Nobuyuki Terasaki
  • Patent number: 11130713
    Abstract: A cBN sintered material cutting tool includes a cutting tool body that is made of a sintered material including cubic boron nitride particles and a binder phase, in which: an average particle size of the cBN particles is 0.5 ?m or less and a content ratio of the cBN particles in the sintered material is 35 vol % to 80 vol %; and the binder phase includes 1.0 vol % to 20 vol % of an Al compound, an average particle size of the Al compound present in the binder phase is 300 nm or less, and a value of a ratio (a value of SN/SO; area ratio) of a content SN of nitrogen (N) included in the Al compound to a content SO of oxygen (O) included in the Al compound is 1.1 to 5.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: September 28, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Masahiro Yano, Shirou Oguchi, Yosuke Miyashita
  • Patent number: 11131009
    Abstract: This high-strength free-cutting copper alloy comprises 75.4-78.0% Cu, 3.05-3.55% Si, 0.05-0.13% P and 0.005-0.070% Pb, with the remainder comprising Zn and inevitable impurities, wherein the amount of Sn existing as inevitable impurities is at most 0.05%, the amount of Al is at most 0.05%, and the total amount of Sn and Al is at most 0.06%. The composition satisfies the following relations: 78.0?f1=Cu+0.8×Si+P+Pb?80.8; and 60.2?f2=Cu?4.7×Si?P+0.5×Pb?61.5. The area percentage (%) of respective constituent phases satisfies the following relations: 29???60; 0???0.3; ?=0; 0???1.0; 98.6?f3=?+?; 99.7?f4=?+?+?+?; 0?f5=?+??1.2; and 30?f6=?+6×?1/2+0.5×??62. The long side of the ? phase is at most 25 ?m, the long side of the ? phase is at most 20 ?m, and the ? phase is present within the ? phase.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: September 28, 2021
    Assignee: Mitsubishi Materials Corporation
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
  • Patent number: 11133156
    Abstract: According to the present invention, an electrode plate for a plasma processing apparatus is provided, which includes an air hole through which a gas for plasma generation passes, the electrode plate for a plasma processing apparatus including: a base; and a coating layer provided on at least one front surface of the base, and in which the base is formed of a material having a plasma resistance higher than the plasma resistance of a material forming the coating layer.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: September 28, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Satoshi Nomura, Syuji Fujimori
  • Publication number: 20210298170
    Abstract: A metal base substrate comprising: a metal base; an insulating layer; and a circuit layer, the metal base, the insulating layer and the circuit layer being laminated in an order, wherein the insulating layer includes a resin, a film thickness of the circuit layer is in a range of 10 ?m or more and 1000 ?m or less, and an average grain size, which is expressed by a unit of and a purity, which is expressed by a unit of mass %, satisfy a formula (1) below, average grain size/(100?Purity)>5 (1).
    Type: Application
    Filed: July 17, 2019
    Publication date: September 23, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Fumiaki Ishikawa, Sohei Nonaka