Patents Assigned to Mitsubishi Materials Corporation
  • Patent number: 11512386
    Abstract: A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which is connected to the deposition chamber through a vacuum valve; and a conveying line that conveys the cutting tools from the pre-treatment chamber to the post-treatment chamber going through the deposition chamber, the in-line deposition apparatus using a conveyed carrier on which rods supporting cutting tools are provided in a standing state along a conveying direction. The deposition chamber includes: a deposition region; a conveying apparatus; a heating region; and a carrier-waiting region.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: November 29, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Masao Kawamura, Toshikatsu Sudo, Atsushi Shinboya
  • Patent number: 11512370
    Abstract: This free-cutting copper alloy contains Cu: 58.5 to 63.5%, Si: more than 0.4% and 1.0% or less, Pb: 0.003 to 0.25%, and P: 0.005 to 0.19%, with the remainder being Zn and inevitable impurities, a total amount of Fe, Mn, Co and Cr is less than 0.40%, a total amount of Sn and Al is less than 0.40%, a relationship of 56.3?f1=[Cu]?4.7×[Si]+0.5×[Pb]?0.5×[P]?59.3 is satisfied, constituent phases of a metal structure have relationships of 20?(?)?75, 25?(?)?80, 0?(?)<2, 20?(?)1/2×3+(?)×(?0.5×([Si])2+1.5×[Si])?78, and 33?(?)1/2×3+(?)×(?0.5×([Si])2+1.5×[Si])+([Pb])1/2×33+([P])1/2×14, and a compound including P is present in ? phase.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: November 29, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
  • Publication number: 20220371099
    Abstract: A surface-coated cutting tool comprises a tool substrate comprising a cBN sinter and a hard coating layer including a lower sublayer ? and an upper sublayer ? on the surface of the cutting edge; wherein ? satisfies (Al1-xTix)N (0.40?x?0.60); ? satisfies (Al1-y-zTiyBz)N (0.40?y?0.60 and 0.01?z?0.10); in the sublayer ?, the variation in the concentration of the B component is repeated; the average Bmaxav of the maxima in the concentration of the B component satisfies z<Bmaxav?2.0×z, and the average Bminav of the minima in the concentration of the B component satisfies 0?Bminav<z; and the average thickness t? of ? and the average thickness t? of ? satisfy expression: 2.0?<t?/t??6.0; and the residual stress ? of the overall hard coating layer satisfies ?2.0 GPa????0.5 GPa.
    Type: Application
    Filed: October 20, 2020
    Publication date: November 24, 2022
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventor: Masataka Dobashi
  • Publication number: 20220375819
    Abstract: This copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of aluminum-containing ceramics, the copper member and the ceramic member are bonded to each other, in which, at a bonded interface between the copper member and the ceramic member, an active metal compound layer containing an active metal compound that is a compound of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on a ceramic member side, and in the active metal compound layer Al and Cu are present at a grain boundary of the active metal compound.
    Type: Application
    Filed: October 12, 2020
    Publication date: November 24, 2022
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventor: Nobuyuki Terasaki
  • Patent number: 11505480
    Abstract: A method of treating a waste liquid includes: an aluminum dissolution step of dissolving aluminum in an acidic waste liquid and performing separation into a first treated water and a reduced heavy metal precipitate; a gypsum recovery step of adding a calcium compound to the first treated water at a liquid property of a pH of 4 or less, and performing separation into a second treated water and gypsum; an aluminum and fluorine removal step of adding an alkali to the second treated water and performing separation into a third treated water and a precipitate containing aluminum and fluorine; and a neutralization step of adding an alkali to the third treated water and performing separation into an alkali neutralization treated water and a neutralized precipitate of a heavy metal hydroxide.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: November 22, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Daisuke Haraguchi, Hiroshi Hayashi
  • Publication number: 20220359340
    Abstract: A copper/ceramic bonded body includes: a copper member (12) made of copper or a copper alloy; and a ceramic member (11) made of nitrogen-containing ceramics, the copper member (12) and the ceramic member (11) being bonded to each other, in which a Mg solid solution layer in which Mg is solid-soluted in a Cu matrix is formed at a bonding interface between the copper member (12) and the ceramic member (11), an active metal nitride layer (41) containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on a ceramic member (11) side, and a thickness of the active metal nitride layer (41) is set to be in a range of 0.05 ?m or more and 1.2 ?m or less.
    Type: Application
    Filed: October 28, 2020
    Publication date: November 10, 2022
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventor: Nobuyuki Terasaki
  • Publication number: 20220353989
    Abstract: This copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of nitrogen-containing ceramics, the copper member and the ceramic member are bonded to each other, in which, between the copper member and the ceramic member, an active metal nitride layer containing nitrides of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on a ceramic member side, and a Mg solid solution layer in which Mg is solid-dissolved in a Cu matrix is formed between the active metal nitride layer and the copper member, and Cu-containing particles composed of either one or both of Cu particles and compound particles of Cu and the active metal are dispersed in an interior of the active metal nitride layer.
    Type: Application
    Filed: December 1, 2020
    Publication date: November 3, 2022
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventor: Nobuyuki Terasaki
  • Publication number: 20220349261
    Abstract: A drilling tip includes a tip main body that has a posterior end portion having a columnar or disk shape centered on a tip center line and a distal end portion and is made of a cemented carbide and a hard layer that coats the distal end portion and is made of a polycrystalline diamond sintered body. The distal end portion has a convex portion, and a concave portion. A diameter D of the posterior end portion is 8 mm to 20 mm. A ratio r1/D of a radius r1 of the convex portion is 0.1 to 0.65, and a ratio r2/D of a radius r2 of the concave portion is 0.05 to 3.0. An angle formed by a straight line that connects a tangent point which the convex portion tangents to the concave portion and a center of the convex portion to each other is 20° to 90°.
    Type: Application
    Filed: September 27, 2019
    Publication date: November 3, 2022
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yuichiro TAKEUCHI, Toshihiko MATSUO, Wardoyo AKHMADI EKO
  • Publication number: 20220341000
    Abstract: This copper alloy for electronic or electric devices contains 100 mass ppm or greater and 400 mass ppm or less of Mg, 5 mass ppm or greater and 20 mass ppm or less of Ag, and less than 5 mass ppm of P with a balance being Cu and inevitable impurities, in which when a ratio of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to all grain boundary triple junctions is defined as NFJ3 and a ratio of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary constituting the grain boundary triple junction is a random grain boundary, to all grain boundary triple junctions is defined as NFJ2, an expression of 0.22<(NFJ2/(1?NFJ3))0.5?0.45 is satisfied.
    Type: Application
    Filed: September 11, 2020
    Publication date: October 27, 2022
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka MATSUNAGA, Yuki ITO, Hiroyuki MORI, Hiroyuki MATSUKAWA
  • Patent number: 11479834
    Abstract: This free-cutting copper alloy includes Cu: more than 61.0% and less than 65.0%, Si: more than 1.0% and less than 1.5%, Pb: 0.003% to less than 0.20%, and P: more than 0.003% and less than 0.19%, with the remainder being Zn and unavoidable impurities, a total content of Fe, Mn, Co, and Cr is less than 0.40%, a total content of Sn and Al is less than 0.40%, a relationship of 56.5?f1=[Cu]?4.5×[Si]+0.5×[Pb]?[P]?59.5 is satisfied, constituent phases of a metallographic structure have relationships of 20?(?)?80, 15?(?)?80, 0?(?)<8, 18×(?)/(?)<9, 20?(?)1/2×3+(?)×([Si])1/2?88, and 33?(?)1/2×3+(?)×([Si])1/2+([Pb])1/2×35+([P])1/2×15, and a compound including P is present in ? phase.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: October 25, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
  • Patent number: 11478868
    Abstract: A method for producing a bonded body includes: a laminating step of forming a laminated body in which a first member and a second member are temporarily bonded to each other by providing a temporary bonding material including an organic material on at least one of a bonding surface of the first member and a bonding surface of the second member; and a bonding step of pressurizing and heating the laminated body in a laminating direction and bonding the first member and the second member to each other. In the bonding step, during a temperature increase process of heating the laminated body up to a predetermined bonding temperature, at least a pressurization load P2 at a decomposition temperature TD of the organic material included in the temporary bonding material is lower than a pressurization load P1 at the bonding temperature.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: October 25, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Ryouhei Yumoto, Yoshiyuki Nagatomo, Soutarou Ooi
  • Patent number: 11479490
    Abstract: A method of treating a waste liquid: an aluminum dissolution step of dissolving aluminum in an acidic waste liquid and performing separation into a first treated water and a reduced heavy metal precipitate; a gypsum recovery step of adding a calcium compound to the first treated water at a pH of 4 or less, and performing separation into a second treated water and gypsum; a heavy metal coprecipitation step of adding a ferric compound to the second treated water and performing separation into a third treated water and a heavy metal coprecipitate; an aluminum and fluorine removal step of adding an alkali to the third treated water and performing separation into a fourth treated water and a precipitate containing aluminum and fluorine; and a neutralization step of adding an alkali to the fourth treated water and performing separation into an alkali neutralization treated water and a neutralized heavy metal hydroxide.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: October 25, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Daisuke Haraguchi, Hiroshi Hayashi
  • Publication number: 20220333264
    Abstract: The present invention provides a high-concentration tin sulfonate aqueous solution, in which a divalent tin ion (Sn2+) concentration is 360 g/L to 420 g/L, a tetravalent tin ion (Sn4+) concentration is 10 g/L or less, a free methanesulfonic acid concentration is 40 g/L or less, a Hazen unit color number (APHA) is 240 or less, and a turbidity is 25 FTU or less. This aqueous solution is produced such that stannous oxide powder whose temperature is adjusted to a temperature of 10° C. or lower is added to an aqueous methanesulfonic acid solution having a concentration of 60% by mass to 90% by mass when the aqueous solution circulates in a state of being maintained at the temperature of 10° C. or lower, and the stannous oxide powder is dissolved.
    Type: Application
    Filed: June 29, 2022
    Publication date: October 20, 2022
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koji Tatsumi, Kyohei Mineo, Hirotaka Hirano
  • Patent number: 11476127
    Abstract: A manufacturing method of an electronic-component-mounted module includes a step of forming a laminate of: a ceramic substrate board, a circuit layer made of aluminum or aluminum alloy on the ceramic substrate board, a first silver paste layer between the circuit layer and one surface of an electronic component, the electronic component, a lead frame made of copper or copper alloy, and a second silver paste layer between the other surface of the electronic component and the lead frame; and a step of batch-bonding bonding the circuit layer, the electronic component, and the lead frame at one time by heating the laminate to a heating temperature of not less than 180° C. to 350° C. inclusive with adding a pressure of 1 MPa to 20 MPa inclusive in a laminating direction on the laminate, to sinter the first and second silver paste layers and form first and second silver-sintered bonding layers.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: October 18, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Tomoya Oohiraki, Sotaro Oi
  • Publication number: 20220316028
    Abstract: A copper alloy plate containing in a center part of a plate thickness direction more than 2.0% (% by mass) and 32.5% or less of Zn; 0.1% or more and 0.9% or less of Sn; 0.05% or more and less than 1.0% of Ni; 0.001% or more and less than 0.1% of Fe, and 0.005% or more and 0.1% or less of P; and the balance Cu, including a surface layer part in which a surface Zn concentration in a surface is 60% or less of a center Zn concentration in the center part, having a depth from the surface to where Zn concentration is 90% of the center Zn concentration; and in the surface layer, the Zn concentration increases from the surface toward the center part in the plate thickness direction at a concentration gradient of 10% by mass/?m or more and 1000% by mass/?m or less.
    Type: Application
    Filed: August 5, 2020
    Publication date: October 6, 2022
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenji Morikawa, Naoki Miyashima, Kazunari Maki, Shinichi Funaki
  • Patent number: 11462456
    Abstract: A power-module substrate and a heat sink made of an aluminum-impregnated silicon carbide formed by impregnating aluminum in a porous body made of silicon carbide; where yield strength of a circuit layer is ?1 (MPa), a thickness of the circuit layer is t1 (mm), a bonding area of the circuit layer and a ceramic board is A1 (mm2), yield strength of a metal layer is ?2 (MPa), a thickness of the metal layer is t2 (mm), a bonding area of the metal layer and the ceramic board is A2 (mm2); the thickness t1 is formed to be between 0.1 mm and 3.0 mm (inclusive); the thickness t2 is formed to be between 0.15 mm and 5.0 mm (inclusive); the thickness t2 is formed larger than the thickness t1; and a ratio {(?2×t2×A2)/(?1×t1×A1)} is in a range between 1.5 and 15 (inclusive).
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: October 4, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Ryohei Yumoto, Sotaro Oi
  • Patent number: 11462671
    Abstract: A magnesium-based thermoelectric conversion material made of a sintered compact of a magnesium compound, in which, in a cross section of the sintered compact, a Si-rich metallic phase having a higher Si concentration than in magnesium compound grains is unevenly distributed in a crystal grain boundary between the magnesium compound grains, an area ratio of the Si-rich metallic phase is in a range of 2.5% or more and 10% or less, and a number density of the Si-rich metallic phase having an area of 1 ?m2 or more is in a range of 1,800/mm2 or more and 14,000/mm2 or less.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: October 4, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Yoshinobu Nakada
  • Patent number: 11453953
    Abstract: The present invention provides a high-purity electrolytic copper 10 having a Cu purity excluding gas components (O, F, S, C, and Cl) is 99.9999 mass % or more, a content of S is 0.1 mass ppm or less, and an area ratio of crystals having a (101)±10° orientation is less than 40%, when crystal orientation is measured by electron backscatter diffraction in a cross section along a thickness direction.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: September 27, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshie Tarutani, Kenji Kubota, Kiyotaka Nakaya, Isao Arai
  • Patent number: 11450452
    Abstract: There is provided an insulated flat rectangular conductor including: a flat rectangular conductor; and an insulating film coating the flat rectangular conductor, in which the flat rectangular conductor has a first surface and a second surface opposite to the first surface, and the first surface is rougher than the second surface.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: September 20, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Makoto Urushihara, Hideaki Sakurai
  • Publication number: 20220294140
    Abstract: Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 ?m to 20 ?m inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.
    Type: Application
    Filed: August 3, 2020
    Publication date: September 15, 2022
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshie Tarutani, Kenji Kubota