Patents Assigned to Mitsubishi Materials Corporation
  • Patent number: 10384826
    Abstract: A packing box including lattice members which are arranged in a stacked state into stages, a stage-partition plate which is arranged between the stages of the lattice members, two or more inner tubular-trunk frames which are provided in a stacking direction of the lattice members to surround one or more stages of the lattice members, an outer tubular-trunk frame surrounding an outside of two or more stages of the inner tubular-trunk frames, a bottom lid which is arranged under the outer tubular-trunk frame, and a top lid which is arranged on the outer tubular-trunk frame.
    Type: Grant
    Filed: July 9, 2016
    Date of Patent: August 20, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Tetsuya Atsumi
  • Patent number: 10384269
    Abstract: In a surface-coated cutting tool in which a hard coating layer having a total layer thickness of 0.5 to 10 ?m is deposited on a surface of a tool body made of WC-based cemented carbide or TiCN-based cermet, the hard coating layer has an alternately laminated structure of A layers and B layers, in a case where the A layer is: (AlaTi1-a)N (here, a is in atomic ratio), the A layer satisfies 0.50?a<0.75, in a case where the B layer is: (AlbTi1-b)N (here, b is in atomic ratio), the B layer satisfies 0.75?b?0.95, and when a layer thickness per layer of the A layers is represented by x (nm) and a layer thickness per layer of the B layers is represented by y (nm), 5y?x?3y and 250 (nm)?x+y?100 (nm) are satisfied.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: August 20, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Hidetoshi Asanuma
  • Patent number: 10376974
    Abstract: This sectional hob is provided with: a cylindrical hob body; a plate-shaped blade having a saw-toothed cutting edge, the blade being disposed in at least one attachment seat formed in an outer peripheral part of the hob body such that a direction of the cutting edge is parallel to a center axis direction of the hob body; and a plurality of wedge members configured to detachably-fix the blade disposed in the attachment seat to the hob body, the wedge members being installed in a recess formed on the outer peripheral part of the hob body, wherein the recess is adjacent to the attachment seat in a circumferential direction of the hob body, and the plurality of the wedge members are disposed in a line in the center axis direction in the recess.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: August 13, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Masanori Morikawa, Kousei Torii
  • Patent number: 10369605
    Abstract: A rolling mill roll according to the present invention includes: a shaft member which rotates around an axial line; a rolling ring which is fitted to an outer circumferential surface of the shaft member; a support portion which is provided on the outer circumferential surface of the shaft member; an interposed ring which is fitted to the outer circumferential surface of the shaft member and is provided on the other side of the rolling ring in the axial line direction; a pressing nut which is screwed onto the outer circumferential surface of the shaft member and is disposed to be adjacent to the other side of the interposed ring; a screw hole which is formed to penetrate the pressing nut in the axial line direction; and a screw shaft which is screwed into the screw hole and which is capable of pressing the interposed ring toward the one side in the axial line direction.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: August 6, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Mitsuhiro Takatsuki, Hiroyuki Tanaka, Hiromasa Arimura, Tadamasa Miyagawa, Tsukasa Umeta
  • Patent number: 10375825
    Abstract: This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic substrate 11; and an Ag—Cu eutectic structure layer 32 having a thickness of 15 ?m or less that is formed between the nitride layer and the copper plate.
    Type: Grant
    Filed: October 10, 2016
    Date of Patent: August 6, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nobuyuki Terasaki, Yoshiyuki Nagatomo, Kimihito Nishikawa, Yoshirou Kuromitsu
  • Patent number: 10370303
    Abstract: Disclosed is provided a process for producing a bonded body by bonding a ceramic member made of a ceramic to a Cu member made of Cu or a Cu alloy, the process including: a laminating step of laminating the Cu member on a first surface side of the ceramic member via a brazing material containing Cu and a eutectic element which has a eutectic reaction with Cu, and via an active metal; and a heating step of heating the ceramic member and the Cu member which are laminated together.
    Type: Grant
    Filed: April 16, 2015
    Date of Patent: August 6, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nobuyuki Terasaki, Yoshiyuki Nagatomo
  • Publication number: 20190232381
    Abstract: A surface-coated cutting tool comprises a hard coating layer that includes a TiAlN layer and is provided on a surface of a cutting tool body. In case the composition of the TiAlN layer is expressed by a formula: (TixAl1-x)N, 0.10?x?0.35 (here, x is in atomic ratio) is satisfied. In the TiAlN layer, a high Ti band-like region is present in a direction at 30 degrees or less with respect to a line normal to the surface of the cutting tool body. An average composition X of the Ti component in the high Ti band-like region satisfies (x+0.01)?X?(x+0.05), an average width W of the high Ti band-like region is 30 to 500 nm, and an average area ratio St of the high Ti band-like region is 3 to 50 area %.
    Type: Application
    Filed: September 11, 2017
    Publication date: August 1, 2019
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shun SATO, Tsuyoshi OGAMI, Kenji YAMAGUCHI
  • Patent number: 10364360
    Abstract: A surface coating material is provided for forming a hydrophilic oil repellent layer on at least a part of the surface of a substrate, and the surface coating material includes one or more fluorine-based compounds represented by the following formulas (1) to (4), a binder, and a solvent.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: July 30, 2019
    Assignees: Mitsubishi Materials Corporation, Mitsubishi Materials Electronic Chemicals Co., Ltd.
    Inventors: Masakazu Uotani, Hiroshi Koshiyama, Takeshi Kamiya, Tsunetoshi Honda, Kosei Sato, Masato Fujita, Daisuke Takano
  • Patent number: 10358730
    Abstract: The additive for high-purity copper electrolytic refining of the present invention is an additive which is added to a copper electrolyte in electrolytic refining for high-purity copper and is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group, in which a dispersion term dD of the Hansen solubility parameters satisfies 10?dD?20, a polarity term dP of the Hansen solubility parameters satisfies 6?dP?9, and a hydrogen bonding term dH of the Hansen solubility parameters satisfies 9?dH?11.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: July 23, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshie Tarutani, Kenji Kubota, Kiyotaka Nakaya
  • Patent number: 10358712
    Abstract: This surface-coated cutting tool includes a cutting tool body made of tungsten carbide-based cemented carbide and a hard coating layer deposited on a surface of the cutting tool body, in which the hard coating layer has at least one (Ti1-xAlx)N layer (0.4?X?0.7, X is an atomic ratio) with an average layer thickness of 0.5 to 10 ?m, the (Ti, Al)N layer has a cubic crystal structure, and Ia?Ib<5 is satisfied when Ia (%) is an average absorptance of the hard coating layer at a wavelength of 400 to 500 nm and Ib (%) is an average absorptance of the hard coating layer at a wavelength of 600 to 700 nm.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: July 23, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Takashi Kimura, Masakuni Takahashi, Kazuaki Senbokuya, Tatsuo Hashimoto
  • Patent number: 10351438
    Abstract: A stannous oxide powder which has a high dissolution rate into various acid solutions such as a plating solution and is particularly suitable as a Sn supply material to a plating solution, and a method for producing the stannous oxide powder are provided. The stannous oxide powder is a particle body having a plurality of plate-like protrusions protruding outward, and has an average particle size in a range of 1 ?m to 15 ?m.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: July 16, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka Hirano, Takuma Katase
  • Patent number: 10351946
    Abstract: Provided are a sputtering target composed of a Cu—Ga sintered compact that has a further reduced oxygen content and can suppress abnormal discharges, and a method for producing the same. The sintered compact has a component composition containing a Ga content of 20 at % or higher and less than 30 at % with the balance being Cu and inevitable impurities, and has an oxygen content of 100 ppm or lower and an average grain size of 100 ?m or less, and exhibits the diffraction peaks assigned to the ? and ? phases of CuGa as observed in X-ray diffraction, wherein the main peak intensity of the diffraction peaks assigned to the ? phase is 10% or higher relative to that of the diffraction peaks assigned to the ? phase.
    Type: Grant
    Filed: October 7, 2013
    Date of Patent: July 16, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kazunori Igarashi, Muneaki Watanabe, Yuuki Yoshida, Kouichi Ishiyama, Satoru Mori
  • Patent number: 10352771
    Abstract: Provided are an infrared sensor and an infrared sensor device that are less susceptible to effects from the casing and lead wires, can be surface-mounted, and can measure the temperature of the object to be measured in a more accurate manner. This invention has: an insulating film; a first and a second heat sensitive element provided on the insulating film; a first and a second wiring film that are respectively connected to the heat sensitive elements; an infrared reflecting film; a terminal support body, arranged on the one face; and a plurality of mounting terminals provided to the terminal support body, wherein the mounting terminals have support convex parts protruding upward, the support convex parts are connected to the corresponding first and second wiring films, and the insulating film is supported such that a gap is provided between the terminal support body and the insulating film.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: July 16, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kazuyoshi Tari, Mototaka Ishikawa, Keiji Shirata, Kenzo Nakamura
  • Patent number: 10352104
    Abstract: A drill bit button insert is attached to a button inserts mounted in a drill bit and performs a drilling. The drill bit button insert includes a tip body and an abrasive layer that is formed of a diamond sintered body harder than the tip body and is coated at least at the button insert working surface of the tip body. The abrasive layer has two or more high hardness layers and a low hardness layer having a hardness lower than that of the high hardness layers disposed between the high hardness layers. The high hardness layers and the low hardness layer are provided from the surface side of the abrasive layer toward the tip body side.
    Type: Grant
    Filed: November 26, 2015
    Date of Patent: July 16, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Wardoyo Akhmadi Eko, Toshihiko Matsuo, Chihiro Sakurazawa
  • Publication number: 20190193165
    Abstract: A multilayer hard film-coated cutting tool including a cutting tool body and a multilayer hard film formed on a surface of the cutting tool body, wherein the multilayer hard film comprises at least an upper layer and a lower layer; the upper layer is made of a Ti and Si compound layer; the lower layer is made of a multi-layered film of an A-layer and a B-layer, a layer thickness of the B-layer is equal to or thicker than a layer thickness of the A-layer, a ratio of the layer thicknesses of the A-layer and the B-layer being A-layer:B-layer=1:1 to 1:2, the multilayer hard films having 2 to 8 pairs of the A-layer and the B-layer in a case where a single pair is defined by a combination of a single A-layer and a single B-layer.
    Type: Application
    Filed: July 28, 2017
    Publication date: June 27, 2019
    Applicants: MITSUBISHI MATERIALS CORPORATION, Oerlikon Surface Solutions AG, Pfaffikon
    Inventors: Masakuni TAKAHASHI, Denis KURAPOV, Volker DERFLINGER, Wolfgang KALSS
  • Patent number: 10330572
    Abstract: According to the sampling method of the aspect of the present invention, the coordinate (location information) of the sampling location on the sampling specimen is generated randomly by the controller, such as a personal computer, of the sampling location display. Based on the location information, the sampling location is displayed on the sampling specimen, which is a part of the recycled raw material, by laser light. Because of this, arbitrariness, in which the operator artificially selects the sampling location, during incremental sampling for setting the average quality of the sampling specimen, such as the average content of valuable metal, can be excluded reliably.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: June 25, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Akira Nitta, Michiaki Onishi, Kenichi Tomioka, Tomohiro Tsutsui, Makoto Takagi
  • Patent number: 10329680
    Abstract: A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing sulfonium salt with one or more of aromatic rings is provided.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: June 25, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kiyotaka Nakaya, Mami Watanabe
  • Patent number: 10332649
    Abstract: A conductive paste includes: a silver-coated resin; and an organic vehicle that includes a thermosetting resin composition, a curing agent, and a solvent, in which the thermosetting resin composition is an epoxy resin composition which is solid at room temperature and has a melt viscosity of 0.5 Pa·s or lower at 150° C., and a mass ratio of a content of the thermosetting resin composition to a content of the silver-coated resin is 10 to 40:60 to 90.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: June 25, 2019
    Assignees: MITSUBISHI MATERIALS CORPORATION, MITSUBISHI MATERIALS ELECTRONIC CHEMICALS CO., LTD.
    Inventors: Satoko Higano, Kazuhiko Yamasaki, Kensuke Kageyama, Hirokazu Tsukada
  • Patent number: 10329671
    Abstract: The hard coating layer includes at least a complex nitride or complex carbonitride layer expressed by the composition formula (Ti1-xAlx)(CyN1-y). The average Al content ratio xavg the average C content ratio yavg satisfy 0.60?xavg?0.95 and 0?yavg?0.005, respectively, each of the xavg and yavg is in atomic ratio. The crystal grains constituting the complex nitride or complex carbonitride layer include a crystal grain having the cubic structure. Predetermined average crystal grain misorientation and inclined angle distribution exist in the crystal grains having the cubic structure.
    Type: Grant
    Filed: May 28, 2015
    Date of Patent: June 25, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Sho Tatsuoka, Kenji Yamaguchi
  • Patent number: 10319664
    Abstract: A bonded body is provided in which an aluminum alloy member formed from an aluminum alloy, and a metal member formed from copper, nickel, or silver are bonded to each other. The aluminum alloy member is constituted by an aluminum alloy in which a concentration of Si is in a range of 1 mass % to 25 mass %. The aluminum alloy member and the metal member are subjected to solid-phase diffusion bonding. A compound layer, which is formed through diffusion of Al of the aluminum alloy member and a metal element of the metal member, is provided at a bonding interface between the aluminum alloy member and the metal member. A Mg-concentrated layer, in which a concentration of Mg is to 3 mass % or greater, is formed at the inside of the compound layer, and the thickness of the Mg-concentrated layer is in a range of 1 ?m to 30 ?m.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: June 11, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nobuyuki Terasaki, Yoshiyuki Nagatomo