Patents Assigned to Mitsubishi Materials Corporation
  • Patent number: 10493540
    Abstract: A minor cutting edge has a first minor cutting edge and a second minor cutting edge that extends inward of the insert in a direction of an insert short side face axial line, as the second minor cutting edge extends from the first minor cutting edge in a direction of an insert major face axial line. A flank face of the second minor cutting edge is inclined outward of the insert in the direction of the insert short side face axial line, as the flank face extends from the second minor cutting edge in the direction of an insert long side face axial line, and is inclined outward of the insert in the direction of the insert short side face axial line, as the flank face extends from a major face adjacent to the flank face in the direction of the insert major face axial line.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: December 3, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Jun Kitajima, Toshimitsu Furuki, Shigeru Ishimori, Kiichi Yamazaki, Takayuki Hagiwara
  • Patent number: 10493528
    Abstract: A porous copper body including a skeleton having a three-dimensional network structure is provided. An oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton, and the oxygen concentration of the entirety of the skeleton is set to be 0.025 mass % or less.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: December 3, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koichi Kita, Jun Kato, Toshihiko Saiwai
  • Patent number: 10497637
    Abstract: A bonded body is provided that is formed by bonding a metal member formed from copper, nickel, or silver, and an aluminum alloy member formed from an aluminum alloy of which a solidus temperature is lower than a eutectic temperature of aluminum and a metal element that constitutes the metal member. The aluminum alloy member and the metal member are subjected to solid-phase diffusion bonding. A chill layer, in which a Si phase of which an aspect ratio of a crystal grain is 2.5 or less and a crystal grain diameter is 15 ?m or less is dispersed, is formed on a bonding interface side with the metal member in the aluminum alloy member. The thickness of the chill layer is set to 50 ?m or greater.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: December 3, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nobuyuki Terasaki, Yoshiyuki Nagatomo
  • Patent number: 10497585
    Abstract: A bonded body is provided that is formed by bonding a metal member formed from copper, nickel, or silver, and an aluminum alloy member formed from an aluminum alloy of which a solidus temperature is lower than a eutectic temperature of aluminum and a metal element that constitutes the metal member. The aluminum alloy member and the metal member are subjected to solid-phase diffusion bonding. A chill layer, in which a Si phase of which an aspect ratio of a crystal grain is 2.5 or less and a crystal grain diameter is 15 ?m or less is dispersed, is formed on a bonding interface side with the metal member in the aluminum alloy member. The thickness of the chill layer is set to 50 ?m or greater.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: December 3, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Nobuyuki Terasaki, Yoshiyuki Nagatomo
  • Publication number: 20190360528
    Abstract: In order to supply sufficient amount of oil to one or more sliding surfaces and to prevent the supplied oil from moving from the sliding surface(s) to an inside so as to achieve lower friction and improve sliding performance of a bearing, in an oil-impregnated sintered bearing 1, sliding surfaces 3 supporting an outer circumferential surface of a shaft 11 and an oil supply surface 4 in which a diameter is larger than that of the sliding surfaces 3 are formed on an inner circumferential surface of a bearing hole 2 into which the shaft 11 is inserted, to be adjacent in an axial direction of the bearing hole 2, a height gap “d1” between the sliding surfaces 3 and the oil supply surface 4 is not less than 0.
    Type: Application
    Filed: December 20, 2017
    Publication date: November 28, 2019
    Applicants: MITSUBISHI MATERIALS CORPORATION, DIAMET CORPORATION
    Inventors: Hajime Kouno, Yoshinari Ishii, Tsuneo Maruyama, Jyun Katou, Kenji Orito
  • Publication number: 20190358711
    Abstract: A surface-coated cutting tool including at least a TiAlCN layer, in which the layer is expressed by a composition formula: (Ti1-XAlX)(CYN1-Y), an average content ratio X of Al and an average content ratio Y of C (here, X and Y are atomic ratios) satisfy 0.60?X?0.95 and 0?Y?0.005, respectively, an average content ratio Z of Cl in the total amount of atoms configuring the TiAlCN phase (here, Z is an atomic ratio) satisfies 0.0001?Z?0.004, plane spacings d(111) and d(200) are respectively calculated from X-ray diffraction spectra of (111) plane and (200) plane of crystal grains having a NaCl type face-centered cubic structure in the TiAlCN layer measured by using an X-ray diffraction device, and an absolute value ?A=|A(111)?A(200)| defined as A(111)=31/2d(111) and A(200)=2d(200) satisfies 0.007 ???A?0.05.
    Type: Application
    Filed: January 17, 2018
    Publication date: November 28, 2019
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Takuya ISHIGAKI, Sho TATSUOKA, Kenichi SATO, Kousuke YANAGISAWA, Shin NISHIDA
  • Patent number: 10488272
    Abstract: A temperature sensor having excellent humidity resistance and responsivity is provided. The temperature sensor according to the present invention includes an insulating substrate 2; a thin film thermistor portion 3 made of a thermistor material formed on either surface of the insulating substrate; and an opposed electrode pair 5 consisting of a pair of opposed electrodes 4 formed so as to be opposed to each other on at least either one of the top and bottom surfaces of the thin film thermistor portion, wherein a plurality of the opposed electrode pairs are provided and connected to one another in series. As a result, a voltage applied to a unit thermistor composed of one opposed electrode pair becomes 1/n fold, which can suppress the electrode corrosion due to humidity load.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: November 26, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Gakuji Uozumi, Noriaki Nagatomo
  • Patent number: 10478896
    Abstract: A porous copper body including a skeleton having a three-dimensional network structure is provided. An oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton, and the average crystal grain size of an entirety including the skeleton and the oxidation-reduction layer is 5% or more of the diameter of the skeleton.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: November 19, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koichi Kita, Jun Kato, Toshihiko Saiwai
  • Patent number: 10478895
    Abstract: A high-quality porous aluminum sintered compact, which can be produced efficiently at a low cost; has an excellent dimensional accuracy with a low shrinkage ratio during sintering; and has sufficient strength, and a method of producing the porous aluminum sintered compact are provided. The porous aluminum sintered compact is the porous aluminum sintered compact that includes aluminum substrates sintered each other. The junction, in which the aluminum substrates are bonded each other, includes the Ti—Al compound and the eutectic element compound capable of eutectic reaction with Al. It is preferable that the pillar-shaped protrusions projecting toward the outside are formed on outer surfaces of the aluminum substrates, and the pillar-shaped protrusions include the junction.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: November 19, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Ji-Bin Yang, Koichi Kita, Toshihiko Saiwai, Koji Hoshino, Jun Katoh
  • Patent number: 10471522
    Abstract: A drill has a thinning rake face formed in the front end. An intersection ridgeline between the thinning rake face and the tip flank face is the thinning edge. On the opposite side of the rotation direction, the first and second thinning wall surfaces (6b, 6c) and are formed. Viewed from the front, an intersection angle between the thinning edge (4a) and the first thinning ridgeline is larger than 95°. The second thinning ridgeline (L2) is bent to the opposite side of the rotation direction. The thinning edge and the first thinning ridgeline are connected via a concave curve line. The first and second thinning wall surfaces are connected via a concave surface, and a curvature radius of the concave curve line is smaller than a curvature radius of the concave surface.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: November 12, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Tadashi Yamamoto, Kazuya Yanagida, Yuya Tsurumaki
  • Publication number: 20190338396
    Abstract: This stabilizer material for superconductor includes a copper material, wherein the copper material contains one kind or two kinds or more of additive elements selected from Ca, La, and Ce for a total amount of 3 ppm by mass or more and 400 ppm by mass or less, with the remainder being Cu and unavoidable impurities, and the total concentration of the unavoidable impurities other than O, H, C, N, and S, which are gas components, is 5 ppm by mass or more and 100 ppm by mass or less, and compounds including one kind or two kinds or more selected from CaS, CaSO4, LaS, La2SO2, CeS, and Ce2SO2 are present in the matrix.
    Type: Application
    Filed: April 3, 2017
    Publication date: November 7, 2019
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kosei FUKUOKA, Yuki ITO, Kazunari MAKI
  • Publication number: 20190338433
    Abstract: The SnAg alloy plating solution of the invention is a SnAg alloy plating solution including a water-soluble tin compound, a water-soluble silver compound, and a particular sulfide compound in an amount in the range of 0.25 mol or more and 10 mol or less with respect to 1 mol of silver in the water-soluble silver compound.
    Type: Application
    Filed: December 21, 2016
    Publication date: November 7, 2019
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koji Tatsumi, Tsukasa Yasoshima, Takuma Katase
  • Patent number: 10465448
    Abstract: In a drill bit insert of the present invention, an insert body of the drill bit insert includes: a rear end portion forming a columnar shape or a disk-like shape; an intermediate portion having an outer diameter smaller than that of the rear end portion; and an end portion having an outer diameter from the center line of the insert gradually decreasing toward the tip side, the hard surface layer is coated on the insert body from a surface of the end portion of the insert body to an outer periphery of the intermediate portion, and an outer diameter of the hard surface layer on the intermediate portion is equal to that of the rear end portion.
    Type: Grant
    Filed: January 14, 2016
    Date of Patent: November 5, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Wardoyo Akhmadi Eko, Toshihiko Matsuo, Chihiro Sakurazawa
  • Patent number: 10465080
    Abstract: A water-based electrodeposition dispersion for forming an insulating film includes: polymer particles; an organic solvent; a basic compound; and water, wherein the polymer particles include polyamic acid having a predetermined structural unit, and a volume-based median diameter (D50) of the polymer particles is 0.08 ?m to 0.7 ?m.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: November 5, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Jyunko Isomura, Hideaki Sakurai
  • Patent number: 10468577
    Abstract: A method for manufacturing a magnesium-based thermoelectric conversion material of the present invention includes a raw material-forming step of forming a raw material for sintering by adding silicon oxide in an amount within a range equal to or greater than 0.5 mol % and equal to or smaller than 13.0 mol % to a magnesium-based compound, and a sintering step of heating the raw material for sintering at a temperature within a range equal to or higher than 750° C. and equal to or lower than 950° C. while applying pressure equal to or higher than 10 MPa to the raw material for sintering so as to form a sintered substance.
    Type: Grant
    Filed: February 22, 2017
    Date of Patent: November 5, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Yoshinobu Nakada
  • Patent number: 10458003
    Abstract: Copper alloys according to first to third aspects contain Mg at a content of 3.3% by atom to 6.9% by atom, with the balance substantially being Cu and unavoidable impurities, wherein an oxygen content is in a range of 500 ppm by atom or less, and either one or both of the following conditions (a) and (b) are satisfied: (a) when a Mg content is set to X % by atom, an electrical conductivity ? (% IACS) satisfies the following Expression (1), ??{1.7241/(?0.0347×X2+0.6569×X+1.7)}×100??(1); and (b) an average number of intermetallic compounds, which have grain sizes of 0.1 ?m or more and contain Cu and Mg as main components, is in a range of 1 piece/?m2 or less. A copper alloy according to a fourth aspect further contains one or more selected from a group consisting of Al, Ni, Si, Mn, Li, Ti, Fe, Co, Cr, and Zr at a total content of 0.01% by atom to 3.0% by atom, and satisfies the condition (b).
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: October 29, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kazunari Maki, Yuki Ito
  • Patent number: 10456842
    Abstract: A surface-coated cutting tool has a hard coating layer on a tool body. The hard coating layer includes a (Ti1?xAlx)(CyN1?y) layer (the average amount Xavg of Al and the average amount Yavg of C satisfy 0.60?Xavg?0.95 and 0?Yavg?0.005). Crystal grains having an NaCl type face-centered cubic structure in the layer have {111} orientation, a columnar structure in which the average grain width of the individual crystal grains having an NaCl type face-centered cubic structure is 0.1 ?m to 2.0 ?m and the average aspect ratio is 2 to 10 is included, and in the individual crystal grains having an NaCl type face-centered cubic structure, a periodic compositional variation in Ti and Al in the composition formula: (Ti1?xAlx)(CyN1?y) is present and the difference between the average of maximum values of x and the average of minimum values thereof is 0.03 to 0.25.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: October 29, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Sho Tatsuoka, Kenichi Sato, Kenji Yamaguchi
  • Patent number: 10456841
    Abstract: A coated tool includes a hard coating layer that is formed with a (Ti,Al)(C,N) layer on its surface, the layer including an upper layer where a periodic compositional variation in Ti and Al is present in crystal grains having an NaCl type face-centered cubic structure, and a lower layer where a periodic compositional variation in Ti and Al is not present. The upper layer has a high Al amount, while the lower layer has a low Al amount. A value of I(200)/I(111) of the upper layer is greater than 10 and that of the lower layer is less than 3. The lower layer has a composition inclined structure where the Al amount increases from a tool body side towards an upper layer side. The lower layer contains multiple layers, where the Al amount of each layer can increase from the tool body side towards the upper layer side.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: October 29, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenichi Sato, Sho Tatsuoka, Kenji Yamaguchi
  • Patent number: 10457561
    Abstract: A liquid composition for forming a silica porous film of the invention is prepared by mixing a hydrolyzate of tetramethoxysilane or tetraethoxysilane as a silicon alkoxide with a silica sol in which fumed silica particles having primary particles having a mean particle diameter of 40 nm or less and secondary particles having a mean particle diameter of 20 nm to 400 nm, that is greater than the mean particle diameter of the primary particles, are dispersed in a liquid medium, in which the mass ratio (A/B) of the SiO2 content (B) of the silica sol to the SiO2 content (A) in the hydrolyzate is in a range of 1/99 to 60/40.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: October 29, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koutaro Masuyama, Satoko Higano, Kazuhiko Yamasaki
  • Patent number: 10456844
    Abstract: In a surface-coated cutting tool, a hard coating layer composed of a lower layer and an upper layer is deposited on a surface of a tool body made of a WC-based cemented carbide or a TiCN-based cermet. The lower layer has at least one Ti compound layer made of a TiCN layer and the upper layer is made of an ?-type Al2O3 layer. In a case where, regarding Al2O3 crystal grains of the entire upper layer, a constituent atom-sharing lattice point distribution is measured, a highest peak is present in ?3, and a distribution ratio of ?3 is 70% or more. A ratio of a ?3-coincidence grain boundary continuing from an interface between the lower layer and the upper layer to an outermost surface of the upper layer is 60% or more of a ?3-coincidence grain boundary of the upper layer.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: October 29, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Masaki Okude, Kenji Yamaguchi