Abstract: Free-cutting copper alloy comprises Cu: more than 59.7% but less than 64.7%, Si: more than 0.60% but less than 1.30%, Pb: more than 0.001% but less than 0.20%, Bi: more than 0.001% but less than 0.10 mass %, and P: more than 0.001% but less than 0.15%, with remainder being Zn and unavoidable impurities, wherein total amount of Fe, Mn, Co, and Cr is less than 0.45%, the total amount of Sn and Al is less than 0.45%, 56.7?Cu?4.7×Si+0.5×Pb+0.5×Bi?0.5×P?59.7 and 0.003?Pb+Bi<0.25 are satisfied, 0.02?Bi/(Pb+Bi)?0.98 is satisfied if 0.003?Pb+Bi<0.08, 0.01?Bi/(Pb+Bi)?0.40 or 0.85?Bi/(Pb+Bi)?0.98 is satisfied if 0.08?Pb+Bi<0.13.

Abstract: A turning tool includes a tool body extending along a tool axis and having a base on a tip of the tool body, a cutting insert detachably attached to the base, and a measurement device attached to the tool body. The measurement device has a first distance sensor which measures a distance to an object located radially outward of the tool axis.

Abstract: Tungsten trioxide is appropriately disposed on the surface of carbon. A negative-electrode material is a negative-electrode material for a battery and contains amorphous carbon and tungsten trioxide provided on the surface of the amorphous carbon.

Abstract: There is provided a method for producing a carbon material, including a carbon generation step of causing carbon dioxide to react with a reducing agent to generate carbon, in which, as the reducing agent, an oxygen-deficient iron oxide represented by Fe3O4-? (where ? is 1 or more and less than 4), which is obtained by reducing magnetite while maintaining a crystal structure, or an oxygen-completely deficient iron (?=4) which is obtained by completely reducing magnetite is used.

Abstract: A copper alloy plate containing in a center part of a plate thickness direction more than 2.0% (% by mass) and 32.5% or less of Zn; 0.1% or more and 0.9% or less of Sn; 0.05% or more and less than 1.0% of Ni; 0.001% or more and less than 0.1% of Fe, and 0.005% or more and 0.1% or less of P; and the balance Cu, including a surface layer part in which a surface Zn concentration in a surface is 60% or less of a center Zn concentration in the center part, having a depth from the surface to where Zn concentration is 90% of the center Zn concentration; and in the surface layer, the Zn concentration increases from the surface toward the center part in the plate thickness direction at a concentration gradient of 10% by mass/?m or more and 1000% by mass/?m or less.

Abstract: A method of recovering cobalt and nickel includes the steps of: adding alkaline to an acidic solution containing aluminum together with cobalt and nickel, adjusting pH of the acidic solution to 5 to 7, and converting the cobalt, the nickel and the aluminum into hydroxides thereof; recovering the hydroxides by solid-liquid separation, mixing the recovered hydroxides with an alkaline solution, and leaching aluminum contained in the hydroxides under a liquid condition of pH 8 or more; and recovering a cobalt hydroxide and a nickel hydroxide that aluminum is separated therefrom by solid-separation on a leachate.

Abstract: There is provided a method for recovering lead from copper smelting dust according to the present invention includes an alkali leaching step of leaching lead contained in copper smelting dust with an alkali solution, a step of performing a solid liquid separation on a post-leaching solution and a leaching residue after the alkali leaching step, a neutralization step of adding an acid to the separated post-leaching solution to precipitate a lead, and a step of recovering a precipitate containing the lead by performing a solid liquid separation.

Abstract: Providing a copper alloy plate, in which center Mg concentration at a center part in a plate thickness direction 0.1 mass % or more and less than 0.3 mass %, center P concentration is 0.001 mass % or more and 0.2 mass % or less, and the balance is composed of Cu and inevitable impurities; in which surface Mg concentration at a surface is 70% or less of the center Mg concentration; in which a surface layer part defined by a prescribed thickness from the surface has a concentration gradient of Mg of 0.05 mass %/?m or more and 5 mass %/?m or less increasing from surface toward center part of the plate thickness direction; and in which restraint of color change of the surface and increase of electrical contact resistance, and adhesiveness of a plating film are excellent due to maximum Mg concentration in the surface layer part is 90% of the center Mg concentration.

Abstract: Provided is a clamping tool for attaching a cutting insert to a holder or detaching a cutting insert from a holder, the cutting insert including a head portion having a circular cutting edge and a shaft portion, the clamping tool including: a first jaw portion configured to be locked to the holder; and an operation lever configured to be connected to the first jaw portion, in which the first jaw portion has a locking portion configured to be locked to the holder, and a first pressing portion configured to push the head portion downward and fit the shaft portion into a shaft hole portion of the holder when the operation lever is rotationally moved in a first direction using the locking portion as a fulcrum.

Abstract: The electrodeposition dispersion of the present invention is an electrodeposition dispersion for electrodepositing an electrodeposited film on a conductive base material, the solution including water, a dispersion medium, and a solid component, in which the solid component includes a polyimide-based resin and a fluorine-based resin, the fluorine-based resin content included in the solid component is in a range of 72 mass % or more and 95 mass % or less, an average particle diameter of the solid component dispersed in the water and the dispersion medium is 50 nm or more and 500 nm or less, and a standard deviation of the particle diameter of the solid component is 250 nm or less.

Abstract: A tin alloy plating solution of the present invention includes (A) a soluble salt or oxide including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) a tin complexing agent formed of a sugar alcohol having 4 or more and 6 or less carbon atoms, (D) a free acid, and (E) an antioxidant. In addition, a content of the tin complexing agent is 0.1 g/L or more and 5 g/L or less, and a concentration of divalent tin ions (Sn2+) is 30 g/L or more.

Abstract: Forming aluminum circuit layers forming an aluminum circuit layers on one surface of a ceramic substrate and forming copper circuit layers are included. The copper circuit layers are formed by laminating copper boards for the circuit layers on the respective aluminum circuit layers, arranging the laminate between a pair of support boards having a convex curved surface at least on one surface so as to face to each other, moving the support boards in a facing direction to press the laminate in a lamination direction, and heating in this pressing state so that the copper boards for the circuit layers are bonded on the aluminum circuit layers respectively by solid phase diffusion. In the step of forming the copper circuit layers, the support boards are arranged so that either one of the convex curved surface is in contact with the adjacent copper boards for the circuit layers in the laminate.

Abstract: A terminal material having a base material in which at least a surface is made of Cu or Cu alloy; an Ni layer with at thickness of 0.1 ?m to 1.0 ?m inclusive on the base material; a Cu—Sn intermetallic compound layer with a thickness of 0.2 ?m to 2.5 ?m inclusive on the Ni layer; and an Sn layer with a thickness of 0.5 ?m to 3.0 ?m inclusive on the Cu—Sn intermetallic compound layer, when cross sections of the Cu—Sn intermetallic compound layer and the Sn layer are analyzed by the EBSD method with a measuring step 0.1 ?m and a boundary in which misorientation between adjacent pixels is 2° or more is deemed to be a crystal boundary, an average crystal grain size Dc of the Cu—Sn intermetallic compound layer is 0.5 ?m or more, and a grain size ratio Ds/Dc is five or less.

Abstract: Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 ?m to 20 ?m inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.

Abstract: A surface-coated cutting tool includes a coating layer having a laminated structure that includes first sublayers and second sublayers having a cubic crystal structure and has an average thickness of 0.5 to 8 ?m, the bottommost and topmost sublayers being both first sublayers; the first sublayer has an average thickness of 0.1 to 2 ?m and a composition (Al1?xCrx)N, where x=0.20 to the second sublayer has an average thickness of 0.1 to 2 ?m, has a composition (Al1-a-bCraSib)N where a=0.20 to 0.60, b=0.01 to 0.20, and has a repeated variation in Si content with an average interval of 1 to 100 nm between local minima and local maxima, the average local maximum and minimum are each within a specific range; and the diffraction peaks of the 111 and 200 diffraction peaks each have a predetermined full width at half maximum and a peak intensity.

Abstract: A resin molded body according to the present invention is a resin molded body to be provided on an outer periphery of one or more lithium-ion secondary battery cells including a safety valve or an exhaust hole such that at least the safety valve or the exhaust hole is covered, in which a thermal conductivity (measurement temperature: 50° C.) of the resin molded body measured by a steady state comparative-longitudinal heat flow method based on JIS H7903:2008 is less than 1.0 W/m·K, a thickness of a part of the resin molded body, the part covering the safety valve or the exhaust hole, is 0.5 mm or more and 10.0 mm or less, and a hardness of a surface of the resin molded body measured by Type D durometer based on JIS K7215 is 50 or more and 90 or less.

Abstract: This aluminum powder mixture is obtained by mixing a starting material powder, which is composed of pure aluminum or an aluminum alloy, with 5% by mass to 30% by mass of an aluminum alloy powder that has a lower melting point than the pure aluminum or the aluminum alloy. The aluminum alloy powder is composed of an aluminum alloy which has a composition that contains 5% by mass to 20% by mass of at least one of Si and Cu, and 0.2% by mass to 2.0% by mass of Mg, with a balance of aluminum and unavoidable impurities. Consequently, sintering among the aluminum powders is accelerated and it is possible to obtain an aluminum sintered body that has a higher density and a high electrical conductivity as well as obtaining a high thermal conductivity.

Abstract: In a copper/titanium/aluminum bonded body of the present invention, a copper member made of copper or a copper alloy and an aluminum member made of aluminum or an aluminum alloy are bonded via a titanium layer, an intermetallic compound containing Cu and Ti is formed at a bonded interface of the copper member and the titanium layer, and a maximum value of a length Li of an intermetallic compound unformed part along the bonded interface is 20 ?m or less in the bonding interface of the copper member and the titanium layer, the intermetallic compound unformed part being a part free of formation of the intermetallic compound, and a ratio ?Li/L0 is 0.16 or less, ?Li being a total length of the intermetallic compound unformed part along the bonded interface and of L0 being a total length of the bonded interface along the bonded interface.

Abstract: The tin alloy plating solution of the present invention includes (A) a soluble salt including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) an alkane sulfonic acid including 9 to 18 carbon atoms in a molecule or a salt thereof, (D) a non-ionic surfactant including one or more phenyl groups in a molecule, and (E) a leveling agent.

Abstract: This copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of silicon nitride, wherein the copper member and the ceramic member are bonded to each other, a Mg—N compound phase extending from a ceramic member side to a copper member side is present at a bonded interface between the copper member and the ceramic member, and at least a part of the Mg—N compound phase enters into the copper member.