Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between a copper foil and a resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having a treated surface having a developed interfacial area ratio Sdr of 0.50% or more and 9.00% or less and a root mean square height Sq of 0.010 ?m or more and 0.200 ?m or less on at least one side, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The Sdr and Sq are values measured in accordance with ISO 25178 under conditions in which a cutoff wavelength of an S-filter is 0.55 ?m, and a cutoff wavelength of an L-filter is 10 ?m.

Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between the copper foil and the resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having on at least one side a treated surface on which an amount of nitrogen is 3.0 atomic % or more and 20.0 atomic % or less, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The amount of nitrogen is a proportion of N in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).

Abstract: There is provided a laminated sheet with which the electrical inspection of a redistribution layer formed later can be efficiently performed, while the laminated sheet is in the form of a sheet useful for the formation of a redistribution layer. This laminated sheet includes a carrier with a release function; a first electrically conductive film provided on the carrier with the release function; an insulating film provided on the first electrically conductive film; and a second electrically conductive film provided on the insulating film. The second electrically conductive film is used for formation of a redistribution layer, and the first electrically conductive film, the insulating film, and the second electrically conductive film function as a capacitor for performing electrical inspection of the redistribution layer.

Abstract: There is provided a copper-clad laminate in which transmission characteristics exhibited by a resin layer can be further improved while sufficient peel strength between a copper foil and the resin layer is ensured. The laminate includes a copper foil; an adhesive layer including a polyphenylene ether resin, a polyimide resin, an olefin-based resin, a liquid crystal polymer, a polyester resin, a polystyrene resin, a hydrocarbon elastomer, a benzoxazine resin, an active ester resin, a cyanate ester resin, a bismaleimide resin, a butadiene resin, a hydrogenated or non-hydrogenated styrene butadiene resin, an epoxy resin, a fluororesin, a vinyl-group-containing resin, or the like; and a resin layer. The maximum height Sz at a copper foil surface on the adhesive layer side is 6.8 ?m or less. The dielectric loss tangent value of the adhesive layer at 1 GHz, ?a, is equal to or less than that of the resin layer, ?r.

Abstract: A temporary fixing composition is provided that is used to temporarily fix a first bonding target material and a second bonding target material to each other before the two bonding target materials are bonded to each other. The temporary fixing composition contains a first organic component having a viscosity of less than 70 mPa·s at 25° C. and a boiling point of 200° C. or lower and a second organic component having a viscosity of 70 mPa·s or greater at 25° C. and a boiling point of 210° C. or higher. It is preferable that, when thermogravimetry-differential thermal analysis is performed under the conditions at a temperature increase rate of 10° C./min in a nitrogen atmosphere with a sample mass of 30 mg, the 95% mass reduction temperature is lower than 300° C.

Abstract: There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water-resistant reliability. This resin composition includes an arylene ether compound having a weight average molecular weight of 30000 or higher and a styrenic copolymer having, in its molecule, a reactive unsaturated bond that exhibits reactivity by heat or an ultraviolet ray.

Abstract: A bonding composition contains copper powder, a liquid medium, and a reducing agent. The reducing agent contains at least one amino group and a plurality of hydroxyl groups. The reducing agent has a boiling point that is higher than the boiling point of the liquid medium. The reducing agent has a melting point that is equal to or below the sintering temperature of the copper powder. Preferably, the reducing agent is bis(2hydroxyethyl)iminotris(hydroxymethyl)methane. Preferably, the bonding composition has a viscosity of from 10 Pa·s to 200 Pa·s at a shear rate of 10 s?1 at 25° C. Preferably, the bonding composition contains from 0.1 parts to 10 parts by mass of the reducing agent and from 10 parts to 40 parts by mass of the liquid medium with respect to 100 parts by mass of the copper powder.

Abstract: A method for producing a semiconductor package, capable of effectively suppressing contamination of a chemical liquid and unintended peeling-off of a reinforcing sheet, is provided. This method includes providing a tacky sheet including a substrate sheet, and a soluble tacky layer and a banking tacky layer on at least one surface of the substrate sheet; making a first laminate including a redistribution layer; using the tacky sheet to obtain a second laminate having a second support substrate bonded to a surface on the redistribution layer side of the first laminate with the tacky layer therebetween; peeling off the first support substrate, pretreating the resulting third laminate; mounting a semiconductor chip on a pretreated surface of the redistribution layer; immersing the third laminate in a solution to dissolve or soften the tacky layer; and peeling off the second support substrate in a state where the tacky layer is dissolved or softened.

Abstract: There is provided a wiring substrate whose mechanical strength, water resistance, humidity resistance, and product yield can be improved. This wiring substrate includes a device region in which a main wiring pattern composed of a metal layer is embedded in an insulating layer; a peripheral region which surrounds a periphery of the device region and in which a dummy wiring pattern composed of a metal layer is embedded in an insulating layer; and an insulating boundary region interposed between the device region and the peripheral region, composed of an insulating layer. The insulating boundary region has a winding shape in which it is possible to draw a virtual straight line alternately traversing the metal layer constituting the dummy wiring pattern and the insulating layer constituting the insulating boundary region, parallel to an inscribed line of at least one side of an outer edge of the device region.

Abstract: There is provided an exhaust gas purifying catalyst including a substrate and catalyst portions. The substrate includes an inflow-side cells, outflow-side cells, and porous partition walls, each partition wall separating the inflow-side cell from the outflow-side cell. The catalyst portion includes: (group A) first catalyst portions, each first catalyst portion being provided on a surface of the partition wall that faces the inflow-side cell on an upstream side in an exhaust gas flow direction; and (group B) second catalyst portions being provided on a surface of the partition wall that faces the outflow-side cell on a downstream side in the exhaust gas flow direction. Each catalyst portion of one of group A and group B includes at least one oxidizing catalyst layer and at least one reducing catalyst layer, and each catalyst portion of the other of group A and group B includes at least one oxidizing catalyst layer and/or at least one reducing catalyst layer.

Abstract: There is provided a resin laminate including a first layer composed of a first resin composition and a second layer composed of a second resin composition. The first resin composition includes a resin component including an epoxy resin, a diamine compound, and a polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 60 to 85 parts by weight based on 100 parts of the first resin composition, and the content of the polyimide resin is 20 to 60 parts by weight based on 100 parts of the resin component. The second resin composition includes a resin component including an epoxy resin and a diamine compound but is free of polyimide resin, and a complex metal oxide including at least two selected from Ba, Ti, etc. of 70 to 90 parts by weight based on 100 parts of the second resin composition.

Abstract: There is provided a carrier-attached metal foil in which the metal layer is less likely to be released at the ends of the carrier-attached metal foil or in the cutting place(s) of a downsized carrier-attached metal foil, and moreover a decrease in the strength of the carrier is effectively suppressed. This carrier-attached metal foil includes a carrier; a release layer provided on the carrier; and a metal layer having a thickness of 0.01 ?m or more and 4.0 ?m or less provided on the release layer. The carrier has a flat region having a developed interfacial area ratio Sdr of less than 5%, and an uneven region having a developed interfacial area ratio Sdr of 5% or more and 39% or less, on at least a surface on the metal layer side, and the uneven region is provided in a linear pattern surrounding the flat region.

Abstract: An object of the present invention is to provide an exhaust gas purification catalyst composition and an exhaust gas purification catalyst, each of which includes a pyrochlore-type CeO2—ZrO2-based complex oxide having an improved oxygen storage capacity (particularly, an improved oxygen storage capacity after being exposed to a high temperature environment), and, in order to achieve the above-mentioned object, the present invention provides an exhaust gas purification catalyst composition and an exhaust gas purification catalyst, each of which contains a pyrochlore-type CeO2—ZrO2-based complex oxide that contains Y and Mg and thus exhibits an excellent oxygen storage capacity (particularly, an excellent oxygen storage capacity after being exposed to a high temperature environment).

Abstract: A method for producing a semiconductor package, capable of suppressing damage of a device, and dissolving or softening a tacky layer quickly to peel off a reinforcing sheet, is provided. This method includes: providing a tacky sheet including a soluble tacky layer, making a first laminate, obtaining a second laminate having a second support substrate bonded to the first laminate, peeling off a first support substrate to obtain a third laminate, mounting a semiconductor chip thereon to obtain a fourth laminate, sealing a right end surface and a left end surface of the fourth laminate with sealing members and immersing a lower end surface of the fourth laminate selectively in a solution, giving a pressure difference between an inner space and the solution to allow the solution to penetrate into the internal space and dissolve or soften the soluble tacky layer, and peeling off the second support substrate.

Abstract: There is provided a method for manufacturing a wiring substrate in which damage to a device layer during carrier release can be suppressed, and a photolithography process can be carried out with good accuracy on the device layer after carrier release. This method includes: providing a laminated sheet including a carrier, a release layer, a metal layer, and a device layer in order; making a cut line from a surface of the laminated sheet on the carrier side so that the cut line passes through the carrier, the release layer, and the metal layer when the laminated sheet is seen in a cross-sectional view; and removing outer edge portions outside the cut line in the carrier, the release layer, and the metal layer, thereby exposing part of a surface of the device layer on the metal layer side to form a pressurizable exposed portion for promoting release of the carrier.

Abstract: A Si-based negative electrode active material that is capable of improving cycle characteristics, reducing or eliminating a plateau region in the discharge profile, and further improving high-rate characteristics. The Si-based negative electrode active material contains Si and a compound containing Si and a semimetal/metal element M, wherein the content of Si in the negative electrode active material is more than 50 wt %; the content of oxygen atoms (O) is less than 30 wt %; the content of the semimetal/metal element M is more than 10 wt % and less than 50 wt %, wherein in an X-ray diffraction pattern as measured by a powder X-ray diffraction (XRD) device using Cu-K?1 rays, the full width at half maximum of the peak of the (111) plane of Si is 0.25° or more; and wherein the peak intensity of the peak of the (111) plane of Si is less than 20,000 cps; and the true density is 2.5 g/cm3 or more.

Abstract: A positive electrode active material for an all-solid-state lithium secondary battery, which is capable of improving the rate characteristics, the cycle characteristics, and the initial charge and discharge efficiency even in the case where a sulfide-based solid electrolyte is used, wherein the surface of a lithium-containing composite oxide, referred to as present core particles, is coated with a compound, referred to as, LiAO compound, containing Li, A, where A represents one or more elements selected from the group consisting of Ti, Zr, Ta, Nb, Zn, W, and Al, and O; and a halogen is present on the surface of the present core particles.

Abstract: Provided is a 5 V class spinel type lithium nickel manganese-containing composite oxide having an operating potential of 4.5 V or more with respect to a metal Li reference potential, wherein the composite oxide is able to improve cycle characteristics while suppressing the amount of gas generated under high temperature environments and, moreover, to improve output characteristics while suppressing a shoulder on discharge at around 4.1 V in a charge and discharge curve. The spinel type lithium nickel manganese-containing composite oxide is represented by a general formula [Li(LiaNiyMnxTibMgzM?)O4-?] (where 0<a, 0<b, 0.30?y<0.60, 0<z, 0??, x=2?a?b?y?z??<1.7, 3?b/a?8, 0.11<b+z+?, 0<z/b<1, 0???0.2, and M represents one or two or more elements selected from the group consisting of Fe, Co, Ba, Cr, W, Mo, Y, Zr, Nb, P, and Ce).

Abstract: An extremely thin copper foil with a carrier is provided that can keep stable releasability even after being heated for a prolonged time at a high temperature of 350° C. or more. The extremely thin copper foil with a carrier includes a carrier composed of a glass or ceramic material; an intermediate layer provided on the carrier and composed of at least one metal selected from the group consisting of Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, and Mo; a release layer provided on the intermediate layer and including a carbon sublayer and a metal oxide sublayer or containing metal oxide and carbon; and an extremely thin copper layer provided on the release layer.

Abstract: A glass carrier-attached copper foil is provided that can achieve a desired circuit mounting board that reduces separation of a copper layer at the cut edge even if the copper foil is downsized to dimensions enabling mount of a circuit, and has an intended circuit pattern with a fine pitch. The glass carrier-attached copper foil includes a glass carrier, a release layer, and a copper layer with a thickness of 0.1 to 3.0 ?m. The glass carrier has, at least on its surface having the copper layer thereon, a plurality of flat regions each having a maximum height Rz of less than 1.0 ?m as measured in accordance with JIS B 0601-2001 and a rough region having a maximum height Rz of 1.0 to 30.0 ?m as measured in accordance with JIS B 0601-2001. The rough region has a pattern of lines that define the flat regions.