Abstract: A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.

Abstract: An exhaust gas purification catalyst comprises a substrate and a catalyst layer on the substrate, and has a first section upstream along a flow direction of the exhaust gas and a second section downstream from the first section. The catalyst layer in the first section comprises a first catalyst layer comprising palladium and a second catalyst layer comprising rhodium and covering the first catalyst layer. A pore volume proportion, which is a proportion of a total volume of the pores having a pore diameter of 0.06-30.0 ?m as measured by mercury press-in method and existing in the substrate and the catalyst layer in the first section to a volume of a entire first section, is 12-18%. A wash coat amount, which is a mass per unit volume of the catalyst layer in the first section to the volume of the substrate existing in the first section, is 100-190 g/L.

Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between the copper foil and the resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having on at least one side a treated surface on which an amount of metal components is 30 atomic % or more and 40 atomic % or less, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The amount of metal components is a proportion of Cr, Ni, Cu, Zn, Mo, Co, W, and Fe in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).

Abstract: A bonded body is provided including: a bonding layer containing Cu; and a semiconductor element bonded to the bonding layer. The bonding layer includes an extending portion laterally extending from a peripheral edge of the semiconductor element. In a cross-sectional view in a thickness direction, the extending portion rises from a peripheral edge of a bottom of the semiconductor element or from the vicinity of the peripheral edge of the bottom of the semiconductor element, and includes a side wall substantially spaced apart from a side of the semiconductor element. Preferably, the extending portion does not include any portion where the side wall and the side of the semiconductor element are in contact with each other. A method for manufacturing a bonded body is also provided.

Abstract: Out of sintered metal carbides having an extremely high melting point, there is provided a sintered metal carbide which can be produced without having to perform sintering under high pressure such as hot pressing or HIP, having a high relative density and excellent mechanical strength. A sintered metal carbide of at least one metal selected from the group consisting of elements of Groups 4 and 5 of the periodic table, wherein the sintered metal carbide contains Si element of 0.1 wtppm or more and 10,000 wtppm or less.

Abstract: A composition for forming a conductive film contains flat metal particles and a resin. The flat metal particles each have a metal oxide layer in the surface portion thereof. The flat metal particles have a ratio of the thickness of the metal oxide layer to the thickness of the flat metal particle of from 0.010 to 0.300. The thickness of the metal oxide layer is from 0.010 ?m to 2.000 ?m. In the method for manufacturing a conductive film, a composition for forming a conductive film is used, the composition containing flat metal particles and a resin. The composition for forming a conductive film is applied to a base material to form a coating film, and then the coating film is irradiated with light to sinter the coating film, thereby obtaining a conductive film. The flat metal particles each have a metal oxide layer in the surface portion thereof.

Abstract: Provided is a method for manufacturing a multilayer substrate capable of suppressing short circuits between bumps and the warpage of substrates. This method includes: providing a first substrate being a rigid substrate including first bumps, and a second substrate or semiconductor device including second bumps, the first bumps and the second bumps being composed of a metal or alloy having a melting point of 600° C. or more, and having a height of 0.3 ?m or more; performing cleaning treatment on bonding surfaces of the first bumps and the second bumps under a pressure of 1×10?3 Pa or less, and subsequently stacking the first substrate and the second substrate or semiconductor device so that the bonding surfaces of the first bumps and the second bumps abut each other, and pressure-welding the first bumps and the second bumps at a temperature of 90° C. or less to form a multilayer substrate.

Abstract: There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 ?m thick having a surface having an arithmetic mean waviness Wa of 0.10 ?m or more and 0.25 ?m or less as measured in accordance with JIS B0601-2001 and a kurtosis Sku of 2.0 or more and 3.5 or less as measured in accordance with ISO 25178; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.

Abstract: Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and suppression of powdering. This roughened copper foil includes a roughened surface on at least one side. The roughened surface has a roughness slope tan ? of 0.58 or less as calculated based on a mean height Rc (?m) and a mean width RSm (?m) of profile elements by formula Rc/(0.5×RSm), and a sharpness index Rc×Sku of 2.35 or less that is a product of the mean height Rc (?m) and a kurtosis Sku. Rc and RSm are values measured in accordance with JIS B0601-2013 under a condition of not performing a cutoff by a cutoff value ?s and a cutoff value ?c, and Sku is a value measured in accordance with ISO 25178 under a condition of not performing a cutoff using an S filter and an L filter.

Abstract: Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and high peel strength when used for a copper-clad laminate or a printed wiring board. This roughened copper foil includes a roughened surface on at least one side. The roughened surface has a roughness slope tan ? of 0.58 or less as calculated based on a mean height Rc (?m) and a mean width RSm (?m) of profile elements by formula Rc/(0.5×RSm), and a small projected area Rc×RSm of 0.45 ?m2 or more and 2.00 ?m2 or less that is a product of the mean height Rc (?m) and the mean width RSm (?m) of the profile elements. Rc and RSm are values measured in accordance with JIS B0601-2013 under a condition of not performing a cutoff by a cutoff value ?s and a cutoff value ?c.

Abstract: Provided are a sulfide solid electrolyte having a small particle size and a low specific surface area; an electrode composite material, a slurry and a battery in each of which the sulfide solid electrolyte is used; and a method of producing the sulfide solid electrolyte. The sulfide solid electrolyte contains lithium (Li), phosphorus (P) and sulfur (S) elements and has: a median diameter D50 of 0.10 ?m or more and 2.0 ?m or less; and a value of the formula: (A×B)/C, wherein A represents a BET specific surface area (m2/g), B represents a true density (g/cm3), and C represents a CS value (m2/cm3), of 1.0 or more and 2.5 or less.

Abstract: Copper particles are provided that each include a core particle made of copper and a coating layer that coats the surface of the core particle, wherein the coating layer is made of a copper salt of an aliphatic organic acid. It is also preferable that the copper particles have an infrared absorption peak in a range of 1504 to 1514 cm?1 and no infrared absorption peak in a range of 1584 to 1596 cm?1. It is also preferable that, in thermogravimetric analysis of the copper particles, the temperature at which the ratio of the mass loss value to the mass loss value at 500° C. reaches 10% is from 150° C. to 220° C. A method is also provided for producing copper particles, the method including bringing core particles made of copper into contact with a solution containing a copper salt of an aliphatic organic acid to thereby coat the surface of the core particles.

Abstract: A sulfide solid electrolyte that can suppress the generation of hydrogen sulfide gas while maintaining the lithium ion conductivity; and an electrode composite material, a slurry and a battery, in each of which the sulfide solid electrolyte is used, are provided. The sulfide solid electrolyte contains lithium (Li), phosphorus (P) and sulfur (S) elements; at least one halogen (X) element; and at least one metal (M) element having a first ionization energy of more than 520.2 KJ/mol and less than 1007.3 KJ/mol, wherein, in an X-ray diffraction pattern measured with CuK?1 radiation, peaks are present at positions of 2?=25.19°±1.00° and 29.62°±1.00°.

Abstract: A negative thermal expansion material having a negative thermal expansion coefficient according to the present invention is represented by Zr2?aMaSxP2O12+?, where M is at least one selected from Ti, Ce, Sn, Mn, Hf, Ir, Pb, Pd, and Cr; a is 0?a<2; x is 0.4?x?1; and ? is a value defined as to satisfy a charge neutral condition. The present invention makes it possible to provide a negative thermal expansion material, a composite material and a method for producing a negative thermal expansion material that can realize reduction in cost and density reduction.

Abstract: A rare earth phosphate particle containing a rare earth element A, where A is Sc, Y, La, Eu, Gd, Dy, Yb, or Lu, and a rare earth element B different from the element A, where B is Sc, Y, La, Eu, Gd, Dy, Yb, or Lu. The phosphate of the element A is preferably crystalline, with at least part of the element B dissolved in the phosphate of the element A in a solid state. The phosphate of the element A preferably has a xenotime or monazite crystal structure.

Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between the copper foil and the resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having on at least one side a treated surface on which an amount of metal components is 30 atomic % or more and 40 atomic % or less, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The amount of metal components is a proportion of Cr, Ni, Cu, Zn, Mo, Co, W, and Fe in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).

Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between a copper foil and a resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having a treated surface having a developed interfacial area ratio Sdr of 0.50% or more and 9.00% or less and a root mean square height Sq of 0.010 ?m or more and 0.200 ?m or less on at least one side, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The Sdr and Sq are values measured in accordance with ISO 25178 under conditions in which a cutoff wavelength of an S-filter is 0.55 ?m, and a cutoff wavelength of an L-filter is 10 ?m.

Abstract: Provided is a method for manufacturing a laminate that is excellent in adhesion between the copper foil and the resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having on at least one side a treated surface on which an amount of nitrogen is 3.0 atomic % or more and 20.0 atomic % or less, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The amount of nitrogen is a proportion of N in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).

Abstract: There is provided a laminated sheet with which the electrical inspection of a redistribution layer formed later can be efficiently performed, while the laminated sheet is in the form of a sheet useful for the formation of a redistribution layer. This laminated sheet includes a carrier with a release function; a first electrically conductive film provided on the carrier with the release function; an insulating film provided on the first electrically conductive film; and a second electrically conductive film provided on the insulating film. The second electrically conductive film is used for formation of a redistribution layer, and the first electrically conductive film, the insulating film, and the second electrically conductive film function as a capacitor for performing electrical inspection of the redistribution layer.

Abstract: There is provided a copper-clad laminate in which transmission characteristics exhibited by a resin layer can be further improved while sufficient peel strength between a copper foil and the resin layer is ensured. The laminate includes a copper foil; an adhesive layer including a polyphenylene ether resin, a polyimide resin, an olefin-based resin, a liquid crystal polymer, a polyester resin, a polystyrene resin, a hydrocarbon elastomer, a benzoxazine resin, an active ester resin, a cyanate ester resin, a bismaleimide resin, a butadiene resin, a hydrogenated or non-hydrogenated styrene butadiene resin, an epoxy resin, a fluororesin, a vinyl-group-containing resin, or the like; and a resin layer. The maximum height Sz at a copper foil surface on the adhesive layer side is 6.8 ?m or less. The dielectric loss tangent value of the adhesive layer at 1 GHz, ?a, is equal to or less than that of the resin layer, ?r.