Abstract: To provide a molded article which can have excellent strength, can also have high durability during repeated use, and can maintain high adsorption performance even when the content of a binder resin is reduced. A molded article containing cerium oxide particles and a binder resin, wherein cerium oxide particles which has an average particle diameter of 1 to 15 ?m and in each of which a crystallite size is 40 to 200 ? are used.

Abstract: The present invention provides a positive electrode active material with which an increase in the interface resistance between the positive electrode active material and a sulfide solid electrolyte over time can be suppressed and also the interface resistance is low. The positive electrode active material of the present invention includes particles that have core particles containing a complex oxide of lithium and a metal element and a coating layer arranged on the surface of the core particles, and is used in a solid-state battery containing a sulfide solid electrolyte. The coating layer is composed of an oxide containing Li and M, where M represents one or two or more elements selected from the group consisting of B, Nb, Ti, Zr, Ta, Zn, W, and Al, or M is B when M represents one element. The molar ratio of Li/M on the surface of the coating layer, as obtained by X-ray photoelectron spectroscopy, is from 0.85 to 3.95.

Abstract: In relation to a Cu-based delafossite-type oxide that is effective as an exhaust gas purification catalyst, Cu is placed in a high catalytic activity low-valence state, whereby a novel Cu-based delafossite-type oxide having higher activity than in the past is provided. Proposed is a delafossite-type oxide for an exhaust gas purification catalyst that is represented by a general formula ABO2, wherein Cu and Ag are contained in the A site of the general formula, one or two or more elements selected from the group consisting of Mn, Al, Cr, Ga, Fe, Co, Ni, In, La, Nd, Sm, Eu, Y, V, and Ti are contained in the B site of the general formula, and Ag is contained at a ratio of 0.001 at. % or more and less than 20 at. % in the A site of the general formula.

Abstract: There is provided a laminate that can suppress the warpage of a laminated product when used for the manufacture of the laminated product. This laminate includes a float glass substrate having a top surface and a bottom surface; and a metal layer provided on the top surface side of the float glass substrate.

Abstract: A novel sulfide solid electrolyte containing Li, P, S, and a halogen, which can be used as a solid electrolyte for a lithium secondary battery or the like, and is able to suppress the generation of a hydrogen sulfide gas even when exposed to moisture in the atmosphere. The sulfide solid electrolyte comprises a crystal phase or a compound having an argyrodite-type structure and containing Li, P, S, and a halogen; and a compound composed of Li, Cl, and Br and having a peak at each position of 2?=29.1°±0.5° and 33.7°±0.5° in an X-ray diffraction pattern.

Abstract: A substrate (11) includes an inflow-side cell (21), an outflow-side cell (22), and a porous, gas-permeable partition wall (23) that separates the inflow-side cell (21) and the outflow-side cell (22) from each other, and also includes a first catalyst portion (14) that is provided on a side of the partition wall (23) that faces the inflow-side cell (21) at least at a portion in upstream side in an exhaust gas flow direction, and a second catalyst portion (15) that is provided on a side of the partition wall that faces the outflow-side cell at least at a portion in downstream side.

Abstract: Provided is a method of manufacturing a multilayer wiring board, in which electrical inspection can be performed with accurate probing while warpage of a multilayer laminate is reduced. This method includes providing a laminated sheet including a first support, a first release layer and a metal layer; alternately stacking wiring layers and insulating layers on a surface of the metal layer, wherein an n-th wiring layer being the uppermost layer includes an n-th connection pad; bonding a second support having an opening on a surface, remote from the laminated sheet, of the multilayer laminate with a second release layer therebetween such that at least a part of the n-th connection pad is disposed within the opening; releasing the first support from the reinforced multilayer laminate at the first release layer; and putting conductors into contact with the n-th connection pads of the reinforced multilayer laminate to perform electrical inspection.

Abstract: The purpose of the present invention is to provide a metal-substituted beta zeolite that exhibits a more excellent catalytic performance than conventional one, and a method for producing the same. The present invention provides a metal-substituted beta zeolite by subjecting an alkali metal-form beta zeolite produced without using an organic structure-directing agent to ion exchange with ammonium ion and then, using a filter cake procedure, to ion exchange with copper ion or iron(II) ion. The present invention also provides a metal-substituted beta zeolite which has been ion exchanged with copper ion or iron(II) ion and in which the amount of Lewis acid sites is greater than the amount of Bronsted acid sites when the amount of Bronsted acid sites and the amount of Lewis acid sites are measured by ammonia infrared-mass spectroscopy temperature-programmed desorption on the as-produced state.

Abstract: There is provided a copper powder containing an organic compound containing carbon and nitrogen. The powder has a ratio of carbon content PC (mass %) to specific surface area SSA (m2/g), PC/SSA, of 0.005 to 0.1 and a ratio of nitrogen content PN (mass %) to specific surface area SSA (m2/g), PN/SSA, of 0.001 to 0.05. The organic compound preferably contains two or more of nitrogen atom per molecule and is preferably capable of forming a five-membered ring complex with copper. The organic compound preferably includes one or more of dimethyl glyoxime, ethylenediamine, and polyethyleneimine.

Abstract: An extremely thin copper foil is provided that enables formation of highly fine different wiring patterns with a line/space (L/S) of 10 ?m or less/10 ?m or less on two sides of the copper foil and is thus usable as an inexpensive and readily processable substitution for silicon and glass interposers. The extremely thin copper foil includes, in sequence, a first extremely thin copper layer, an etching stopper layer, and the second extremely thin copper layer. Two sides of the extremely thin copper foil each have an arithmetic average roughness Ra of 20 nm or less.

Abstract: A solid electrolyte assembly is obtained by joining a solid electrolyte layer having oxide ion conductivity and containing lanthanum and a first electrode layer made of an oxide that is represented by ABO3?? and has a cubic perovskite structure to each other, where A represents an alkaline-earth metal element, B represents a transition metal element, and ? represents a fraction that occurs depending on the valences and amounts of A, B, and O. The oxide contains lanthanum at a part of the A site, and an atom ratio of lanthanum to all the elements occupying the A site is 0.01 or greater and 0.80 or less.

Abstract: Sulfide-type compound particles microparticulated, having an argyrodite-type crystal structure, and including lithium (Li), phosphorus (P), sulfur (S), and a halogen (Ha). As sulfide-type compound particles that can inhibit generation of hydrogen sulfide gas even upon contact with moisture in the atmosphere, provided are sulfide-type compound particles having D50 in a volume-basis particle size distribution of 50 ?m or less and having an occupancy of sulfur (S) and the halogen (Ha) in the S3 (4a) site, as calculated by a neutron diffraction measurement, of 85% or more.

Abstract: An extremely thin copper foil with a carrier is provided that can keep stable releasability even after being heated for a prolonged time at a high temperature of 350° C. or more. The extremely thin copper foil with a carrier includes a carrier composed of a glass or ceramic material; an intermediate layer provided on the carrier and composed of at least one metal selected from the group consisting of Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, and Mo; a release layer provided on the intermediate layer and including a carbon sublayer and a metal oxide sublayer or containing metal oxide and carbon; and an extremely thin copper layer provided on the release layer.

Abstract: A substrate (11) of an exhaust gas purification catalyst (10) includes inflow-side cells (21), outflow-side cells (22), and porous partition walls (23), each porous partition wall separating the cells (21, 22) from each other. A first catalyst portions (14) is provided at least on a portion of a side of the partition wall (23) that faces the inflow-side cell (21), the portion being located on an upstream side in an exhaust gas flow direction, and a second catalyst portion (15) is provided at least on a portion of a side of the partition wall that faces the outflow-side cell, the portion being located on a downstream side in the exhaust gas flow direction.

Abstract: There is provided a copper-clad laminate in which transmission characteristics exhibited by a resin layer can be further improved while sufficient peel strength between a copper foil and the resin layer is ensured. The laminate includes a copper foil; an adhesive layer including a polyphenylene ether resin, a polyimide resin, an olefin-based resin, a liquid crystal polymer, a polyester resin, a polystyrene resin, a hydrocarbon elastomer, a benzoxazine resin, an active ester resin, a cyanate ester resin, a bismaleimide resin, a butadiene resin, a hydrogenated or non-hydrogenated styrene butadiene resin, an epoxy resin, a fluororesin, a vinyl-group-containing resin, or the like; and a resin layer. The maximum height Sz at a copper foil surface on the adhesive layer side is 6.8 ?m or less. The dielectric loss tangent value of the adhesive layer at 1 GHz, ?a, is equal to or less than that of the resin layer, ?r.

Abstract: A glass carrier-attached copper foil is provided that is suitable for production of a desired circuit mounting board ensuring electric conduction over the entire copper layer, reducing separation of the copper layer at the cut edge even if the copper foil is downsized, and having an intended circuit pattern with a fine pitch. The glass carrier-attached copper foil includes a glass carrier, a release layer provided on the glass carrier, and a copper layer provided on the release layer. The release layer has a function to enable release of the copper layer from the glass carrier. The glass carrier-attached copper foil has a plurality of releasable regions including the release layer and an unreleasable region not including the release layer. The unreleasable region has a pattern defining the releasable regions.

Abstract: There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper foil provided with a carrier comprises a carrier; an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu; a release layer disposed on the interlayer; and an extremely-thin copper layer disposed on the release layer.

Abstract: There is provided a copper foil provided with a carrier providing excellent chemical resistance against the copper flash etching solution during the formation of the wiring layer on the surface of the coreless support and excellent visibility of the wiring layer due to high contrast to the antireflective layer in image inspection after copper flash etching. The copper foil provided with a carrier comprises a carrier; a release layer provided on the carrier; an antireflective layer provided on the release layer and composed of at least one metal selected from the group consisting of Cr, W, Ta, Ti, Ni and Mo; and an extremely-thin copper layer provided on the antireflective layer; wherein at least the surface adjacent to the extremely-thin copper layer of the antireflective layer comprises an aggregate of metal particles.

Abstract: A glass carrier-attached copper foil is provided that can achieve a desired circuit mounting board that reduces separation of a copper layer at the cut edge even if the copper foil is downsized to dimensions enabling mount of a circuit, and has an intended circuit pattern with a fine pitch. The glass carrier-attached copper foil includes a glass carrier, a release layer, and a copper layer with a thickness of 0.1 to 3.0 ?m. The glass carrier has, at least on its surface having the copper layer thereon, a plurality of flat regions each having a maximum height Rz of less than 1.0 ?m as measured in accordance with JIS B 0601-2001 and a rough region having a maximum height Rz of 1.0 to 30.0 ?m as measured in accordance with JIS B 0601-2001. The rough region has a pattern of lines that define the flat regions.

Abstract: Provided is a production method with which it is possible to produce beta zeolite at high purity by suppressing the generation of impurities by a seed crystal addition method that can reduce the environmental burden as much as possible, without using an organic structure-directing agent. This method for producing beta zeolite having a step that mixes and heats an organic-compound-free reaction mixture comprising a silica source, alumina source, alkali source, and water with beta zeolite seed crystals, wherein (I) beta zeolite synthesized without using an organic structure-directing agent and having 90% or more by volume of particles 10 ?m or less in diameter in the particle size distribution by a laser diffraction scattering-type particle size distribution measurement method is used, (III) acid-treated zeolite in which the SiO2/Al2O3 ratio is 150 or less is prepared by (II) contact treatment with an acidic aqueous solution, and the acid-treated zeolite is used as the beta zeolite seed crystals.