Abstract: A resin which is an ethylene/&agr;-olefin copolymer comprising ethylene and an &agr;-olefin having 3 to 12 carbon atoms exhibiting particular physical properties including a narrow molecular weight distribution, and which is suitable for flexible sealed containers showing excellent flexibility, unstickiness and excellent slip properties, and flexible sealed containers therefrom.

Abstract: An object of the invention is to prevent dent faults generated during bonding of an outer copper foil layer onto an inner layer substrate having a through hole or a cavity serving as an interlayer electrical connection means such as an interstitial via hole (IVH) or a blind via hole (BVH).

Abstract: A composite material for use in making printed wiring boards comprising a carrier having releasable conductive fine particles on its surface. The composite is laminated to a substrate with the conductive fine particles facing the substrate and the carrier removed, leaving the surface of the conductive fine particles exposed. Printed wiring is formed using the conductive fine particles as its base, thus providing improved peel strength and permitting formation of fine wiring lines and spaces.

Abstract: An aqueous emulsion composition that has high adhesion strength for a variety of materials so that it can be used for the adhesive bonding of even molded products and an adherent composition containing the aqueous emulsion composition. The aqueous emulsion composition comprises a carboxyl modified resin of a saponified ethylene-vinyl acetate copolymer and a surface active agent. This aqueous emulsion composition can be suitably used as adherent composition, such as an primer and an adhesive, for adhesive bonding a variety of molded products, such as plastic films, plastic sheets, plastic foams, fibers, synthetic leathers and metals. Due to the aqueous composition, the composition can have little risk to catch fire and can provide good sanitation in the environment.

Abstract: A polyethylene nonwoven fabric is produced by the meltblowing process using a resin composition comprising a polyethylene (A) and a polyethylene wax (B). The fabric is made up with fine fibers having a small fiber diameter and good formation. A nonwoven fabric laminate containing at least one layer comprising the polyethylene nonwoven fabric is excellent in softness, water impermeability and interlaminar bond properties. In particular, the laminate of a meltblown nonwoven fabric comprising the polyethylene nonwoven fabric and a spunbonded nonwoven fabric made up with a conjugate fiber comprising a propylene-based polymer (a) and an ethylene-based polymer (b) provides good uniformity and excellent softness, gas permeability, water impermeability and interlaminar bond strength. The laminate is advantageously used as substrate materials for sanitary goods such as disposable diapers and for packaging materials.

Abstract: On a substrate of n-type GaAs are sequentially formed an n-type cladding layer (AlGaAs, Al content x=0.07, thickness t=2.86 &mgr;m), an n-type optical waveguide layer (GaAs, t=0.49 &mgr;m), an n-type carrier blocking layer (AlGaAs, x=0.40, t=0.03 &mgr;m), an active layer (composed of an In0.18Ga0.82As quantum well layer and a GaAs barrier layer), a p-type carrier blocking layer (AlGaAs, x=0.40, t=0.03 &mgr;m), a p-type optical waveguide layer (GaAs, t=0.49 &mgr;m), a p-type cladding layer (AlGaAs, x=0.20, t=1.08 &mgr;m), and a p-type cap layer (GaAs) in which a pair of n-type current blocking layers (GaAs) are buried. With this construction, the occurrence of a wavelength spit due to a higher-order mode can be inhibited thereby stabilizing a higher power operation.

Abstract: Disclosed are a propylene polymer having a high crystallinity of a boiled heptane-insoluble component contained therein, a high stereoregularity and an extremely long mesochain (continuous propylene units wherein directions of &agr;-methyl carbons are the same as each other), and a process for preparing said polymer. Also disclosed are a propylene block copolymer containing a crystalline polypropylene portion having a high crystallinity of a boiled heptane-insoluble component contained therein, a high stereoregularity and an extremely long mesochain, and a process for preparing said copolymer. Further disclosed is a propylene polymer composition comprising the above propylene polymer or propylene block copolymer and at least one stabilizer selected from a phenol type stabilizer, an organophosphite type stabilizer, a thioether type stabilizer, a hindered amine type stabilizer and a metallic salt of higher aliphatic acid.

Abstract: A copper foil for use in making a printed wiring board and a copper clad laminate comprising the copper foil are herein disclosed and the copper foil is characterized in that a metal chromium layer is formed on at least one side of the copper foil by vapor deposition or characterized in that one side of the copper foil is supported by a carrier through a releasing layer and a metal chromium layer is formed on the other side of the foil by vapor deposition. The copper foil is excellent in the adhesion to various substrates (the peel strength between the substrate and the copper foil), moisture resistance, chemical resistance and heat resistance and therefore, the copper foil can suitably be used in the production of printed wiring boards.

Abstract: An object of the present invention is to provide a copper foil having excellent adhesion to an etching resist layer, without performing physical polishing such as buffing in pre-treatment of an etching process to form a circuit from the copper foil. To attain the object, in electroforming, a titanium material having a grain size number of 6.0 or more is employed as a copper deposition surface of the rotating drum cathode, and glue and/or gelatin is added in an amount of 0.2-20 mg/l to a copper sulfate solution, thereby producing a drum foil. An electrodeposited copper foil obtained from the drum foil, wherein 20% or more of the crystals present in a shiny side surface of the electrodeposited copper foil have a twin-crystal structure, is used for producing copper-clad laminates.

Abstract: An aliphatic polyester stretched film which has excellent flexibility and heat resistance and manifests no bleeding of a plasticizer, an aliphatic polyester composition which is a raw material of the stretched film, and a package using the stretched film. The film can be prepared from an aliphatic polyester composition comprising 10 to 60 parts by weight of at least one compound selected from (A) a compound represented by the general formula: R1OCH2CH(OR2)CH2OR3 (wherein, at least one of R1, R2 and R3 represents an acyl group having 6 to 18 carbon atoms, and remaining groups represent a hydrogen atom or an acetyl group.) and (B) a compound which is a reaction product of a condensate of 1 to 10 glycerin units with a carboxylic acid having 6 to 18 carbon atoms, based on 100 parts by weight of an aliphatic polyester. The aliphatic polyester stretched film can have a crystallinity of 20 to 60% which is obtained by molding the composition, and the film can be formed into a package obtained.

Abstract: To provide an electrodeposited copper foil with carrier, in which electrical connection holes such as through holes (PTH), interstitial via holes (IVH), and blind via holes (BVH) can be readily formed. The invention provides an electrodeposited copper foil with carrier comprising a carrier foil, an organic release interface layer formed on a surface of the carrier foil, and an electrodeposited copper foil layer deposited on the release interface layer, wherein copper microparticles are deposited on the surface of the carrier foil onto which the organic release interface layer and the electrodeposited copper layer are formed.

Abstract: The olefin thermoplastic elastomer of the invention has an islands-sea structure, in which the average particle diameter of the islands phases is not more than 2 &mgr;m, and has a gel fraction ranging from 0.5 to 15% by weight and a quantity of heat of melt at a temperature of 125° C. or below, as measured in a different scanning calorimeter (DSC), of 40% or more of the total quantity of heat of melt. The olefin thermoplastic elastomer can be obtained by melt blending in the presence of a crosslinking agent of a specific amount a blend that contains specific amounts of: a high density polyethylene having a density of 0.940 g/cm3 or more, or a crystalline ethylene polymer having a crystallinity determined by a DSC method of 10% or more and a density of less than 0.940 g/cm3, an ethylene/&agr;-olefin(/non-conjugated polyene) copolymer rubber comprising ethylene, an &agr;-olefin of 3 to 20 carbon atoms and optionally a non-conjugated polyene, and a polypropylene.

Abstract: Olefin polymerization catalyests are formed from: (I-2) a contact product obtained by contacting (A) a solid titanium catalyst component, (B) an organometallic compound catalyst component, and (D) a specific polyether compounds, (II-2)(C) a specific organosilicon compound, and, optionally, (III-2) an organometallic compound catalyst component; or the contact product (I-2) may be replaced by one which is obtained by prepolymerizing an olefin of 2 or more carbon atoms in the presence of the catalyst components for the contact product (I-2).

Abstract: The solvent-free two-component adhesive composition of the present invention comprises a polyol component (A) and a polyisocyanate component (B), and the viscosity of the mixture at 80° C. immediately after the point of time the components (A) and (B) are mixed together is 900 mPa·s or higher. The component (A) may be a polyol having a number average molecular weight of 800 or larger, or a mixture thereof, and the viscosity of the component (B) at 25° C. may be 20,000 mPa·s or higher. The composition may be used for laminating metal foil of 5 to 15 m thickness with a plastic film. By using the composition of the present invention, the occurrence of blocking due to the seepage of the adhesive from metal foil is prevented. The present invention includes a process of lamination using the same.

Abstract: A real index guided semiconductor laser device includes an optical waveguide layer at least on one side of an active layer that has a band gap energy not less than that of the active layer; a cladding layer on an outer side of the optical waveguide layer that has a band gap energy not less than that of the optical waveguide layer; a refractive index control layer having a striped window, buried in the optical waveguide layer by selective growth; and a semiconductor layer formed in the optical waveguide layer by selective growth prior to the selective growth of the refractive index control layer. In a laminated portion including the semiconductor layer and the refractive index control layer, a change in effective refractive index due to a change in thickness of the semiconductor layer is smaller than that of the refractive index control layer.

Abstract: The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has,,been subjected to nodular treatment and anti-corrosion treatment, wherein the anti-corrosion treatment includes forming a-zinc-copper-tin ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.

Abstract: A resin composition is a transparent, low-water-absorption polyolefin-based resin composition containing a sorbitol-based derivative of a particular structure, whose polyolefin-based resin having crystallinity of 0% to 20% shows haze of not more than 10%, total light transmittance of not less than 80%, when measured in accordance with ASTM D1003 using an article 3 mm thick molded therefrom as the test specimen, and shows water absorption of not more than 0.1% after 100-hour immersion in water at 23° C., or whose polyolefin-based resin comprises a cyclic olefin-based polymer comprising a cyclic olefin of a particular structure. Preferable examples of the polyolefin-based resin include the aforesaid cyclic olefin-based polymer and a polycyclohexane-based resin.

Abstract: A wire showing satisfactory electrical insulation, mechanical strength, wear resistance, crosslinking properties and appearance may be obtained by coating a conductor with an ethylene/&agr;-olefin copolymer whose density, melt flow rate, decane soluble matter content, melting point and melt tension are controlled to particular ranges. The copolymer may be used singly or in combination with high-pressure low-density polyethylene. Such copolymer provides a coated layer showing tensile strength of not less than 15 MPa, tensile elongation of not less than 400% and taper wear amount of not more than 15 mg. Furthermore, if the resin pressure in the extruder is adjusted to a particular range, high-speed extrusion becomes possible with a smooth apparent coated layer.

Abstract: An electrically resistive foil comprising a resistive composite material including a conductive material and a non-conductive material alone or incorporated into a two layer foil material that includes a conductive metal layer and a layer of the resistive composite material. This invention also includes circuit boards comprising an insulative substrate and an integral resistor comprising the resistive composite material of this invention as well as methods for manufacturing printed circuit boards including integral resistors.

Abstract: The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has been subjected to nodular treatment and anti-corrosion treatments, wherein the anti-corrosion treatment includes forming a zinc-copper-nickel ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-absorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.