Patents Assigned to MPI Corporation
  • WAFER INSPECTION METHOD AND WAFER PROBING SYSTEM
    Publication number: 20190187206
    Abstract: A wafer inspection method was provided. A motorized chuck stage is controlled by a control rod to be displaced between an upper position and a lower position of an adjustment range along a Z-axis direction, to change a relative position of a wafer on the motorized chuck stage relative to a probe. The control rod is movable between an upper limit position and a lower limit position in a displacement range. The wafer inspection method includes: determining a position of the control rod in the displacement range based on a measurement signal; determining a moving direction and a moving distance of the control rod based on a change of the measurement signal; generating a control signal based on the moving distance of the control rod; and controlling, based on the control signal, the motorized chuck stage and a camera stage to be displaced the same distance.
    Type: Application
    Filed: December 7, 2018
    Publication date: June 20, 2019
    Applicant: MPI Corporation
    Inventors: Lin-Lin Chih, Chien-Hung Chen, Guan-Jhih Liou, Yu-Hsun Hsu
  • ALIGNING METHOD FOR USE IN SEMICONDUCTOR INSPECTION APPARATUS
    Publication number: 20190171328
    Abstract: An aligning method for use in semiconductor inspection apparatus is provided. The semiconductor inspection apparatus includes a stage and a touch-control screen. The aligning method includes defining a reference direction; displaying an image of a device under test supported by the stage on the touch-control screen; detecting a first touch point and a second touch point occurred on the touch-control screen; defining a straight line according to the first touch point and the second touch point; calculating an included angle defined by the straight and the reference direction; and rotating the stage according to the included angle.
    Type: Application
    Filed: August 17, 2018
    Publication date: June 6, 2019
    Applicant: MPI Corporation
    Inventors: Lin-Lin Chih, Guan-Jhih Liou, Chien-Hung Chen, Yung-Chin Liu
  • Method for compensating probe misplacement and probe apparatus
    Patent number: 10312123
    Abstract: A method for compensating probe misplacement and a probe apparatus are provided. The method is applicable to a probe module which includes a probe and a fixing base. The probe includes a probe body section and a probe tip section. The probe body section is fixed on the fixing base. The method includes: measuring a temperature of a probe body of the probe body section of the probe; calculating, according to the temperature of the probe body, thermal expansion amount of the probe along a length direction of the probe body section; calculating a compensation value according to the thermal expansion amount; moving the probe or a to-be-tested element according to the calculated compensation value, to align a probe tip of the probe tip section with the to-be-tested element or align the to-be-tested element with the probe tip of the probe tip section.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: June 4, 2019
    Assignee: MPI CORPORATION
    Inventors: Chen-Ching Chen, Yu-Hsun Hsu, Po-Yi Ting, Stojan Kanev
  • Probe module supporting loopback test
    Patent number: 10295567
    Abstract: A probe module, which supports loopback test and is provided between a PCB and a DUT, includes an adapter, two probes, two inductive components provided at the adapter, and a capacitive component. The adapter has two connecting circuits. An end of each of the probes is connected to one of the connecting circuits, while another end thereof, which is a tip, contacts the DUT. Each of the inductive components has an end electrically connected to one of the connecting circuits, and another end electrically connected to the PCB through a conductive member, which is provided at the adapter, wherein two ends of the capacitive component are electrically connected to one of the connecting circuits, respectively. Whereby, the signal paths are changed by the differences between frequencies of signals, and the transmission path of high-frequency signals is effectively shortened.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: May 21, 2019
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Hao Wei, Jun-Liang Lai, Chih-Hao Ho
  • Probe card having replaceable probe module and assembling method and probe module replacing method of the same
    Patent number: 10281488
    Abstract: A probe card includes a substrate module having an installation hole and a first stair-shaped structure provided on two stairs thereof with a first connection surface and a first transmission surface having a first contact pad, a probe module having a probe and a second stair-shaped structure provided on two stairs thereof with a second connection surface and a second transmission surface having a second contact pad electrically connected with the probe, and a pressing member. The probe module is disposed in the installation hole so that the first and second connection surfaces are connected and the first and second transmission surfaces are opposite. The pressing member is detachably pressed on the probe module to press the second connection surface against the first connection surface and make the first and second contact pads electrically connected.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: May 7, 2019
    Assignee: MPI CORPORATION
    Inventors: Shih-Shin Chen, Cheng-En Wu, Chia-Hsiang Yu
  • Probe card for high voltage testing
    Patent number: 10168359
    Abstract: A probe card includes a wiring board, a top cover, a retractable structure and a probe. The top cover couples with the wiring board and has an air inlet. The retractable structure connects with the top cover and includes a first and a second rings. The first ring has vent holes. A top surface of the first ring and a first bottom surface of the top cover define a homogenized space communicating with the air inlet and the vent holes. The second ring couples with the first ring and has jet holes communicating with the vent holes. Outlets of the jet holes locate on a second bottom surface of the second ring. A first inner sidewall of the first ring and a second inner sidewall of the second ring define a pressure space. The probe connects with the wiring board and extends to the pressure space.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: January 1, 2019
    Assignee: MPI Corporation
    Inventors: Chin-Yi Tsai, Chien-Hung Chen
  • Temperature control system and method thereof
    Patent number: 10161995
    Abstract: A temperature control system and method are provided. The system includes a first channel, a second channel, a heating element, a DUT chamber, a converter, a first PID controller, and at least one switching regulator. The heating element is disposed downstream of the first and the second channels to heat the first air from the first channel or the second air from the second channel according to an input power so as to provide mixing air with a temperature into the DUT chamber. The converter converts an AC power to a DC power. The first PID controller provides a first input signal according to a first set point and an amount of power consumed by the heating element. The input power is adjusted by the switching regulator to drive the heating element according to the first input signal. Thus, the use of electrical power is more efficient.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: December 25, 2018
    Assignee: MPI CORPORATION
    Inventors: Helge Jacob Krystad, Ying-Chiao Chang, Yueh-Ying Lee
  • Vertical probe device and supporter used in the same
    Patent number: 10119991
    Abstract: A vertical probe device includes a lower die having engaging holes and needle holes, a positioning film having limiting holes and needle holes, probe needles inserted through the needle holes, and supporters having at least an upper stopping surface and at least a lower stopping surface for moveably limiting the positioning film therebetween. Each supporter has a head, a neck passing through the limiting hole and having a length longer than the thickness of the positioning film, a body, and a tail inserted into the engaging hole, which are connected in order, and at least one of the upper and lower stopping surfaces. The supporters can prevent the positioning film from being lifted and flipped over and enables the positioning film to move so that the probe needles are reliable.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: November 6, 2018
    Assignee: MPI CORPORATION
    Inventors: Tsung-Yi Chen, Horng-Kuang Fan, Ching-Hung Yang, Chung-Tse Lee, Chia-Yuan Kuo, Tien-Chia Li, Ting-Ju Wu, Shang-Jung Hsieh
  • Probe module with high stability
    Patent number: 10101362
    Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: October 16, 2018
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Hao Wei, Yu-Hao Chen, Chih-Hao Ho
  • Wafer cassette
    Patent number: 10096505
    Abstract: A wafer cassette includes a case, a plurality of wafer trays, and a plurality of transmission mechanisms. The wafer trays are disposed in the case. Each of the wafer trays includes a central opening, a first groove, and a second groove. The diameter of the second groove is greater than that of the first groove. A bottom surface of the second groove is higher than that of the first groove. The first and second grooves surround the central opening. Each of the transmission mechanisms is connected to the corresponding wafer tray to move the wafer tray between a pick-up position and a received position. Since the wafer tray has grooves with different diameters, the wafer tray is capable of receiving wafers with different sizes.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: October 9, 2018
    Assignee: MPI CORPORATION
    Inventors: Lin-Lin Chih, Chien-Hung Chen, Cheng-Rong Yang, Stojan Kanev
  • Probe card capable of transmitting high-frequency signals
    Patent number: 10067163
    Abstract: A probe card which is capable of transmitting high-frequency signals provided by a DUT, and the DUT includes an output pin group and an input pin group for sending and receiving the high-frequency signals respectively. The probe card includes a first signal pin group, a second signal pin group, and a band circuit. The first signal pin group is made of a conductive material, and is used to contact the output pin group; the second signal pin group is made of a conductive material too, and is used to contact the input pin group; the band circuit is electrically connected to the first signal pin group and the second signal pin group to allow signals within a first bandwidth and a second bandwidth to pass therethrough.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: September 4, 2018
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai
  • Testing jig
    Patent number: 10054627
    Abstract: A testing jig includes a substrate and a plurality of conductive elastic pieces, wherein the substrate has a recess and a plurality of circuits; the recess is located on a top surface of the substrate, while the circuits are provided on the top surface of the substrate. The conductive elastic pieces are provided on the substrate, and are respectively electrically connected to the circuits. Each of the conductive elastic pieces has a contact portion located within an orthographic projection range of the recess, wherein each of the contact portions contacts a pad of a DUT. Whereby, attenuation happens while transmitting test signals with high frequency can be effectively reduces by using the conductive elastic pieces to transmit test signals.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: August 21, 2018
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Hao Wei, Chia-Nan Chou, Chih-Hao Ho
  • Operating method for inspecting equipment
    Patent number: 10048844
    Abstract: The instant disclosure provides an operating method of inspecting equipment, with the method applicable to semiconductor inspecting equipment having a movable element. The method includes: displaying a wafer graphic by a touch display; detecting a touch signal generated by the touch display; detecting the magnification of the wafer graphic when the touch signal is generated; and determining the moving speed of the movable element based on the magnification of the wafer graphic when the touch signal is generated. In addition, the moving direction of the movable element can be determined according to the touch signal. Through the instant disclosure, the operator can more intuitively operate each movable element of semiconductor inspecting equipment.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: August 14, 2018
    Assignee: MPI CORPORATION
    Inventors: Stojan Kanev, Yung-Chin Liu, Andrej Rumiantsev, Yao-Chuan Chiang
  • Probe head of vertical probe card
    Patent number: 10041974
    Abstract: A probe head includes a probe base, a film, and a probe assembly. The probe base includes first, second, and third guiding boards. The second guiding board is fixed between the first and third guiding boards. The film is fixed to the probe base and has a hole. The probe assembly passes through the first, second, and third guiding boards and the hole, and includes a probe and an outer spring sleeve. The probe has a tip passing out through the third guiding board. The outer spring sleeve is sleeved at the exterior of the probe and has a spring area and a plurality of non-spring areas. The spring area is disposed between adjacent two of the non-spring areas. One of the non-spring areas has a bonding section mounted to the probe and retained between the third guiding board and the film.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: August 7, 2018
    Assignee: MPI Corporation
    Inventors: Tien-Chia Li, Yi-Ching Chuo
  • Temperature controlling equipment
    Patent number: 10036591
    Abstract: A temperature controlling equipment includes a connection head of a fluid output device, an isolation hood, a drying chamber and a dry air source. The connection head of the fluid output device has an output nozzle and a first fluid output pipe. The isolation hood has a hood body and a second fluid output pipe. The hood body defines a working space. The output nozzle is communicated with the working space. The second fluid output pipe is communicated with the working space and the first fluid output pipe. The first fluid output pipe and the second fluid output pipe have a connection interface in between. The connection interface is at least partially located in the drying chamber. The dry air source is communicated with the drying chamber and is configured to provide a dry air to the drying chamber.
    Type: Grant
    Filed: August 13, 2015
    Date of Patent: July 31, 2018
    Assignee: MPI Corporation
    Inventors: Yueh-Ying Lee, Helge Jacob Krystad, Ying-Chiao Chang
  • Testing machine and operation method thereof
    Patent number: 9958477
    Abstract: A test machine includes a base, a testing platform, a probe platform, a control lever, a temporary positioning mechanism and a damper. The testing platform connects with the base and carries a device under test. The probe platform connects with the base and moves along a longitudinal direction. The probe platform connects with a probe. The control lever connects with the base and the probe platform which is driven by the control lever to move along the longitudinal direction. The temporary positioning mechanism connects with the control lever and temporarily holds the probe platform and the control lever at a specific position. The damper connects with the base. When a distance between the probe and the DUT is shorter than a buffering distance, the damper abuts against the control lever or the probe platform to reduce a velocity of the probe moving towards the DUT.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: May 1, 2018
    Assignee: MPI Corporation
    Inventors: Yu-Hsun Hsu, Ban-Ban Lim
  • Probe card having configurable structure for exchanging or swapping electronic components for impedance matching
    Patent number: 9927487
    Abstract: A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: March 27, 2018
    Assignee: MPI CORPORATION
    Inventors: Chao-Ching Huang, Chih-Hao Ho, Wei-Cheng Ku
  • Probe card and test equipment with the same
    Patent number: 9903888
    Abstract: A probe card for contacting an LED chip of flip-chip type includes a circuit board, two probes and a fixing seat. The circuit board has a mounting surface and a lateral edge. Each probe has a connecting portion mounted on the circuit board, an extending portion extending from the connecting portion, a cantilever portion connected with the extending portion and protruding out of the lateral edge, and a contacting portion extending from the cantilever portion. The fixing seat is mounted on the mounting surface of the circuit board and has a fixing surface. A part of the extending portion is located between the circuit board and the fixing seat. A test equipment for testing optical characteristics of an LED chip of flip-chip type is provided with the probe card.
    Type: Grant
    Filed: August 13, 2015
    Date of Patent: February 27, 2018
    Assignee: MPI CORPORATION
    Inventors: Chia-Tai Chang, Hsiu-Wei Lin, Hung-Yi Lin
  • Fluid discharge device
    Patent number: 9889454
    Abstract: A fluid discharge device includes a discharge tube, an outer tube and at least one baffle. The discharge tube has a discharge port. The discharge tube has an end surface adjacent to the discharge port. The outer tube is sleeved outside the discharge tube. The outer tube has at least one passage. The passage is configured to flow a clean dry air. The passage has an outlet. The baffle is disposed outside the outlet. When the clean dry air passes through the outlet, at least part of the clean dry air is blocked by the baffle and is directed to the end surface of the discharge tube.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: February 13, 2018
    Assignee: MPI Corporation
    Inventors: Helge Jacob Krystad, Yueh-Ying Lee, Ying-Chiao Chang
  • Method of calibrating and debugging testing system
    Patent number: 9880252
    Abstract: A method of calibrating and debugging a testing system is provided. First, values of different electrical path segments are calibrated, and parameters of the electrical path segments while being calibrated are saved. After calibration, electrical tests can be processed on a DUT. If the testing system malfunctions, the values of the electrical path segments are calibrated again to compare the current parameters to the previously saved parameters. The component which goes wrong can be found out quickly in this way.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: January 30, 2018
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Shao-Wei Lu, Hao Wei, Yu-Tse Wang