Abstract: A thermal analysis method and apparatus, and a computer program that enable highly accurate heat transfer simulation of a structure or space, while reducing calculation costs. By performing thermal analysis on a structure or space using the calculation meshes generated by initial dividing means, the spatial distribution of heat flux vectors J and temperature gradient vectors ?T are calculated; by calculating the volume integrals of the inner products J·?T of the heat flux vectors J and the temperature gradient vectors ?T for individual partitioned regions and acquiring the absolute values of the volume integrals, thermal management sensitivity indices are calculated for the partitioned regions. Subsequently, partition of calculation meshes and subdivision of partitioned regions are performed on a predetermined number of partitioned regions that indicate greater indices among the calculated thermal management sensitivity indices, for example one partitioned region.

Abstract: An inductor component includes a base body, first and second inner wiring line inside the base body, an inter-layer insulation layer, and a via-wiring line. The inter-layer insulation layer is inside the base body, and between the first and second inner wiring lines. The inter-layer insulation layer includes first and second major faces and a via-hole. The first major face faces the first inner wiring line. The second major face faces the second inner wiring line. The via-hole extends through the inter-layer insulation layer between the first and second major faces. The via-wiring line is in the via-hole, and electrically connects the first and second inner wiring lines. As seen in a first cross-section including a center axis of the via-wiring line, the via-wiring line includes a first portion in contact with the first inner wiring line, and a second portion in contact with the second inner wiring line.

Abstract: A power amplifier circuit includes an amplifier transistor having a collector terminal, an emitter terminal, and a base terminal, bias circuits, and a current limiter circuit. The bias circuit includes a constant current amplifier transistor that supplies direct-current bias current from an emitter terminal to the base terminal. The current limiter circuit includes a current limiting transistor an emitter terminal of which is connected to the bias circuit, a resistive element connected between the current limiting transistor and a power supply terminal, and a resistive element connected between the current limiting transistor and the constant current amplifier transistor. The bias circuit includes a constant current amplifier transistor that supplies direct-current bias current i3 from an emitter terminal to the base terminal.

Abstract: A hydrocarbon reforming catalyst for producing a synthesis gas containing hydrogen and carbon monoxide from a hydrocarbon-based gas, the hydrocarbon reforming catalyst containing a complex oxide having a perovskite structure including at least Ba, Zr, and Ru; and a hydrocarbon reforming apparatus that includes the hydrocarbon-reforming catalyst.

Abstract: Disclosed herein is a stress sensor that includes a stress detection layer including a laminated body including a first ferromagnetic layer, a first non-magnetic layer, a second ferromagnetic layer, and an antiferromagnetic layer stacked one on another. The antiferromagnetic layer includes Mn, and the magnetization direction of the second ferromagnetic layer is fixed by the exchange bias caused by the exchange coupling with the antiferromagnetic layer. The stress sensor detects a stress by an electric resistance depending upon a relative angle between magnetization directions of the first ferromagnetic layer and the second ferromagnetic layer, the relative angle changing depending upon an externally applied stress.

Abstract: An electronic component includes an element body including two end surfaces opposite to each other and a bottom surface connected between the two end surfaces. A coil is provided in the element body and an external electrode is provided in the element body. In a first cross-section intersecting with the two end surfaces and the bottom surface of the element body, the external electrode has a first portion extending along a first surface that is one of the end surface and the bottom surface of the element body. The coil is disposed such that an outer circumferential edge of the coil faces the first surface of the element body. A shortest distance between the outer circumferential edge of the coil and the first surface of the element body is smaller than a minimum width of the first portion in a direction orthogonal to the first surface.

Abstract: A module includes: a board having a first surface; a first component and a second component mounted on the first surface; and a wire disposed to extend across the first component and having one end and the other end. The one end is connected to the second component. The wire is grounded.

Abstract: A coil component is capable of suppressing permeation of liquid or gas into a magnetic portion and increasing mechanical strength of the magnetic portion. A coil component includes a magnetic portion including soft magnetic metal particles having an insulating oxide layer on a surface thereof, with the soft magnetic metal particles being bonded to each other with the insulating oxide layer interposed therebetween; and a coil portion provided inside or on the surface of the magnetic portion. A mixture containing a resin and inorganic particles is disposed between the soft magnetic metal particles.

Abstract: In a coil device, a first coil includes a common terminal side first coil conductor connected to a ground terminal, an intermediate first coil conductor, and an input/output terminal side first coil conductor connected to a first input/output terminal, and a second coil includes a common terminal side second coil conductor connected to the ground terminal, an intermediate second coil conductor, and an input/output terminal side second coil conductor connected to a second input/output terminal. The input/output terminal side first coil conductor is located between the intermediate second coil conductor and the input/output terminal side second coil conductor, and the input/output terminal side second coil conductor is located between the intermediate first coil conductor and the input/output terminal side first coil conductor.

Abstract: A change in potential at a ground terminal is suppressed. A radio frequency module includes a mount board, a first circuit element, a second circuit element, a signal terminal (an antenna terminal, a signal input terminal, or a signal output terminal) for a radio frequency signal, and a block terminal. The mount board has a first principal surface and a second principal surface facing each other. The first circuit element is mounted on the first principal surface of the mount board. The second circuit element is mounted on the second principal surface of the mount board. The signal terminal (the antenna terminal, the signal input terminal, or the signal output terminal) is disposed on the second principal surface of the mount board. The block terminal is disposed on the second principal surface of the mount board. The block terminal includes a plurality of ground terminals.

Abstract: An amplifier device includes an amplifier including cascade-connected power amplifiers in a plurality of stages and a bias circuit configured to supply bias currents to the amplifier. A bias current supplied to a power amplifier in the first stage of the power amplifiers in the plurality of stages exhibits a positive temperature characteristic. A bias current supplied to a power amplifier in the final stage exhibits a negative temperature characteristic.

Abstract: An acoustic wave device includes an antenna terminal, a signal terminal, and a plurality of resonators that are provided on a piezoelectric substrate. The plurality of resonators include a plurality of series arm resonators on a series arm, and the duty of an IDT electrode of the series arm resonator closest to the antenna terminal among the plurality of series arm resonators is smaller than the duty of an IDT electrode of at least one series arm resonator among the other series arm resonators.

Abstract: Isolation between the first path and second path is increased. A radio frequency module includes a first inductor, a second inductor, a third inductor, and a switch. The first inductor is provided in a first path through which a first communication signal travels. The second inductor is provided in a second path through which a second communication signal travels, the second path being used simultaneously with the first path. The third inductor is provided in a third path through which a third communication signal travels, the third path not being used simultaneously with the first path. The switch is provided between ground and a node in the third path and is connected to the third inductor. The third inductor is arranged between the first inductor and the second inductor.

Abstract: A vibrating device includes a translucent cover, an ejector to eject a liquid onto the surface of the translucent cover, and a first vibrating portion to vibrate the translucent cover at a vibration acceleration of larger than about 8.0×105 m/s2 and equal to or smaller than about 21.0×105 m/s2.

Abstract: An acoustic wave filter includes series arm resonators and parallel arm resonators each including an acoustic wave resonator including an IDT electrode including a pair of comb-shaped electrodes each including electrode fingers and a busbar electrode. An electrode finger connected to neither of the busbar electrodes of the pair of comb-shaped electrodes is a floating withdrawal electrode, and of all the electrode fingers of the pair of comb-shaped electrodes, the electrode finger that is connected to a same busbar electrode to which the electrode fingers on both sides thereof are connected is a polarity-reversing withdrawal electrode, and, of the series arm resonators, the series arm resonator having a lowest anti-resonant frequency includes an IDT electrode including the floating withdrawal electrodes, and the series arm resonator includes an IDT electrode including the polarity-reversing withdrawal electrodes.

Abstract: A cover for covering an oral device that includes a first sheet member made of a first resin, and a second sheet member made of a second resin and facing the first sheet member, wherein when a first direction is a direction along a surface of the first sheet member and a second direction is a direction along the surface of the first sheet member and orthogonal to the first direction, the first sheet member and the second sheet member are joined to each other in a bag shape so as to define an opening at a first side in the first direction. A protruding portion protrudes from the second sheet member and past an outer edge of the first sheet member at the opening in the first direction.

Abstract: A multilayer resin substrate includes a base material including stacked resin layers including an opening resin layer, a conductor pattern, and an interlayer connection conductor. A concave portion is provided in the base material. The opening resin layer is closer to a first main surface than other resin layers. The concave portion includes a first opening portion provided by a cutting process from one surface of the opening resin layer, and another resin layer. The interlayer connection conductor is provided by filling a conductor in a second opening portion provided by a cutting process from an opposite surface of the opening resin layer. The end portion of the one surface of the first opening portion is not in contact with the conductor pattern.

Abstract: A battery includes a positive electrode, a negative electrode, and an electrolyte, and the positive electrode includes a substituted barium titanate.

Abstract: An electronic component includes a substrate and side wires. The substrate includes a first major surface, a second major surface, and a side surface. The side wires are on the side surface of the substrate and spaced apart from each other in a direction along an outer periphery of the substrate when viewed in plan in a thickness direction of the substrate. At least a portion of each of the side wires is provided indirectly on the side surface of the substrate. The electronic component further includes an electrically insulating layer interposed between the side surface of the substrate and the at least a portion of each of the side wires. Each of the side wires includes a bent portion bent when viewed in plan in the thickness direction of the substrate.

Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers that are alternately stacked, and outer electrodes that are electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite each other in a stacking direction, first and second side surfaces opposite each other in a width direction, and first and second end surfaces opposite each other in a length direction. At least one of the outer electrodes is located on at least one of the first side surface or the second side surface of the multilayer body and is directly connected to the inner electrodes at positions spaced away from the at least one of the first side surface or the second side surface toward the inside of the multilayer body.