Abstract: A module includes a substrate, metal layers and insulating layers laminated on the substrate, a bottom winding made of a metal directly contacting a first metal layer or a second metal layer, a first insulating layer on the bottom winding, a core on the first insulating layer, a second insulating layer on the core, a top winding made of the metal that is located on the core and a portion of the second insulating layer and that directly contacts the first metal layer or the second metal layer, and a third insulating layer on the top winding, electronic components that are located on the third insulating layer, where primary and secondary windings of the transformer are defined by portions of the bottom winding and the top winding and are located on opposite sides of the core from each other.

Abstract: A conductor non-formed portion where no conductor layer exists is provided in a first ground conductor layer. A multilayer body is provided with a void where no insulating resin exists. At least a portion of the conductor non-formed portion is provided in a first area positioned at a right of a first interlayer connection conductor with respect to a multilayer body left-right direction and at left of a second interlayer connection conductor with respect to the multilayer body left-right direction in a view in a multilayer body downward direction. At least a portion of a void overlaps with the conductor non-formed portion in the view in the multilayer body downward direction and is provided above a first signal conductor layer with respect to a multilayer body up-down direction and below the first ground conductor layer with respect to the multilayer body up-down direction.

Abstract: A load detection circuit includes a first detection part and a second detection part. The first detection part includes a first capacitor and a second capacitor, forms capacitive coupling with a signal transmission line connecting an output port of an RF amplifier and a load, and outputs a first signal. The second detection part includes a first inductor and a second inductor, forms inductive coupling with the signal transmission line, and outputs a second signal.

Abstract: A radio frequency signal having a constant amplitude is modulated by a digital modulation signal and a radio frequency input signal whose amplitude changes stepwise is generated. The radio frequency input signal is input into a power amplifier that is an evaluation target. A period in which an amplitude of the radio frequency input signal is constant is defined as a measurement period and an output signal of the power amplifier is measured in each of measurement periods in which amplitudes of the radio frequency input signal are different from each other.

Abstract: An electronic device that includes a base member made of a material containing metal atoms, the base member having a bonding surface, and the bonding surface contains oxides of the metal atoms; an electronic element is mounted on the base member; an organic structure on the bonding surface of the base member; and a cover member bonded to the bonding surface of the base member via the organic structure so as to encapsulate the electronic element in a space between the base member and the cover member.

Abstract: Increase in power-added efficiency can be achieved. A second base of a second transistor is connected to a first collector of a first transistor. A third base of a third transistor is connected to the first collector of the first transistor, and a third collector of the third transistor is connected to a second collector of the second transistor. A second bias circuit includes a fifth transistor connected to the second base of the second transistor. A third bias circuit includes a sixth transistor connected to the third base of the third transistor. A first current limiting circuit includes a seventh transistor, a first collector resistor, and a first base resistor. A second current limiting circuit includes an eighth transistor, a second collector resistor, and a second base resistor.

Abstract: The present disclosure facilitates impedance matching between a power amplifier and filters. A radio-frequency circuit includes a power amplifier, a plurality of transmit filters, a switch, a plurality of first matching networks, and a second matching network. The switch switches the plurality of transmit filters to be coupled to the power amplifier. The plurality of first matching networks are coupled between the plurality of transmit filters and the switch. The second matching network is coupled between the power amplifier and the switch. The second matching network includes a transmission line transformer.

Abstract: An acoustic wave device includes a piezoelectric substrate made of LiNbO3, and a dielectric film provided on the piezoelectric substrate to cover first and second IDT electrodes on the piezoelectric substrate. The first and second IDT electrodes include main electrode layers. When wave lengths determined by electrode finger pitches of the first and second IDT electrodes are ?1 and ?2, respectively, the average value thereof is ?0, ?1/?0=1+X, and ?2/?0=1?X, a relationship of 0.05?X?0.65 is satisfied. The wavelength ?1 is the longest, and the wavelength ?2 is the shortest. In Euler angles (?, ?, ?) of the piezoelectric substrate, ? is 0°±5°, ? is 0°±10°, and ? satisfies Expression 1, wherein a relationship of B1<T×r?0.10?0 and B2<T×r?0.10?0 are satisfied.

Abstract: A first portion and a second portion are connected to a first surface of a connection portion having the first surface and a second surface opposite to the first surface. A first radiating element is disposed on the first portion, and a second radiating element is disposed on the second portion. The connection portion includes a first flat board portion, a bent portion extending from the first flat board portion, and bent to have the first surface facing outward, and a second flat board portion further extended from the bent portion.

Abstract: A radio frequency circuit includes a filter with a pass band including at least a part of a band (A) for TDD; a filter with a pass band including at least a part of the band (A); and a switch circuit that has (i) a first mode in which the filter is connected between an antenna connection terminal and a radio frequency input terminal, (ii) a second mode in which the filter is connected between the antenna connection terminal and a radio frequency output terminal, and (iii) a third mode in which the filters are connected in series between the antenna connection terminal and the radio frequency input terminal or between the antenna connection terminal and the radio frequency output terminal.

Abstract: An inductor including a component main body having a multilayer structure formed with stacked non-conductive material layers; and a coil inside the component main body and configured of line conductors each extending along an interface between the non-conductive material layers and via conductors penetrating through the non-conductive material layers to a thickness direction. The line conductors each have pad portions connected to the via conductors and line wire portions connected to the pad portions. The coil has a shape of extending along a helical path with the line conductors and the via conductors alternately connected, in which the via conductors include a longitudinal via conductor in a longitudinal shape extending along the line conductor. The pad portions include a longitudinal pad portion connected to the longitudinal via conductor, and a width-direction dimension of the longitudinal pad portion is larger than a width-direction dimension of the line wire portion.

Abstract: A power amplifier circuit includes an amplifier transistor which amplifies a radio frequency signal applied to its base and outputs the amplified signal; a resistance element having a first end, and a second end electrically connected to the base of the amplifier transistor; a first bias transistor having a collector to which a first voltage is applied, a base to which a first bias voltage is applied, and an emitter electrically connected to the first end of the resistance element and which supplies a bias current to the base of the amplifier transistor through the resistance element; and a second bias transistor having an emitter electrically connected to the emitter of the first bias transistor and the first end of the resistance element, a base to which a second bias voltage is applied, and a collector to which a second voltage lower than the first voltage is applied.

Abstract: An acoustic wave device includes a piezoelectric layer that is made of lithium niobate or lithium tantalate, and a plurality of pairs of electrodes opposed to each other in a direction intersecting with a thickness direction of the piezoelectric layer, in which a bulk wave in a thickness shear primary mode is used or d/p is about 0.5 or lower when a thickness of the piezoelectric layer is d and a distance between centers of mutually adjacent electrodes among the plurality of pairs of electrodes is p. The plurality of pairs of electrodes include at least one pair of first electrodes of a first acoustic wave resonator and at least one pair of second electrodes of a second acoustic wave resonator. A direction orthogonal to a longitudinal direction of the second electrodes in the second acoustic wave resonator is inclined at an angle that is greater than 0° and smaller than 360° with respect to a direction orthogonal to a longitudinal direction of the first electrodes in the first acoustic wave resonator.

Abstract: A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.

Abstract: An in-vivo implantable electronic device includes a housing, a power reception coil, and an electronic circuit. The housing is formed of a biocompatible material and forms an internal space sealed. The power reception coil is disposed in the internal space of the housing and receives power by interacting with an electromagnetic field formed by an external electric field or magnetic field, or transmits an electromagnetic wave to the outside. The electronic circuit is disposed in the internal space, is connected to the power reception coil, and performs at least processing of an electric signal. The housing includes a first member in a box shape formed of a biocompatible metal material and having an opening, a second member formed of a biocompatible nonmetal material and having a shape that closes the opening, a packing in an annular shape disposed between the first member and the second member.

Abstract: A magneto-resistive element includes a first element section including a first unit element and a second element section including a second unit element. The first element section is connected to the second element section in series. The first unit element includes a first reference layer with a magnetization that is fixed in an in-plane direction, and a first free layer including a vortex magnetization. The second unit element includes a second reference layer with a magnetization that is fixed in an in-plane direction, and a second free layer including a vortex magnetization. A direction of the fixed magnetization of the first reference layer is opposite to that of the second reference layer.

Abstract: A mounting structure of an electronic component includes a multilayer ceramic capacitor including lands on a board and spaced apart from each other, solder on the lands, and a component main body including external electrodes on both end portions of the component main body in a length direction, each of the pair of external electrodes being connected to a corresponding one of the pair of lands via the solder. When a separation direction of the lands is an X direction and a direction orthogonal or substantially orthogonal to the X direction is a Y direction, when a width dimension of the land along the Y direction is c, a dimension of each of the external electrodes in the X direction is e, and a gap between the land and the external electrode is Gap, 3.4<(c×e)/Gap<258.8 is satisfied.

Abstract: A resonance device is provided that includes a resonator having a base, a vibrating arm extending from one end of the base along a first direction, a frame disposed around at least a part of the vibrating arm and holding the vibrating arm such that the vibrating arm is configured to vibrate, and a support arm connecting the base to the frame. Moreover, a first substrate is provided that includes a first recess forming at least a part of a vibration space for the resonator and a first limiting portion provided away from the support arm by a first distance in a thickness direction, in which the first distance is smaller than a distance between a bottom surface of the first recess and the vibrating arm in the thickness direction of the first substrate.

Abstract: A surface acoustic wave device includes a piezoelectric substrate including principal surfaces and an IDT electrode on a first principal surface side of the principal surfaces, and the first principal surface is a polarization positive potential surface of the piezoelectric substrate.

Abstract: A secondary battery includes an outer package member, a battery device, a wiring member, and a sealing member. The outer package member has flexibility and has an opening. The battery device is accommodated inside the outer package member. The wiring member extends from an inside of the outer package member to an outside of the outer package member via the opening. The wiring member is coupled to the battery device. The sealing member has an insulating property. The sealing member extends along the wiring member from the inside of the outer package member at least to the opening, and is interposed between the battery device and the wiring member. The sealing member is configured to seal the opening.