Abstract: Here is described an electrode material comprising an electrochemically active metallic film and an organic compound, e.g. an indigoid compound (indigo blue or a derivative or precursor thereof). Processes for the preparation of the electrode material and electrodes containing the material, as well as to the electrochemical cells and their use are also contemplated.

Abstract: A coil component includes: a core that includes a winding-core portion and a flange portion that is formed on an end surface of the winding-core portion; a wire that is wound around the winding-core portion; and an outer electrode that is formed on a bottom surface of the flange portion, to which an end portion of the wire is connected, and that includes a first metal layer that forms a surface of the outer electrode. At least a part of the end portion of the wire is embedded in the first metal layer.

Abstract: A balun includes: an unbalanced terminal; a first and a second balanced terminals; a first and a second main lines; a first and a second sub-lines; and a first line. The first main line has a first end connected to the unbalanced terminal. The second main line has a first end connected to a second end of the first main line, and a second end that is open. The first sub-line is connected between the first balanced terminal and a reference potential, and is coupled to the first main line. The second sub-line is connected between the second balanced terminal and the reference potential, and is coupled to the second main line. The first line has a first end connected to the midpoint of the first sub-line, and a second end that is open. The first line is coupled to the first main line and the first sub-line.

Abstract: An integrated circuit (IC) includes a first switch, a second switch, and an amplifier electrically connected between the first switch and the second switch. An RF signal path passes through first switch, the amplifier, and the second switch in this order. The IC includes an input terminal and an output terminal that are to be connected to each other between the first switch and the amplifier or between the amplifier and the second switch outside of the IC with a component connected therebetween. In a top view of the IC, a first region of the first switch, a second region of the amplifier, and a third region of the second switch are disposed on a straight line such that a virtual straight line connects any point of the first region, any point of the second region, and any point of the second region in this order.

Abstract: An inductor component comprising a spiral wiring wound on a plane; first and second magnetic layers located at positions sandwiching the spiral wiring from both sides in a normal direction relative to the plane of the wound spiral wiring; a vertical wiring extending from the spiral wiring in the normal direction to penetrate at least the inside of the first magnetic layer; and an external terminal disposed on at least a surface of the first magnetic layer to cover an end surface of the vertical wiring. The first magnetic layer is larger than the second magnetic layer in terms of the area of the external terminal viewed in the normal direction, and when A is the thickness of the first magnetic layer and B is the thickness of the second magnetic layer, A/((A+B)/2) is from 0.6 to 1.6.

Abstract: A coil component includes a drum core including a core portion, first and second flange portions; first, second, third and fourth outer electrodes; and first and second wires. When the first wire is traced from a first wire end to a second wire end, a turn including a last point that makes contact with an outer surface of the core portion is referred to as an N-th turn. When the second wire is traced from a first wire end to a second wire end, a turn including a last point that makes contact with the outer surface of the core portion is referred to as an M-th turn. The M-th turn of the second wire and the N-th turn of the first wire do not include an intersection portion at which the M-th turn of the second wire and the N-th turn of the first wire intersect.

Abstract: An inductor component includes an element body including an insulator; a coil inside the element body; and a first outer electrode electrically connected to the coil. The element body includes first and second end surfaces opposed to each other in a length direction, first and second main surfaces opposed to each other in a height direction perpendicular to the length direction, and first and second side surfaces opposed to each other in a width direction perpendicular to the length and height directions. The first end surface intersects the first main surface on a first ridge line. The second end surface intersects the first main surface on a second ridge line. The first outer electrode includes a first electrode layer embedded in the element body such that at least part of the first electrode layer is exposed from the element body.

Abstract: A coil component includes a drum core including a core portion and first and second flange portions; first, second, third and fourth outer electrodes; and first and second wires. The second wire includes first and second winding portions. The first winding portion is a portion including plural turns wound around an outer periphery of the first wire. The second winding portion is on a second wire end side relative to the first winding portion and includes less than 1.0 turn continuously wound around the outer periphery of the first wire. The first winding portion includes a first traverse portion, which runs across the first wire without running in the same layer as the first wire in one turn immediately preceding an end portion of the first winding portion where the end portion is the closest to the second wire end in the first winding portion.

Abstract: A coil component includes a core including a winding core extending in an axial direction and a first flange portion and a second flange portion provided on respective both end portions, in the axial direction, of the winding core; electrodes including a first electrode and a second electrode provided on the first flange portion and the second flange portion, respectively; and a first wire wound around the winding core and including a first end portion joined to the first electrode and a second end portion joined to the second electrode. The first electrode has a first joint surface to which the first end portion is joined, at least one protrusion is provided on the first joint surface, and the first end portion is joined to the first joint surface with the first wire passing over the at least one protrusion provided on the first joint surface.

Abstract: A transmission line includes a ground electrode, a first line, and a second line, and transfers a radio frequency signal. The first line is disposed to face the ground electrode and constitutes a microstrip line together with the ground electrode. The second line faces the first line and is disposed along the first line. The second line constitutes a resonator for the first line. The first line is disposed between the second line and the ground electrode.

Abstract: A radio frequency circuit includes a switch having selection terminals, a switch, a filter connected to the selection terminal, a filter connected to the selection terminal, and a filter. The switch is connected in series to and between the filter and a path connecting the selection terminal and the filter.

Abstract: A multilayer substrate includes an insulator that includes a first region and a second region that is thinner than the first region, and a first signal line and a second signal line that are structured to extend across the first region and the second region. In a region in which the first signal line and the second signal line face each other, a line width of the first signal line and a line width of the second signal line are smaller in the second region than in the first region, and a distance between the first signal line and the second signal line is smaller in the second region than in the first region.

Abstract: Communications devices are disclosed. A communications device includes an unlicensed national information infrastructure frequency range 1 (U-NII-1) to U-NII-2A transceiver coupled to a first antenna though a U-NII-1 to U-NII-2A coexistence filter, and a U-NII-2C to U-NII-8 transceiver coupled to a second antenna though a U-NII-2C to U-NII-8 coexistence filter.

Abstract: A power supply circuit includes a transformer having a primary winding and secondary windings, a first power conversion circuit configured to convert a DC voltage into an AC voltage and output the AC voltage to the primary winding, a rectifying and smoothing circuit that is connected to the secondary winding and is configured to rectify and smooth an alternating current output from the secondary winding, and a second power conversion circuit configured to boost a direct current output from the rectifying and smoothing circuit and supply to a load a DC voltage lower than a rated voltage of the load set in advance.

Abstract: An acoustic wave device includes a silicon support substrate, a silicon nitride film on the support substrate, a silicon oxide film on the silicon nitride film, a piezoelectric layer on the silicon oxide film and using Y-cut X-SAW propagation lithium tantalate, and an IDT electrode on the piezoelectric layer. A film thickness of the piezoelectric layer is equal to or less than about 1?, Euler angles of the piezoelectric layer are (0±5°, ?, 0±5°) or (0±5°, ?, 180±5°), ? in the Euler angles of the piezoelectric layer is about 95.5°??<117.5° or about ?84.5°??<?62.5°, and a relationship between ? in the Euler angles of the piezoelectric layer and a film thickness of the silicon nitride film is a combination shown in Table 1 or Table 2.

Abstract: A film capacitor that includes a capacitor element including one or more wound or laminated metallized films, each metallized film including a dielectric resin film and a metal layer on one surface of the dielectric resin film; a cover covering an outer surface of the capacitor element in a direction in which layers of the dielectric resin film are laminated with the metal layer therebetween; and an exterior body covering an outer periphery of the capacitor element and an outer surface of the cover. In a first aspect, the dielectric resin film contains a curable resin as a main component thereof, and the cover is made of a thermoplastic resin.

Abstract: An electronic component that has fewer cracks during production is provided. The electronic component includes an outer electrode on a multilayer body, which includes an inner glass layer, a magnetic material layer on top and bottom surfaces of the inner glass layer, and an outer glass layer on top and bottom surfaces of the magnetic material layer. The insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina. The glass material content of each insulating layer of the inner glass layer ranges from approximately 60%-65% by weight, the quartz content of each insulating layer of the inner glass layer ranges from approximately 34%-37% by weight, and the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5%-4% by weight.

Abstract: An electronic component includes a laminate in which first internal electrodes and second internal electrodes are alternately laminated in a lamination direction with dielectric layers interposed therebetween, the laminate including a first main surface and a second main surface opposite to each other in the lamination direction, a first side surface and a second side surface opposite to each other in a width direction, and a first end surface and a second end surface opposite to each other in a length direction, a first external electrode provided on a surface of the laminate and electrically connected to the first internal electrodes, a second external electrode provided on a surface of the laminate and electrically connected to the second internal electrodes, and side margin portions each including a dielectric including Ca, Zr, and Ti.

Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The external electrodes each include a first Sn plated layer that covers an outer surface of the interposer board in a vicinity of at least one board end surface.

Abstract: An electrolytic solution includes at least one compound of a first oxazoline-based compound having a molecular weight of 200 or less and a second oxazoline-based compound having a molecular weight of 200 or less, and the electrolytic solution includes no dioxolane.