Abstract: A bandpass acoustic wave filter device includes an IDT electrode and a dielectric film disposed on a piezoelectric substrate including a LiNbO3 layer, and an acoustic wave resonator is defined by the IDT electrode. The acoustic wave resonator utilizes the Rayleigh wave, and a response of an SH wave excited by the acoustic wave resonator is outside a pass band of the acoustic wave filter device.

Abstract: An antenna module includes feeding elements arranged adjacent to each other and filters connected to the respective feeding elements. Each of the filters includes a plurality of resonant lines that is not connected to each other. The filters are arranged between the feeding elements so as to cross a virtual line equidistant from the feeding elements when the antenna module is viewed in plan from the normal direction.

Abstract: Methods and devices to mitigate time varying impairments in sensors are described. The application of such methods and devices to pressure sensors facing time varying parasitic capacitances due to water droplets is detailed. Benefits of auto-zeroing technique as adopted in disclosed devices is also described.

Abstract: Acoustic resonators, filters and methods of making resonators are disclosed. An acoustic resonator includes a substrate, a piezoelectric plate, and an acoustic Bragg reflector between a surface of the substrate and a back surface of the piezoelectric plate. An interdigital transducer (IDT) on a front surface of the piezoelectric plate includes first and second busbars and a plurality of interleaved fingers extending alternately from the first and second busbars. At least a portion of the first busbar contacts the substrate through an opening in the piezoelectric plate and acoustic Bragg reflector.

Abstract: An inductor that includes a body having a magnetic portion containing a magnetic powder and a first resin; a coil that is encapsulated in the body and includes a winding portion formed by winding a conductor and a pair of lead-out portions that extend from the winding portion; and a pair of outer electrodes to which at least end portions of the lead-out portions are connected at surfaces of the body. The outer electrodes each includes an electrically conductive resin layer and a first cover layer arranged on the electrically conductive resin layer. The electrically conductive resin layers each contain an electrically conductive powder and a second resin and a plurality of electrically conductive metal portions composed of the same material as the first cover layers are contained inside the electrically conductive resin layers.

Abstract: An electronic component includes a mounting substrate, and first and second devices each including a functional element. The first device is spaced apart from and faces the mounting substrate. The second device is located on the mounting substrate and faces the first device. A functional element of the first device is located on a first surface facing the second device, in the first device. A functional element of the second device is located on a second surface facing the first device, in the second device.

Abstract: An electronic component module that includes a substrate, an inductor element, a single-sided functional component, a sealing resin, and an electromagnetic shield. The inductor element is mounted on the substrate. The single-sided functional component is mounted on a base ground conductor and a base signal conductor that are disposed on a side of the inductor element opposite to the substrate. The sealing resin has an insulating property and covers the inductor element, the base ground conductor, the base signal conductor, and the single-sided functional component. The electromagnetic shield covers the sealing resin, and a ground surface of the single-sided functional component.

Abstract: An acoustic wave device includes a substrate, a first resonator, a second resonator, and a shared reflector. The second resonator is adjacent to the first resonator and has different frequency characteristics different than the first resonator. The first resonator includes a first interdigital transducer electrode. The second resonator includes a second interdigital transducer electrode. The shared reflector has frequency characteristics that are the same as both frequency characteristics of the first resonator and frequency characteristics of the second resonator or between the frequency characteristics of the first resonator and the frequency characteristics of the second resonator. a higher-order mode frequency of the first resonator and a higher-order mode frequency of the second resonator coincides.

Abstract: Provided is a secondary battery where a positive electrode includes a first covered part covered with a positive electrode active material layer and a positive electrode active material non-covered part on a positive electrode foil, and a negative electrode includes a second covered part covered with a negative electrode active material layer and a negative electrode active material non-covered part on a negative electrode foil, one or both of the positive electrode active material non-covered part and the negative electrode active material non-covered part have a surface formed by bending toward the central axis of the wound structure and overlapping each other, and the surface is joined to the positive electrode current-collecting plate or the negative electrode current-collecting plate.

Abstract: Acoustic resonators, filters, and methods. An acoustic resonator includes a substrate, a piezoelectric plate, and a diaphragm including a portion of the piezoelectric plate spanning a cavity in a substrate. An interdigital transducer (IDT) on a front surface of the piezoelectric plate includes first and second sets of interleaved interdigital transducer (IDT) fingers extending from first and second busbars respectively. The interleaved IDT fingers extend onto the diaphragm. Overlapping portions of the interleaved IDT fingers define an aperture of the acoustic resonator. First and second dielectric strips are on the front surface of the piezoelectric plate. Each dielectric strip has a first portion under the IDT fingers in a respective margin of the aperture and a second portion extending into a gap between the respective margin and the respective busbar.

Abstract: A module (101) includes a substrate (1) having a first main surface (1a) and including wiring, a first component (31) having a circuit surface (31a), mounted on the first main surface (1a) such that the circuit surface (31a) faces the first main surface (1a), and having a ground terminal (10) on the circuit surface (31a), a first sealing resin (6a) disposed to cover the first main surface (1a) and the first component (31), and a heat dissipation portion (5) provided along an upper surface of the first sealing resin (6a). The wiring is connected to the ground terminal (10), and the module further includes a heat conducting member (7) connecting the wiring and the heat dissipation portion (5).

Abstract: A resonance device that includes a MEMS substrate including a resonator, an upper lid that seals a vibration space of the resonator, and a ground portion positioned between the MEMS substrate and the upper lid, the ground portion being extended to an inside of the upper lid and electrically connected to the upper lid.

Abstract: A piezoelectric resonator unit that includes a base, a cover, and a laminated structure disposed between the base and the cover. The laminated structure includes a piezoelectric resonator having a piezoelectric layer with a pair of principal surfaces facing each other, and a pair of excitation electrodes disposed on respective surfaces of the pair of principal surfaces so as to face each other with the piezoelectric layer therebetween, a semiconductor layer laminated on a side of one of the pair of principal surfaces of the piezoelectric layer, and a pair of measurement electrodes provided on the semiconductor layer. The pair of measurement electrodes measure signals based on temperature of the piezoelectric resonator through the semiconductor layer.

Abstract: Acoustic resonators, filters, and methods. A filter includes a piezoelectric plate supported by a substrate; and three or more diaphragms of the piezoelectric plate spanning a respective cavity in the substrate. A conductor pattern on the plate has interdigital transducers (IDTs) of three or more acoustic resonators. Each IDT has two sets of interleaved fingers extending from two busbars respectively. Overlapping portions of the fingers define an aperture of each acoustic resonator. Sometimes, each of the resonators has two dielectric strips that overlap the IDT fingers in first and second margins of the aperture and that extend into first and second gaps between the first and second margins and the busbars. Other times, the first and second dielectric strips are on the front surface of the plate, have a first portion under the IDT fingers and have a second portion extending into a gap between the margins and the busbars.

Abstract: A filter includes first and second shunt resonators, at least one series resonator connected to the first and second shunt resonators in a ladder filter circuit, and a first ground contact pad. The first shunt resonator has two or more first sub-resonators and the second shunt resonator has two or more second sub-resonators. At least one first sub-resonator and at least one, but less than all, of the two or more second sub-resonators are connected to the first ground contact pad.

Abstract: Circuits and methods that enable stable and reliable “hot switching” from one antenna to another without turning RF power to the antennas OFF in wireless RF systems during at least some transmission events. One embodiment comprises an RF switch circuit including a common port configured to pass an RF signal, a plurality of switch arms each coupled to the common port and including an associated port, and a shunt termination impedance selectively couplable to the common port through a switch. Another embodiment comprises a method for switching an RF signal applied to a common port of a switch from a first switch arm initially in an ON state to a second switch arm initially in an OFF state, including: setting the second switch arm to the ON state, and then setting the first switch arm to the OFF state.

Abstract: A 5 GHz Wi-Fi bandpass filter includes a ladder filter circuit with two or more shunt transversely-excited film bulk acoustic resonators (XBARs) and two or more series XBARs. Each of the two or more shunt XBARS includes a diaphragm having an LN-equivalent thickness greater than or equal to 360 nm, and each of the two or more series XBARS includes a diaphragm having an LN-equivalent thickness less than or equal to 375 nm.

Abstract: Circuits and methods that enable stacking of phase change material (PCM) switches and that accommodate variations in the resistance of the resistive heater(s) of such switches. Stacking is enabled by providing isolation switches for the resistive heater(s) in a PCM switch to reduce parasitic capacitance caused by the proximity of the resistive heater(s) to the PCM region of a PCM switch. Variations in the resistance of the resistive heater(s) of a PCM switch are mitigated or eliminated by sensing the actual resistance of the resistive heater(s) and then determining a suitable adjusted electrical pulse profile for the resistive heater(s) that generates a precise thermal pulse to the PCM region, thereby reliably achieving a desired switch state while extending the life of the resistive heater(s) and the phase-change material.

Abstract: A coil component includes a core including a winding core portion and a first flange portion, a first wire and a second wire that are wound around the winding core portion in the same direction, and a first terminal electrode that is disposed on the first flange portion and that is connected to a first end portion of the first wire. The shape of an outer edge of the first terminal electrode includes a convex curve.

Abstract: An inductor component includes an element body, a coil provided in the element body, and an outer electrode provided to the element body and electrically connected to the coil. The outer electrode includes an underlying layer embedded in the element body in which part of the underlying layer protrudes from a surface of the element body, and a coating film that covers a portion of the underlying layer exposed at the element body.