Abstract: A conductive composition includes conductive particles, a thermoplastic resin, and a solvent, wherein a glass transition temperature of the thermoplastic resin is 140 to 200 degrees C.

Abstract: To suppress the bias of the distribution of a filler dispersed in a sealing material (cured product) covering an electrode connection portion, provided is an epoxy resin composition, including: (A) an epoxy resin; (B) a curing agent; (C) a filler; and (D) an ionic compound in which at least one of a cation or an anion is organic matter.

Abstract: A conductive paste that can reduce an increase in electrical resistance caused by stretching of a wiring when the wiring of an electrical circuit and/or an electronic circuit is formed on a surface of a stretchable and/or bendable base material. The stretchable conductive paste includes (A) surface-treated silver particles and (B) a thermoplastic resin. The (A) surface-treated silver particles include a surface-treated layer.

Abstract: Provided are a varistor forming paste, a cured product thereof, and a varistor, that can increase the degree of freedom in designing an electronic device, and can exhibit appropriate varistor characteristics. The varistor forming paste contains an epoxy resin (A), a curing agent (B), and a carbon aerogel (C).

Abstract: An alumina composite sol composition includes (A) an alumina sol containing an alumina hydrate, (B) an alkoxysilane compound, (C) a polyvalent organic acid, and (D) a solvent, wherein the amount of the alumina hydrate in the alumina sol (A) is 3 to 11% by mass.

Abstract: There are provided a syringe filled with a resin composition and a storage method thereof. According to the syringe and the storage method, mixed air, which causes the resin composition to be intermittently discharged from the syringe, is suppressed. The syringe filled with the resin composition includes a syringe, a resin composition filling the syringe, and a plunger. The resin composition contains voids. The ratio of the volume of the voids relative to the volume of the resin composition is 1.0 ppm by volume to 520 ppm by volume. The voids have a maximum diameter of 2,500 ?m or less.

Abstract: A base-releasing composition which suppresses release of a basic compound at room temperature and rapidly releases the basic compound under predetermined conditions. The base-releasing composition includes (A) a side-chain crystalline (meth)acrylate copolymer includes (i) repeating units each derived from an ester of a C8-C32 saturated, linear primary alcohol with acrylic acid or methacrylic acid and (ii) repeating units each derived from acrylic acid or methacrylic acid, and (B) a basic compound. The amount of basic groups in the (B) basic compound is 0.01 to 1.00 mmol per 1 g of the base-releasing composition, and at least a portion of the Component (B) is included in the Component (A). A curable resin composition includes a specific 2-methylene-1,3-dicarbonyl compound in combination with the base-releasing composition.

Abstract: A conductive paste contains (A) copper fine particles having an average particle diameter of 50 nm to 400 nm and a crystallite diameter of 20 nm to 50 nm, (B) copper particles having an average particle diameter of 0.8 ?m to 5 ?m and a ratio of a crystallite diameter to the crystallite diameter of the copper fine particles (A) of 1.0 to 2.0, and (C) a solvent.

Abstract: [Problem] An object is to provide novel composite copper foils. [Means to solve the problem] A composite copper foil comprises a copper foil and a layer of metal other than copper, the metal layer being formed on at least a part of a surface of the copper foil, wherein at least a part of the composite copper foil has protrusions on a surface thereof, and each protrusion has a height of 10 nm or more but 1000 nm or less in a cross-section of the composite copper foil.

Abstract: A resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) an initiator comprising at least one basic substance, and (c) an anionic polymerization inhibitor including at least one borate ester compound.

Abstract: Provided is an antenna-equipped semiconductor package which is excellent in solder heat resistance and has low transmission loss. In the antenna-equipped semiconductor package 100 in which an antenna unit 5 is integrally formed in a semiconductor device unit 10, at least one of an insulating layer 1 for connecting the semiconductor device unit 10 and the antenna unit 5 and an insulating layer 1 inside the antenna unit is a cured product of a resin composition including (A) a styrene-based elastomer having a double bond and (B) a compound generating a radical.

Abstract: A conductive paste that can reduce an increase in electrical resistance caused by stretching of a wiring when the wiring of an electrical circuit and/or an electronic circuit is formed on a surface of a stretchable and/or bendable base material. The stretchable conductive paste includes (A) surface-treated silver particles and (B) a thermoplastic resin. The (A) surface-treated silver particles include a surface-treated layer.

Abstract: A method for producing a semiconductor element by wafer-level chip-size packaging includes applying a liquid compression molding material to a wafer after completion of circuit formation and subjecting the wafer to sealing treatment by compression molding. The liquid compression molding material includes (A) an epoxy resin; (B) a curing agent; and (C) a filler. The liquid compression molding material having a thixotropic index (TI) of 0.8 to 4.0.

Abstract: A residual thermal strain distribution measurement method of measuring a residual thermal strain distribution as residual thermal deformation in a sample generated under application of a thermal load, comprises recording images of a periodic pattern present on the surface of the sample by an image recording unit at a first temperature and a sample formation temperature at which the sample is formed, generating moire fringes based on each recorded image of the periodic pattern, calculating a phase of the moire fringes for the sample at the first temperature, calculating a phase of the moire fringes for the sample at the sample formation temperature, acquiring a phase difference of the moire fringes at the sample formation temperature with respect to the first temperature, and calculating a residual thermal strain of the sample at the first temperature with respect to the sample formation temperature based on the acquired phase difference.

Abstract: A polymerizable composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound and (b) at least one ionic compound including a specific anion.

Abstract: An object of the present invention is to provide a photocurable resin composition which is quickly cured through anionic polymerization even by irradiation with ultraviolet light from a ultraviolet light-emitting diode in the UV-A or UV-B range, the resin composition suitable for the manufacture of electronic components. The photocurable resin composition of the present invention comprises (a) a 2-methylene-1,3-dicarbonyl compound, (b) an ionic photo base generator and (c) a photo-sensitizer. The 2-methylene-1,3-dicarbonyl compound is a compound comprising at least one specific structural unit, and the ionic photo base generator is a salt comprising specific anion (i) and cation (ii).

Abstract: A low-voltage varistor includes a cured body of a resin composition for forming the low-voltage varistor. The resin composition includes: (A) at least one selected from carbon nanotubes and carbon aerogels; and (B) at least one selected from epoxy resin and acrylic resin.

Abstract: A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below.

Abstract: There is provided a syringe filled with a resin composition which prevents a barrel cap from being detached due to temperature change during storage or during transportation, a production method thereof, and a storage method thereof. This syringe filled with the resin composition includes a syringe having a syringe barrel, a resin composition filling the syringe barrel, a plunger inserted in the syringe barrel, a barrel cap blocking an opening of the syringe barrel, and a spatial part between the plunger and the barrel cap in the syringe barrel. The pressure of the spatial part in a frozen state is 50 kPa to 92 kPa.

Abstract: A resin composition suppresses unintended curing of a 2-methylene-1,3-dicarbonyl compound in the presence of conductive particles to facilitate the production of a paste including the 2-methylene-1,3-dicarbonyl compound for electronic components. The resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) at least one type of conductive particles and (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more.