Patents Assigned to Namics Corporation
-
Publication number: 20230042359Abstract: An electromagnetic shielding composition includes silver particles (A), and a first solvent (B). The first solvent (B) has at least one structure selected from the group consisting of a structure represented by the formula (1) and a structure represented by the formula (2) and has a boiling point of less than 200° C.Type: ApplicationFiled: December 4, 2020Publication date: February 9, 2023Applicant: NAMICS CORPORATIONInventors: Takashi YONEDA, Yoshitaka KAMATA, Noriyuki SAKAI, Hironobu TSUBURA, Satomi KAWAMOTO, Yoshito YAMADA
-
Patent number: 11518867Abstract: To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.Type: GrantFiled: December 12, 2018Date of Patent: December 6, 2022Assignee: NAMICS CORPORATIONInventors: Masashi Kajita, Ayako Sato
-
Patent number: 11485848Abstract: There is provided a pre-applied semiconductor sealing film for curing under pressure atmosphere as a non conductive film (NCF) suitable for pressure mounting. This NCF includes (A) a solid epoxy resin, (B) an aromatic amine which is liquid at room temperature and contains at least one of structures represented by formulae 1 and 2 below, (C) a silica filler, and (D) a polymer resin having a mass average molecular weight (Mw) of 6000 to 100000. The epoxy resin of the component (A) has an epoxy equivalent weight of 220 to 340. The component (B) is included in an amount of 6 to 27 parts by mass relative to 100 parts by mass of the component (A). The component (C) is included in an amount of 20 to 65 parts by mass relative to 100 parts by mass in total of the components. A content ratio ((A):(D)) between the component (A) and the component (D) is 99:1 to 65:35. This NCF further has a melt viscosity at 120° C. of 100 Pa·s or less, and has a melt viscosity at 120° C., after heated at 260° C.Type: GrantFiled: June 12, 2018Date of Patent: November 1, 2022Assignee: NAMICS CORPORATIONInventors: Kenichi Tosaka, Yoshihide Fukuhara, Hiromi Saito, Toyokazu Hotchi, Masaaki Hoshiyama
-
Patent number: 11472957Abstract: Provided is a resin composition, which is fast curable at low temperature, has high adhesive strength (especially, high peel strength) after curing, and can suppress a decrease in adhesive strength (especially, in peel strength) after a moisture resistance test of the resin composition after curing, and further has excellent pot life. Provided is the resin composition including: (A) an epoxy resin; (B) a thiol compound represented by C(CH2OR1)(CH2OR2)(CH2OR3)(CH2OR4) (wherein R1, R2, R3 and R4 are each independently hydrogen or CnH2nSH (wherein n is 2 to 6), at least one of R1, R2, R3 and R4 is CnH2nSH (wherein n is 2 to 6)); (b) a polyfunctional thiol compound other than the (B); and (C) a latent curing accelerator.Type: GrantFiled: October 23, 2017Date of Patent: October 18, 2022Assignee: NAMICS CORPORATIONInventors: Kazuki Iwaya, Fuminori Arai
-
Patent number: 11466170Abstract: A conductive paste, for forming an electrode of a solar cell, includes (A) a conductive component, (B) an epoxy resin, (C) an imidazole and (D) a solvent. An amount of (C) the imidazole in the conductive paste is 0.1 to 1.0% by weight based on 100% by weight of the conductive paste excluding (D) the solvent.Type: GrantFiled: November 7, 2018Date of Patent: October 11, 2022Assignee: NAMICS CORPORATIONInventors: Kenji Kobayashi, Kazuo Muramatsu, Hideo Tanabe
-
Publication number: 20220185667Abstract: A porous carbon has an ID/IG of 2.0 or more in a Raman spectrum measured by Raman spectroscopy with respect to the porous carbon wherein the IG is an accumulated intensity of a peak for G band around 1590 cm?1, and the ID is an accumulated intensity of a peak for D band around 1350 cm?1. The porous carbon has pores having a size of less than 1 ?m. The porous carbon can be contained in a resin composition for producing a varistor element.Type: ApplicationFiled: February 13, 2020Publication date: June 16, 2022Applicant: NAMICS CORPORATIONInventors: Pawel CZUBAROW, Yoshitaka KAMATA, Toshiyuki SATO
-
Publication number: 20220177639Abstract: A latent curing catalyst includes zirconium phosphate fine particles containing a curing accelerator. The zirconium phosphate fine particles containing the curing accelerator do not have a sharp crystalline peak at a diffraction angle (2?) in a range of 10° to 40° in powder X-ray diffraction and have a broad halo pattern.Type: ApplicationFiled: April 24, 2020Publication date: June 9, 2022Applicant: NAMICS CORPORATIONInventors: Osamu SHIMOMURA, Kazuki IWAYA
-
Patent number: 11339269Abstract: Provided are a resin composition for forming a varistor and a varistor capable of increasing freedom in the design of substrates, ICs, or electronics. The resin composition for forming a varistor includes (A) an epoxy resin, (B) a curing agent, (C) carbon nanotubes, and (D) a dispersant. The (C) carbon nanotubes may be single-walled carbon nanotubes, multi-walled carbon nanotubes, or a combination thereof. The (D) dispersant includes a polyalkyl oxide surfactant. The polyalkyl oxide surfactant has a polyalkyl ether skeleton in the molecule.Type: GrantFiled: December 4, 2018Date of Patent: May 24, 2022Assignee: NAMICS CORPORATIONInventor: Yoshitaka Kamata
-
Publication number: 20220144993Abstract: A photocurable resin composition includes a specific modified polyphenylene ether resin, a specific bifunctional acrylic resin, a photopolymerization initiator and a coupling agent in a specific ratio. Curing of the photocurable resin composition can be achieved satisfactorily by irradiation with a common active energy ray (for example, an ultraviolet ray) without requiring high-temperature treatment.Type: ApplicationFiled: January 22, 2020Publication date: May 12, 2022Applicant: NAMICS CORPORATIONInventors: Pawel CZUBAROW, Toshiyuki SATO, Masayoshi OTOMO
-
Patent number: 11315846Abstract: An object of the present invention is to provide a semiconductor device in which peeling between a mold resin and a substrate is suppressed. A semiconductor device 1 includes a semiconductor chip 20 and a substrate 10 that are molded with a mold resin layer 40. The semiconductor device 1 includes a resin layer 50 having a thickness of 200 nm or less different from the mold resin layer 40 between the cured mold resin layer 40 and the substrate 10. The resin layer 50 present between the mold resin layer 40 and the substrate 10 is preferably present on a periphery of 30% or more of the chip when an entire peripheral length of the chip is 100%.Type: GrantFiled: August 9, 2018Date of Patent: April 26, 2022Assignee: NAMICS CORPORATIONInventors: Hiroki Myodo, Toyokazu Hotchi, Masaaki Hoshiyama
-
Patent number: 11316203Abstract: A secondary battery having high electromotive force and including less lead or being free of lead is provided. The secondary battery includes a positive electrode including a positive electrode active material containing manganese oxide, a negative electrode including a negative electrode active material containing at least one selected from zinc, gallium, and tin, and an electrolytic solution containing at least one selected from phosphoric acid and organic oxoacid and having a pH of less than 7 at 25° C. This secondary battery has an open circuit voltage of more than 1.6 V in a fully charged state.Type: GrantFiled: May 22, 2018Date of Patent: April 26, 2022Assignee: NAMICS CORPORATIONInventor: Takayuki Fujita
-
Publication number: 20220045026Abstract: The present invention addresses the problem of providing a conductive paste that achieves both low resistance and high adhesion strength (die shear strength) of the resulting conductive body after firing. The present invention provides a conductive paste comprising: (A) copper fine particles having an average particle diameter of 50 nm to 400 nm and a crystallite diameter of 20 nm to 50 nm; (B) copper particles having an average particle diameter of 0.8 ?m to 5 ?m and a ratio of a crystallite diameter to the crystallite diameter of the copper particles (A) of 1.0 to 2.0; and (C) a solvent.Type: ApplicationFiled: September 24, 2019Publication date: February 10, 2022Applicant: NAMICS CORPORATIONInventors: Masashi KAJITA, Masahiro KITAMURA, Takayuki HIGUCHI, Noritsuka MIZUMURA
-
Patent number: 11230617Abstract: A resin composition contains a 2-methylene-1,3-dicarbonyl compound and an initiator. The 2-methylene-1,3-dicarbonyl compound has a molecular weight of 180 to 10,000, and the initiator contains a basic substance having a pKa of 8 or greater.Type: GrantFiled: October 30, 2018Date of Patent: January 25, 2022Assignee: NAMICS CORPORATIONInventors: Fuminori Arai, Kazuki Iwaya
-
Publication number: 20210388128Abstract: A curing agent composition is capable of curing a base resin containing a 2-methylene-1,3-dicarbonyl compound. The curing agent composition contains a specific 2-methylene-1,3-dicarbonyl compound and an initiator. A two-part mixing adhesive contains the curing agent composition and a base resin containing another specific 2-methylene-1,3-dicarbonyl compound.Type: ApplicationFiled: October 8, 2019Publication date: December 16, 2021Applicant: NAMICS CORPORATIONInventor: Fuminori ARAI
-
Publication number: 20210380851Abstract: A resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) an initiator comprising at least one basic substance, and (c) an anionic polymerization inhibitor including at least one borate ester compound.Type: ApplicationFiled: October 4, 2019Publication date: December 9, 2021Applicant: NAMICS CORPORATIONInventors: Ayako SATO, Fuminori ARAI
-
Patent number: 11104832Abstract: Provided are a liquid epoxy resin sealing material capable of suppressing occurrence of fillet cracks generated when an underfill cured product is left under high temperature aerobic conditions, and a semiconductor device using the liquid epoxy resin sealing material. More specifically, provided are the liquid epoxy resin sealing material containing (A) a liquid epoxy resin, (B) an amine curing agent, (C) an inorganic filler and (D) an antioxidant agent represented by the following formula, wherein 0.5 to 10 parts by mass of (D) the antioxidant agent is contained based on a total of 100 parts by mass of (A) the epoxy resin and (B) the amine curing agent, and the semiconductor device using the liquid epoxy resin sealing material.Type: GrantFiled: February 6, 2018Date of Patent: August 31, 2021Assignee: NAMICS CORPORATIONInventors: Nozomu Sasage, Yohei Hosono
-
Patent number: 11072710Abstract: The present invention provides a surface-treated silica filler for suppressing an increase in viscosity when added to a resin composition used for applications such as a semiconductor sealing material, and the resin composition containing the surface-treated silica filler. The surface-treated silica filler of the present invention is surface-treated with a basic substance having an acid dissociation constant (pKa) of its conjugate acid of 9.4 or more.Type: GrantFiled: November 28, 2017Date of Patent: July 27, 2021Assignee: NAMICS CorporationInventors: Ayako Sato, Masashi Kajita
-
Patent number: 11049983Abstract: Provided is a conductive paste for forming bus bar electrodes having high adhesive strength with respect to a passivation film in a crystalline silicon solar cell without having a detrimental effect on the passivation film so as to affect solar cell properties. The conductive paste is a conductive paste formed on a passivation film of a solar cell, containing: (A) silver particles, (B) an organic vehicle, and (C) glass fit containing TeO2 at 1.0 mol % to 20 mol % and Bi2O3 at 10 mol % to 30 mol %.Type: GrantFiled: July 12, 2017Date of Patent: June 29, 2021Assignee: NAMICS CORPORATIONInventors: Seiya Konno, Noriyuki Sakai
-
Publication number: 20210163772Abstract: Provided is a thermosetting conductive paste which is able to be processed at low temperature (for example, at 250° C. or less), and which enables the achievement of a conductive film that has low resistivity. The conductive paste which contains (A) a conductive component, (B) a thermosetting resin, (C) a compound having a specific structure, and (D) a solvent.Type: ApplicationFiled: November 7, 2018Publication date: June 3, 2021Applicant: NAMICS CORPORATIONInventors: Kazuo MURAMATSU, Hideo TANABE
-
Publication number: 20210155769Abstract: Provided are a resin composition for forming a varistor and a varistor capable of increasing freedom in the design of substrates, ICs, or electronics. The resin composition for forming a varistor includes (A) an epoxy resin, (B) a curing agent, (C) carbon nanotubes, and (D) a dispersant. The (C) carbon nanotubes may be single-walled carbon nanotubes, multi-walled carbon nanotubes, or a combination thereof. The (D) dispersant includes a polyalkyl oxide surfactant. The polyalkyl oxide surfactant has a polyalkyl ether skeleton in the molecule.Type: ApplicationFiled: December 4, 2018Publication date: May 27, 2021Applicant: NAMICS CORPORATIONInventor: Yoshitaka KAMATA