Abstract: Disclosed is a thermosetting conductive paste which is advantageous in that an external electrode for multilayer ceramic electronic part formed using the paste exhibits excellent bonding properties with an internal electrode and is suitable for mounting on a substrate or plating, achieving excellent electric properties (electrostatic capacity, tan ?. A thermosetting conductive paste comprising: (A) metal powder having a melting point of 700° C. or higher; (B) metal powder having a melting point of higher than 300 to lower than 700° C.; and (C) a thermosetting resin.

Abstract: The present invention provides a dielectric ceramic composition, which is, in addition to having superior resistance to reduction during firing, superior capacitance temperature characteristics after firing and superior dielectric characteristics, also demonstrates an enhanced lifetime for insulation resistance. The present invention is a dielectric ceramic composition comprising 0.18 to 0.5 part by weight of Yb2O3, 0.6 to 1.5 parts by weight of MgO, 0.4 to 1.5 parts by weight of CaSiO3, 0.02 to 0.2 part by weight of WO3, 0.1 to 0.4 part by weight of MnCO3 and 0.02 to 0.2 part by weight of MoO3 based on 100 parts by weight of (BaO)m.TiO2 (wherein, m is from 0.990 to 0.995).

Abstract: A method for producing a light emitting diode chip encapsulation product, the method comprising covering a light emitting diode chip connected onto a substrate with a thermosetting film, and thermally curing the thermosetting film.

Abstract: The present invention provides a dielectric ceramic composition, which is, in addition to having superior resistance to reduction during firing, superior capacitance temperature characteristics after firing and superior dielectric characteristics, also demonstrates an enhanced lifetime for insulation resistance. The present invention is a dielectric ceramic composition comprising 0.18 to 0.5 part by weight of Yb2O3, 0.6 to 1.5 parts by weight of MgO, 0.4 to 1.5 parts by weight of CaSiO3, 0.02 to 0.2 part by weight of WO3, 0.1 to 0.4 part by weight of MnCO3 and 0.02 to 0.2 part by weight of MoO3 based on 100 parts by weight of (BaO)m.TiO2 (wherein, m is from 0.990 to 0.995).

Abstract: The present invention is intended to solve the problem of a conventional thermosetting conductive paste with respect to bonding-property between an internal electrode(s) and an external electrode(s) so as to provide a multilayer ceramic electronic part suitable for its mounting on a substrate and for its plating-treatment. The present invention relates to a multilayer ceramic electronic part, characterized in that it has an external electrode(s) formed from a thermosetting conductive paste comprising conductive particles having a high melting point, metal powder having a melting point of 300° C. or less and a resin(s).

Abstract: The present invention is to provide a flip chip mounting method which does not cause void formation between a semiconductor chip and a substrate, and in the flip chip mounting method, the method comprising the steps of: (A) drying the substrate; and (B) at least one step of: (1) dispensing uncured sealant at least at a bump pressing portion on the surface of the substrate and/or the entire portion of the substrate where minute irregularities are present; and (2) performing a pressing and the curing of the underfill while maintaining the temperature conditions so that a temperature difference between the semiconductor chip and the substrate does not cause convection substantially in the uncured or curing underfill.

Abstract: The present invention provides a conductive paste for an outer electrode of an electronic part comprising glass frit, a vehicle and conductive particles, wherein the glass frit comprises (1) substantially no lead oxide; and (2) as an oxide unit, B2O3 in an amount of 5.0 to 30.0% by weight, SiO2 in an amount of 10.0 to 60.0% by weight and at least one oxides selected from the group consisting of BaO, ZnO, Al2O3 and Na2O wherein a content of BaO is 60.0% by weight or less, a content of ZnO is 30.0% by weight or less, a content of Al2O3 is 12.0% by weight or less and a content of Na2O is 15.0% by weight or less; an outer electrode of an electronic part obtained by calcining the conductive paste; and a process for producing an outer electrode which comprises the step of calcining the conductive paste at a temperature of 500 to 750° C.

Abstract: A cationically polymerizable resin composition which comprises (A) a compound containing at least one ring selected from the group consisting of an oxirane ring and an oxetane ring; (B) an onium salt; (C) an organic peroxide; and (D) an alkaline filler except for a hydroxide.

Abstract: There is disclosed a conductive adhesive comprising(A) conductive particles having a surface of at least one of nickel and nickel-boron alloy, and the surface of which has been subjected to surface treatment with a mixture of a polyoxyalkylene phosphate compound and a polyoxyalkylenealkyl or polyoxyalkylenealkenyl amine or a derivative thereof;(B) an epoxy compound which contains a diglycidyl epoxy compound used as a reactive diluent in an amount of 20 to 70 weight % based on the total amount of the epoxy compound; and(C) a phenolic resin hardener which contains at least one of an alkyl resol phenolic resin and alkyl novolak phenolic resin in an amount of 50% by weight or more based on the total amount of the phenolic resin hardener.