Abstract: A mixed gas separation method includes a step of supplying a mixed gas to the separation membrane and causing a gas with high permeability in the mixed gas to permeate through the separation membrane. In the step, when ?P is a difference between a gas pressure on the primary side of the separation membrane, i.e., a feed pressure, and a gas pressure on the secondary side of the separation membrane, i.e., a permeate pressure, and A is a Joule-Thomson coefficient, a difference ?T between a gas temperature on the primary side of the separation membrane, i.e., a feed temperature, and a gas temperature on the secondary side of the separation membrane, i.e., a permeate temperature, is made less than 90% of A·?P by setting the Nu number in the mixed gas to be greater than or equal to 2 and less than or equal to 10.

Abstract: A wafer placement table includes a ceramic plate having a wafer placement surface and an electrode, a cooling plate made of a metal-ceramic composite and having a cooling medium passage, and a joining layer configured to join the plates. A distance from the wafer placement surface to at least one of upper base or lower base of the cooling medium passage is not constant. The cooling plate has a plurality of plate portions including a first plate portion and a second plate portion, and has a structure in which the plurality of plate portions metal-joined to each other. The first plate portion has a first passage portion which is a through groove having the same shape as the cooling medium passage. The second plate portion has a second passage portion which is a bottomed groove disposed in at least part of a region facing the first passage portion.

Abstract: A heat treatment system may include a heat treatment furnace; a supply device; a stack device configured to stack saggars in an up-down direction; a first conveyor configured to convey the saggars to the heat treatment furnace; an unstack device configured to unstack the stacked saggars; a recovery device; and a second conveyor configured to convey the saggars from the heat treatment furnace to the unstack device. At least one of the recovery device and the supply device may include at least a first conveyor mechanism and a second conveyor mechanism. The recovery device may further include a first recovery unit disposed on the first conveying path and a second recovery unit disposed on the second conveying path, or the supply device may further include a first supply unit disposed on the first conveying path and a second supply unit disposed on the second conveying path.

Abstract: There is provided an electrostatic chuck assembly including: an electrode-embedded ceramic plate; a cooling plate that supports a bottom surface of the ceramic plate and has an internal space of an annular or arcuate shape; an internal fixation member of an annular or arcuate shape accommodated in the internal space so as to be rotatable about a central axis of the cooling plate; female threads in a multiple of n, which is an integer of 2 or more, spaced apart from each other in the internal fixation member; and n insertion holes for insertion of bolts for being fixed to a chamber, the insertion holes each being provided at the bottom of the cooling plate such that one set of n female threads is exposed. Each of the female threads is disposed such that another set of n female threads is exposed in the insertion holes when rotated.

Abstract: A heat treatment system may include a heat treatment furnace configured to heat treat a material in a saggar; a conveyor configured to convey the saggar from an exit to an entrance of the heat treatment furnace; a recovery device configured to recover the material heat-treated; a supply device configured to supply a non-heat-treated material to the saggar; and a hood covering the conveying path. The conveying path may include a first conveying path disposed on at least a part of the conveying path between the recovery device and the supply device; and a second conveying path disposed on other part of the conveying path than the part where the first conveying path is disposed. The hood may be disposed over the second conveying path and may not be disposed over the first conveying path.

Abstract: A heater element includes: a honeycomb structure including an outer peripheral wall and partition walls disposed on an inner side of the outer peripheral wall, the partition walls defining a plurality of cells, each of the cells extending from a first end face to a second end face to form a flow path; a pair of electrode layers provided on the outer peripheral wall and the partition walls on the first end face and the second end face; and terminals capable of electrically connecting the electrode layers to a conducting wire. At least a part of each of the electrode layers has an extending portion extending outwardly from an outer edge of each of the first end face and the second end face. Each of the terminals is connected to the extending portion and disposed to face a side surface of the honeycomb structure.

Abstract: Provided is a semiconductor film having a corundum-type crystal structure composed of ?-Ga2O3 or an ?-Ga2O3 solid solution and the crystal defect density on at least one surface of the semiconductor film is 1.0×106/cm2 or less.

Abstract: Provided is a battery module including: a metal module housing that has a closed interior space; and multiple secondary batteries that have a vertically long shape and are housed vertically in the interior space and juxtaposed parallel to each other. The module housing has an upper excess space above the secondary batteries in the interior space, the upper excess space being capable of mitigating a pressure increase in the module housing due to ignition of gas generated in the event of an abnormality in the secondary batteries.

Abstract: A sensor element includes an element body having a measurement-object gas flow section being provided therein, a first measurement pump cell that includes a first measurement electrode being disposed in a first measurement chamber and a first outer measurement electrode and that pumps out oxygen produced in a first measurement chamber, and a second measurement pump cell that includes a second measurement electrode being disposed in a second measurement chamber and a second outer measurement electrode and that pumps out oxygen produced in a second measurement chamber.

Abstract: There is provided an EUV transmissive membrane including: a main layer composed of metallic beryllium that has a first surface and a second surface; and a pair of surface layers provided on the first surface and the second surface of the main layer, each containing at least one fluoride selected from beryllium fluoride, beryllium fluoride nitride, beryllium fluoride oxide, and beryllium fluoride nitride oxide.

Abstract: Provided is an EUV transmissive membrane including a main layer having an EUV transmittance of 85% or more at a wavelength of 13.5 nm, wherein the main layer is composed of a monolayer or a composite layer of two or more layers, and a protective layer that covers at least one side of the main layer, wherein the protective layer includes at least one selected from the group consisting of amorphous carbon, Cu, Al, and an organic resist as a main component.

Abstract: A layered double hydroxide contains four elements of Ni, Fe, V, and Co, and further contains Mn as a fifth element.

Abstract: A layered double hydroxide is represented by the following formula (I): Ni2+1?(x+y+z)Fe3+xV3+yCo3+z(OH)2An?(x+y+z)/n·mH2O . . . (I). In one embodiment, in the formula (I), (x+y+z) is from 0.2 to 0.5, “x” represents more than 0 and 0.3 or less, “y” represents from 0.04 to 0.49, and “z” represents more than 0 and 0.2 or less.

Abstract: A bonded body has a supporting substrate composed of silicon, piezoelectric material substrate, and a bonding layer provided on a bonding surface of the supporting substrate and composed of a metal oxide. An amount of aluminum atoms on the bonding surface of the supporting substrate is 1.0×1011 to 1.0×1015 atoms/cm2.

Abstract: A heat treatment system may include a heat treatment furnace configured to heat treat a material in a saggar, the saggar including a saggar body and a lid; a lid removing device configured to remove the lid from the saggar; a body conveyor configured to convey the saggar body; a lid conveyor configured to convey the lid; a recovery device configured to recover the material from the saggar body; a supply device configured to supply a non-heat-treated material to the saggar body; and a lid attaching device configured to attach the lid to the saggar body. A conveying time for the lid to be conveyed from an entrance to an exit of a conveying path of the lid conveyor may be shorter than a conveying time for the saggar body to be conveyed from an entrance to an exit of a conveying path of the body conveyor.

Abstract: A dielectric drying method for ceramic formed bodies includes drying a plurality of ceramic formed bodies placed side by side in an arrangement direction Y perpendicular to a conveying direction X on an upper surface of a drying table by conveying the ceramic formed bodies between electrodes of an upper electrode and a lower electrode, and applying a high frequency between the electrodes. The drying table is conveyed by a conveyor having at least one conveyor belt for supporting a portion of the drying table in the arrangement direction Y. At least one electric field adjusting member is arranged below the drying table that is not supported by the conveyor belt.

Abstract: A heat treatment system may include a heat treatment furnace configured to heat treat a material in a saggar; a conveyor configured to convey the saggar from an exit to an entrance of the heat treatment furnace; a recovery apparatus configured to recover the material heat-treated from the saggar; and a supply device configured to supply a non-heat treated material to the saggar. The conveyor may include a conveyor mechanism and a drive unit configured to drive the conveyor mechanism. The recovery apparatus may comprise a recovery unit disposed at a position where the conveyor mechanism is not disposed and configured to recover the material in the saggar; a transport device configured to transport the saggar between a placement position on the conveyor mechanism and a recovery position above the recovery unit; and an inversion mechanism configured to invert the saggar at the recovery position.

Abstract: A composite sintered body includes a base material that includes ceramic as a main component, and an electrode arranged inside the base material or on a surface of the base material. The electrode contains W and ZrO2.

Abstract: A package has a cavity to be sealed by a lid. The package includes a heat sink having a coefficient of thermal expansion of 9 ppm/° C. or more and 15 ppm/° C. or less from 25° C. to 100° C. and a frame disposed on the heat sink, made of ceramics, and surrounding the cavity in plan view. An outer edge of the frame includes a first linear portion extending along a first direction, a second linear portion extending along a second direction orthogonal to the first direction, and a chamfer connecting the first linear portion and the second linear portion in plan view.

Abstract: A wafer placement table includes an upper substrate; a lower substrate; a through hole extending through the lower substrate in an up-down direction; a plurality of projections provided in a dot pattern, for example, at an entirety of an upper surface of the lower substrate and being in contact with the lower surface of the upper substrate; a heat dissipation sheet having a projection insertion hole and being disposed between the upper substrate and the lower substrate; a screw hole provided, in the lower surface of the upper substrate, at a position facing the through hole; a screw member inserted from a lower surface of the lower substrate into the through hole and screwed into the screw hole; and a thermally conductive paste interposed, for example, between side surfaces of the projections and an inner peripheral surface of the projection insertion hole of the heat dissipation sheet.