Patents Assigned to Nippon Mektron, Ltd.
  • Patent number: 10410106
    Abstract: An attachment tag includes a stretchable circuit board having stretchability, a stretchable wiring line provided on a first main surface of the stretchable circuit board and having stretchability, an identification signal generator connected to the stretchable wiring line and configured to generate an identification signal containing identification information, a transmitter configured to transmit the identification signal generated by the identification signal generator, and an adhesive layer provided on a second main surface, different from the first main surface, of the stretchable circuit board and exhibiting adhesiveness.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: September 10, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Akio Yoshida, Mitsunori Sasaki
  • Patent number: 10391584
    Abstract: An ultrasonic bonding jig includes: a plurality of protrusions; and a planar portion among protrusions formed among base ends of the protrusions. The protrusions have side surfaces of tapered surfaces, the side surfaces being positioned in a vibration direction. At the tapered surfaces, an inclination of a tangent at distal ends of the protrusions, with respect to the vibration direction, is larger than an inclination of a tangent at the base ends of the protrusions, with respect to the vibration direction.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: August 27, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi Miyashiro, Yoichi Suruga, Shuhei Koyano
  • Patent number: 10398024
    Abstract: The stretchable circuit board (100) includes: a stretchable base (10); a stretchable wiring portion (20) formed on the stretchable base (10); a reinforcement base (30) having in-plane rigidity higher than that of the stretchable base (10); a draw-out wiring portion (40) formed on the reinforcement base (30), and electrically continuous with the stretchable wiring portion (20); and an elastomer layer (50) formed on the reinforcement base (30). The reinforcement base (30) overlaps with a partial area (10a) of the stretchable base (10). An other area (10b) of the stretchable base (10) is exposed from the reinforcement base (30). The stretchable wiring portion (20) extends on the other area (10b) and over the partial area (10a). The elastomer layer (50) and the stretchable base (10) are layered and joined with each other.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: August 27, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Masayuki Iwase, Takeo Wakabayashi, Eiji Mizuno
  • Patent number: 10383224
    Abstract: [Problem] To allow an efficient sheet layout of a flexible printed circuit board having a plurality of cable sections extending in different directions and to improve a yield.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: August 13, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventor: Fumihiko Matsuda
  • Patent number: 10379064
    Abstract: A substrate inspection device for inspecting a flexible printed board to determine whether the transparent adhesive material is properly applied thereto comprises: a substrate reading device which irradiates the flexible printed board with visible light to acquire image data; an adhesive material position determination unit which determines a position of adhesive material CAD data corresponding to the transparent adhesive material with respect to blue color image data among the image data corresponding to blue light which is readily absorbed by polyimide, to create adhesive material alignment data in which the adhesive material CAD data is superposed; an edge enhancing unit which performs processing, on the blue color image data, to enhance an edge of the transparent adhesive material; and a straight line determination unit which determines whether the edge of the transparent adhesive material is present in edge enhanced data in which the edge of the transparent adhesive material is enhanced.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: August 13, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventor: Kenichi Mishima
  • Publication number: 20190239946
    Abstract: A catheter flexible printed wiring board which includes: a long flexible insulating base member having a tip end portion and a base end portion; and a conductive pattern formed on the flexible insulating base member and extending from the base end portion to the tip end portion, wherein the conductive pattern at the base end portion is wider than the conductive pattern at the tip end portion and thicker than the conductive pattern at the tip end portion.
    Type: Application
    Filed: January 14, 2019
    Publication date: August 8, 2019
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Akio YOSHIDA, Ryoichi TOYOSHIMA, Mitsunori SASAKI, Hiroyasu HASEGAWA
  • Patent number: 10359326
    Abstract: This invention provides a pressure sensitive element capable of suppressing dispersion in the initial load for pressure sensing among the sensor electrodes or among the pressure sensors. The pressure sensitive element has a support substrate, a sensor electrode, a pressure sensing film and an insulating layer. The pressure sensing film is arranged opposing to the sensor electrode. The insulating layer has an opening and is provided between the support substrate and the pressure sensing film. At least a part of an opening edge of the opening is fallen on the sensor electrode. An exposed part as a part of the sensor electrode is exposed inside the opening, while leaving a buried part as the other part of the sensor electrode buried under the insulating layer.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: July 23, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Ryoichi Toyoshima, Keizo Toyama, Hirokazu Ohdate, Masayuki Iwase
  • Patent number: 10321578
    Abstract: A filling method of conductive paste includes a step of providing a protective film on a principal surface of a metal foil clad laminated sheet, a step of forming bottomed via holes, a step of removing the film from a surface to a midway thereof to form a conductive paste flowing groove having the via holes, a step of disposing a housing member on the film, and thereby, causing a conductive paste injecting channel and a vacuum evacuating channel to communicate with a conductive paste flowing space S, a step of depressurizing the space S via the channel, and a step of injecting conductive paste into the space S via the channel, and thereby, filling an inside of the via holes with the conductive paste.
    Type: Grant
    Filed: November 10, 2014
    Date of Patent: June 11, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Shoji Takano, Fumihiko Matsuda
  • Publication number: 20190166689
    Abstract: Provided is a stretchable circuit board including: a stretchable base material having stretchability and including a stretchable wiring line on one main surface; an electrode formed on at least the main surface of the stretchable base material and connected to the stretchable wiring line; an adhesive layer directly or indirectly bonded to the main surface on which the electrode is formed and formed in a region of the main surface other than an electrode region including the electrode; and an adhesive layer separator detachably bonded to the adhesive layer and having an opening formed at a position corresponding to at least part of the electrode region.
    Type: Application
    Filed: November 19, 2018
    Publication date: May 30, 2019
    Applicant: NIPPON MEKTRON, LTD.
    Inventor: Masayuki IWASE
  • Publication number: 20190166688
    Abstract: Provided is a stretchable circuit board including: a stretchable base material having stretchability; a film base material overlapping with part of a one-surface-side surface of the stretchable base material and having lower stretchability than that of the stretchable base material; a stretchable wiring line formed on the one-surface-side surface of the stretchable base material; and an adhesive layer formed on one surface side or the other surface side of the stretchable base material. The adhesive layer is formed on both of an overlapping region where the stretchable base material overlaps with the film base material and a non-overlapping region where the stretchable base material does not overlap with the film base material.
    Type: Application
    Filed: November 13, 2018
    Publication date: May 30, 2019
    Applicant: NIPPON MEKTRON, LTD.
    Inventor: Masayuki IWASE
  • Patent number: 10288574
    Abstract: A wetting sensor includes a stretchable circuit board having stretchability, a first stretchable wiring line as a wiring line formed on a main surface of the stretchable circuit board and having stretchability on the main surface, a second stretchable wiring line as a wiring line formed on the main surface of the stretchable circuit board and having stretchability on the main surface, a first electrode connected to the first stretchable wiring line, a second electrode connected to the second stretchable wiring line, a water absorbing member configured to cover at least a part of each of the first electrode and the second electrode, and a measurer configured to measure an electric characteristic between the first electrode and the second electrode which are contacting the water absorbing member.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: May 14, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Akio Yoshida, Hiroyasu Hasegawa
  • Publication number: 20190090345
    Abstract: Provided are both a flexible printed board, in which heat dissipation performance can be improved in without using an aluminum heal dissipating material, which is light in weight, has good processability and can be reduced in cost, and a method for manufacturing such a flexible printed board. The flexible printed board is a flexible printed board 10 on which a power consuming load is mounted, including: a front surface heat dissipation layer 30 made of a copper foil and having a circuit portion on which the load is mounted; a thermally conductive resin layer 20 having the front surface heat dissipation layer 30 laminated to a front surface side thereof and having a thermal conductivity of 0.49 W/mK or more; and a rear surface heat dissipation layer made of a copper foil, laminated to a rear surface side of the thermally conductive resin layer 20, and having a thickness of 100 to 400% with respect to the front surface heat dissipation layer 30.
    Type: Application
    Filed: June 21, 2017
    Publication date: March 21, 2019
    Applicants: NIPPON MEKTRON, LTD., NIPPON MEKTRON, LTD.
    Inventors: Satoshi EBIHARA, Takahisa KATO, Nobuto SASAKI, Kazuyuki AZUMA, Tomohiro SHIMOKAWAJI, Takeo WAKABAYASHI
  • Patent number: 10232464
    Abstract: An ultrasonic bonding jig includes: a plurality of protrusions; a planar portion among protrusions formed among base ends of the protrusions; and recessed portions recessed to a side opposite to a projection direction of the protrusions, the recessed portions being formed on both sides in a vibration direction of the protrusions.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: March 19, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi Miyashiro, Yoichi Suruga, Shuhei Koyano
  • Publication number: 20190079038
    Abstract: A moisture sensitive sheet includes a stretchable circuit board having stretchability, a moisture absorbing film provided on a main surface of the stretchable circuit board and exhibiting an electric property changing according to an amount of moisture absorption, and a stretchable electrode provided on the main surface, having stretchability, and configured to measure the electric property of the moisture absorbing film.
    Type: Application
    Filed: August 2, 2018
    Publication date: March 14, 2019
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Hiroyasu HASEGAWA, Akio YOSHIDA
  • Publication number: 20190072508
    Abstract: A wetting sensor includes a stretchable circuit board having stretchability, a first stretchable wiring line as a wiring line formed on a main surface of the stretchable circuit board and having stretchability on the main surface, a second stretchable wiring line as a wiring line formed on the main surface of the stretchable circuit board and having stretchability on the main surface, a first electrode connected to the first stretchable wiring line, a second electrode connected to the second stretchable wiring line, a water absorbing member configured to cover at least a part of each of the first electrode and the second electrode, and a measurer configured to measure an electric characteristic between the first electrode and the second electrode which are contacting the water absorbing member.
    Type: Application
    Filed: July 31, 2018
    Publication date: March 7, 2019
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Akio YOSHIDA, Hiroyasu HASEGAWA
  • Publication number: 20190069399
    Abstract: A receiver includes a stretchable circuit board having stretchability and a first antenna formed on a main surface of the stretchable circuit board, the first antenna being configured to stretch in accordance with the stretchable circuit board and configured to receive a signal transmitted from a transmitter installed in a living body.
    Type: Application
    Filed: August 14, 2018
    Publication date: February 28, 2019
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Akio YOSHIDA, Mitsunori SASAKI
  • Publication number: 20190054562
    Abstract: An ultrasonic bonding jig includes: a plurality of protrusions; a planar portion among protrusions formed among base ends of the protrusions; and recessed portions recessed to a side opposite to a projection direction of the protrusions, the recessed portions being formed on both sides in a vibration direction of the protrusions.
    Type: Application
    Filed: March 27, 2018
    Publication date: February 21, 2019
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi MIYASHIRO, Yoichi SURUGA, Shuhei KOYANO
  • Publication number: 20190050701
    Abstract: An attachment tag includes a stretchable circuit board having stretchability, a stretchable wiring line provided on a first main surface of the stretchable circuit board and having stretchability, an identification signal generator connected to the stretchable wiring line and configured to generate an identification signal containing identification information, a transmitter configured to transmit the identification signal generated by the identification signal generator, and an adhesive layer provided on a second main surface, different from the first main surface, of the stretchable circuit board and exhibiting adhesiveness.
    Type: Application
    Filed: July 23, 2018
    Publication date: February 14, 2019
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Akio YOSHIDA, Mitsunori SASAKI
  • Publication number: 20190047079
    Abstract: An ultrasonic bonding jig includes: a plurality of protrusions; and a planar portion among protrusions formed among base ends of the protrusions. The protrusions have side surfaces of tapered surfaces, the side surfaces being positioned in a vibration direction. At the tapered surfaces, an inclination of a tangent at distal ends of the protrusions, with respect to the vibration direction, is larger than an inclination of a tangent at the base ends of the protrusions, with respect to the vibration direction.
    Type: Application
    Filed: March 23, 2018
    Publication date: February 14, 2019
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi MIYASHIRO, Yoichi SURUGA, Shuhei KOYANO
  • Patent number: 10194527
    Abstract: [Problem] Provided is a method for manufacturing a stretchable circuit board, which can facilitate positioning of an external terminal and a stretchable wiring, and increase manufacturing yield of a stretchable circuit board. [Solving Mean] A stretchable circuit board is manufactured through: a step in which an external terminal 31 is formed on a main surface 33b located on one side of a film base 33; a step in which a stretchable wiring portion 55 is formed on a main surface 53a located on one side of a stretchable base 53; and a step in which the stretchable wiring portion 55 is positioned with the external terminal 31, and pressure and heat are applied to the film base 33 and the stretchable wiring portion 55 to join them, whereby the external terminal 31 and the stretchable wiring portion 55 are connected with each other.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: January 29, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventor: Masayuki Iwase