Patents Assigned to Nippon Mektron, Ltd.
  • Patent number: 11975191
    Abstract: Provided is a stretchable wiring board including: a base material having stretchability; a wiring line having at least a portion coated and formed on the base material with a conductive stretchable material; and an uneven engaging portion that is electrically connected to the wiring line and has a protrusion or a recess configured to engage with a connection terminal of an external device.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: May 7, 2024
    Assignee: NIPPON MEKTRON, LTD.
    Inventor: Toshihide Ishiguro
  • Publication number: 20240136740
    Abstract: Provided is a flexible printed circuit connection structure which includes a flexible printed circuit having a plurality of wires, a board to be connected having a plurality of wires to be connected, a plurality of solder connection portions, and a partition wall, in which: the plurality of solder connection portions is a part where the plurality of wires of the flexible printed circuit and the plurality of wires to be connected of the board to be connected are connected to each other by solder; the partition wall is provided away from the plurality of solder connection portions so as to surround the plurality of solder connection portions; and the flexible printed circuit, the board to be connected, and the partition wall define a sealed space, and the plurality of solder connection portions is arranged inside the sealed space.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 25, 2024
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Shuzo YAMADA, Kenichi NAKAYAMA, Tomoki KANAYAMA
  • Patent number: 11942708
    Abstract: A crimp terminal-equipped flexible printed circuit board includes: a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil; multiple crimp terminals including crimp pieces crimped to penetrate the first flexible printed circuit board and bent to bite into part of the circuit; and an insulating reinforcing film partially integrally provided on an area of the base film where the multiple crimp pieces penetrate.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: March 26, 2024
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Masanori Hirata, Shunsuke Aoyama, Yu Miura, Kenji Kiya
  • Patent number: 11931099
    Abstract: A catheter flexible printed wiring board which includes: a long flexible insulating base member having a tip end portion and a base end portion; and a conductive pattern formed on the flexible insulating base member and extending from the base end portion to the tip end portion, wherein the conductive pattern at the base end portion is wider than the conductive pattern at the tip end portion and thicker than the conductive pattern at the tip end portion.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: March 19, 2024
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Akio Yoshida, Ryoichi Toyoshima, Mitsunori Sasaki, Hiroyasu Hasegawa
  • Publication number: 20240068885
    Abstract: Provided is a temperature measurement device including: a case; a flexible printed circuit board attached to the case; a pressing plate; and an elastic body, in which: the flexible printed circuit board includes a thermistor element region; the elastic body is interposed between the thermistor element region and the pressing plate; the pressing plate is configured to press the thermistor element region through the elastic body; the case has a through-hole; as viewed in a direction of pressing the thermistor element region by the pressing plate, the thermistor element region and the elastic body are positioned within an area where the through-hole is provided; and the thermistor element region is configured to protrude, through the through-hole, from an attachment surface side of the case attached to the flexible printed circuit board toward a surface side of the case opposite to the attachment surface side.
    Type: Application
    Filed: August 2, 2023
    Publication date: February 29, 2024
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Katsuhito SHIROTA, Yuki KOMURO, Tomoki KANAYAMA
  • Patent number: 11856695
    Abstract: Provided is a method for forming a through-hole including: forming a laminated body including a fluororesin layer having a first main surface and a second main surface, a first adhesive layer, a first reinforcing resin layer and a first conductor layer provided on the first main surface, a second adhesive layer, a second reinforcing resin layer and a second conductor layer provided on the second main surface; forming an opening in the first conductor layer and irradiating the opening with a laser beam to form a bottomed conduction hole with the second conductor layer exposed on a bottom surface of the conduction hole, wherein a thermal decomposition temperature of the second cured adhesive layer is lower than those of the first reinforcing resin layer and the second reinforcing resin layer, and a thickness of the second cured adhesive layer is 10 ?m or more and 200 ?m or less.
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: December 26, 2023
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Toshihiro Higashira, Fuki Hatano
  • Publication number: 20230411900
    Abstract: Provided is a gasket-equipped flexible printed wiring board including: a flexible printed wiring board with a through-hole; and a gasket, in which the gasket is provided integrally with the flexible printed wiring board so as to embed a partial region of the flexible printed wiring board in such a manner that the gasket is molded on the flexible printed wiring board, which is an insert component, by insert molding, the gasket has a gate mark on a first end side of the flexible printed wiring board in a width direction thereof, and the through-hole is, within the partial region of the flexible printed wiring board, formed at a position closer to a second end side, which faces the first end side in the width direction, than to the first end side.
    Type: Application
    Filed: February 14, 2023
    Publication date: December 21, 2023
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Takashi SASAKI, Eiichi INOUE
  • Publication number: 20230395878
    Abstract: Provided is a flexible printed wiring board attached to a battery, including: multiple lines are provided only on one surface of the flexible printed wiring board, one end of a first line group and a second line group are respectively connected to one of multiple terminals of the battery, and the other end of the first line group is arranged in a bent portion, and the other end of the second line group and one end of a third line group are arranged at an end portion of a trunk portion, and the other end of the third line group is arranged in the trunk portion, and the bent portion is bent such that the other end of the first line group arranged in the bent portion and the other end of the third line group arranged in the trunk portion are connected to each other.
    Type: Application
    Filed: March 20, 2023
    Publication date: December 7, 2023
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Katsuhito SHIROTA, Tomoki KANAYAMA, Shuzo YAMADA
  • Publication number: 20230392994
    Abstract: Provided is a temperature measurement device which includes: a case; a flexible printed circuit board; and a thermistor element mounting portion, the case integrally has a first case portion, a second case portion, and a holding portion; the flexible printed circuit board has a trunk and a branch divided from the trunk; the trunk is fixed to a first surface of the first case portion; the thermistor element mounting portion is arranged in the branch and is fixed to a first surface of the second case portion; the second case portion is folded such that a second surface of the first case portion and a second surface of the second case portion are in contact with each other; and the holding portion holds a part of the branch between a portion divided from the trunk and a portion where the thermistor element mounting portion is arranged.
    Type: Application
    Filed: March 30, 2023
    Publication date: December 7, 2023
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Shunsuke TOMITA, Kenichi NAKAYAMA, Tomoki KANAYAMA
  • Publication number: 20230354522
    Abstract: Provided is a flexible printed wiring board including: a base film which is an insulating layer; a first conductor layer; a second conductor layer; and a through-hole, in which the first conductor layer is provided on one surface of the base film, the second conductor layer is provided on the other surface of the base film, and the through-hole is provided so as to penetrate the base film and electrically connect the first conductor layer and the second conductor layer to each other, and the second conductor layer has a solderable region.
    Type: Application
    Filed: March 1, 2023
    Publication date: November 2, 2023
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Shunsuke AOYAMA, Masanori HIRATA
  • Patent number: 11799164
    Abstract: A flexible printed circuit board which includes: a base film; and multiple wires formed on the base film, in which in a region attached to a battery including multiple arrayed cells, a conductor portion to be the multiple wires is provided only on one surface of the base film, at at least part of a region apart from the region attached to the battery, a conductor portion to be the multiple wires is provided on each surface of the base film, and the flexible printed circuit board further includes multiple conductive portions configured to electrically connect the wires on one surface side of the base film and the wires on the other surface side of the base film.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: October 24, 2023
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Shunsuke Tomita, Tomoki Kanayama, Kazuyuki Azuma
  • Patent number: 11786162
    Abstract: Provided is an electrode sheet allowing easy connection of a wiring that is extended, when required, to a measurement position on a living body. The electrode sheet (main sheet (1), auxiliary sheet (10)) includes a sheet-shaped flexible substrate (2, 11), wirings (3, 12) formed on the flexible substrate (2, 11), electrodes (5, 14) formed on the flexible substrate (2, 11) and electrically connected to the wirings (3, 12), and an insulating layer (4, 13) laid on the flexible substrate (2, 11) in such a manner that the wirings (3, 12) are overlaid with the insulating layer (4, 13) while the electrodes (5, 14) are exposed. The electrodes (5, 14) are formed of a conductive material in which conductive particles are dispersed in a thermoplastic resin.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: October 17, 2023
    Assignees: Osaka University, Nippon Mektron, Ltd.
    Inventors: Tsuyoshi Sekitani, Takafumi Uemura, Teppei Araki, Shusuke Yoshimoto, Masayuki Iwase, Akio Yoshida, Hideki Satake
  • Patent number: 11754632
    Abstract: Provided is a voltage monitoring module which includes: a land; and a metal plate arranged on the land and soldered to the land, in which a through-hole is partially formed at a location of the metal plate corresponding to the land, a non-formation area is formed at a location of the land corresponding to part of the through-hole, and no conductor is formed in the non-formation area.
    Type: Grant
    Filed: December 7, 2021
    Date of Patent: September 12, 2023
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Hajime Gyotoku, Kazuki Ikemiya, Shuzo Yamada
  • Patent number: 11747215
    Abstract: Provided is a temperature measuring device which includes: a flexible printed circuit board with wiring; a thermistor element; a heat collecting plate; and a pressing member. The flexible printed circuit board is configured to be attached to a case that is fixed to an object to be measured, the thermistor element is electrically connected to the wiring, the heat collecting plate is disposed on a side opposite to the thermistor element via the flexible printed circuit board so as to be pressed against a temperature measuring point in the object to be measured, and the pressing member is made of a foam material and is configured to be compressed when the case is fixed to the object to be measured and to press the heat collecting plate against the object to be measured.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: September 5, 2023
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Tsukasa Watanabe, Shunsuke Tomita, Shuzo Yamada, Kenji Kiya
  • Publication number: 20230246303
    Abstract: An electricity storage module includes a plurality of electricity storage cells, a plurality of resin frames, and a bus bar module. Each of the electricity storage cells includes a pair of external terminals. The bus bar module includes a plurality of bus bars and a bus bar case. The resin frame includes a retaining portion configured to retain the bus bar case. The bus bar case includes a retained portion that is configured to engage with the retaining portion, and a biasing portion that is configured to bias the bus bar toward a side of the retained portion, in a state in which the retained portion is engaged with the retaining portion.
    Type: Application
    Filed: January 27, 2023
    Publication date: August 3, 2023
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, NIPPON MEKTRON, LTD.
    Inventors: Yuki OHIRA, Satoshi TABARA, Shunsuke TOMITA, Tsukasa WATANABE
  • Patent number: 11606859
    Abstract: A stretchable circuit board includes a stretchable base material; a stretchable conductive pattern formed on at least one main surface of the stretchable base material and having stretchability; and a reinforcing base having higher rigidity than the stretchable base material, wherein the reinforcing base reinforces the stretchable base material by being directly or indirectly laminated on the stretchable base material so as to surround at least a part of a formation region of the stretchable conductive pattern in the stretchable base material in a plan view.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: March 14, 2023
    Assignee: NIPPON MEKTRON, LTD.
    Inventor: Masayuki Iwase
  • Publication number: 20230045335
    Abstract: Provided is a method for manufacturing a printed circuit board with electronic component; including: mounting an electronic component on an insulating substrate; applying an insulating first coating resin to at least a part of the electronic component; curing the first coating resin; applying an insulating second coating resin to the cured first coating resin; and curing the second coating resin.
    Type: Application
    Filed: June 8, 2022
    Publication date: February 9, 2023
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Jiang ZHU, Shota OBUCHI
  • Publication number: 20230021344
    Abstract: Provided is a flexible printed circuit board with connection terminal, including: a base film and a conductor layer provided on the base film, wherein the connection terminal includes a plurality of crimping pieces for fixing the connection terminal to the flexible printed circuit board, the crimping pieces penetrate the flexible printed circuit board by being crimped, and are bent in a direction opposite to a direction in which the crimping pieces penetrate the flexible printed circuit board, to bite into at least a part of the conductor layer, and the conductor layer is removed in a region of the conductor layer which the crimping pieces penetrate.
    Type: Application
    Filed: June 1, 2022
    Publication date: January 26, 2023
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Shunsuke AOYAMA, Masanori HIRATA
  • Patent number: 11564313
    Abstract: A wiring body includes: a core insulating base material having a first main surface and a second main surface; a signal line and a first power supply line provided on the first main surface; a second power supply line provided on the second main surface and electrically connected to the first power supply line; a first dielectric layer laminated on the first main surface so as to embed the signal line and the first power supply line; a first ground layer provided on the first dielectric layer; a second dielectric layer laminated on the second main surface so as to embed the second power supply line; and a second ground layer provided on the second dielectric layer and sandwiching at least the signal line together with the first ground layer.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: January 24, 2023
    Assignee: NIPPON MEKTRON, LTD.
    Inventor: Fumihiko Matsuda
  • Publication number: 20230003501
    Abstract: A bend sensor comprising a sensor section in which a polymer electrolyte film is sandwiched between a pair of electrode films, wherein each of the electrode films contains: a block copolymer (Z) having a polymer block (S) composed of a structural unit derived from an aromatic vinyl compound, and containing an ion-conducting group, and an amorphous polymer block (T) composed of a structural unit derived from an unsaturated aliphatic hydrocarbon; and a conducting particle; which block copolymer (Z) forms a lamellar structure, which bend sensor therefore allows generation of enhanced voltage between the electrode films when deformation of the sensor occurs as it follows movement of an object, is provided.
    Type: Application
    Filed: September 6, 2022
    Publication date: January 5, 2023
    Applicant: NIPPON MEKTRON,LTD.
    Inventors: Mikiya MATSUURA, Katsuei TAKAHASHI, Naoki CHIKUGO, Kazuhiko MAEKAWA, Kenji SHACHI