Abstract: Provided is a printed circuit board which includes: a first dielectric layer including a first principal surface and a second principal surface on a side opposite to the first principal surface; a first adhesive layer formed on the first principal surface; a first metal foil pattern formed on the first adhesive layer and forming a signal line; and a second metal foil pattern formed on the second principal surface and forming a ground layer, in which the first metal foil pattern has a higher specific conductivity than a specific conductivity of the second metal foil pattern.

Abstract: A flexible printed circuit board which includes: a base film; and multiple wires formed on the base film, in which in a region attached to a battery including multiple arrayed cells, a conductor portion to be the multiple wires is provided only on one surface of the base film, at at least part of a region apart from the region attached to the battery, a conductor portion to be the multiple wires is provided on each surface of the base film, and the flexible printed circuit board further includes multiple conductive portions configured to electrically connect the wires on one surface side of the base film and the wires on the other surface side of the base film.

Abstract: A flexible printed circuit board includes: a trunk portion; and a pair of branch portions as two portions branched from the trunk portion and arranged on a battery including multiple arrayed cells, in which for at least one branch portion of the pair of branch portions, bending is performed using a pair of parallel bending lines extending apart from the other branch portion as extending apart from the trunk portion, and the at least one branch portion is bent such that a direction of bending at one bending line of the pair of parallel bending lines and a direction of bending at the other bending line are directions opposite to each other.

Abstract: A printed-circuit board includes: a film-shaped thermoplastic base member having plasticity; a pattern fuse formed from a metal foil layer provided on a principal surface of the base member; a cover member covering at least part of the pattern fuse from an opposite side of the base member; and a first heat-resistant protection film provided on a region overlapping with at least part of the pattern fuse and covering the pattern fuse from a cover member side.

Abstract: An adhesive film includes: a resin film layer; and an adhesive layer laminated to the resin film layer, in which the adhesive layer includes an adhesive agent, the adhesive layer is in a B stage state, an oxygen transmission rate at 200° C. of the resin film layer, measured in accordance with JIS K7126-1, is 1.50×10?10 cc·cm/cm2·sec·cmHg or less, and a 3% thermal weight reduction temperature of the adhesive agent is 320° C. or higher.

Abstract: A receiver includes a stretchable circuit board having stretchability and a first antenna formed on a main surface of the stretchable circuit board, the first antenna being configured to stretch in accordance with the stretchable circuit board and configured to receive a signal transmitted from a transmitter installed in a living body.

Abstract: Provided is a method for manufacturing a substrate for flexible printed wiring board, comprising a laminated body forming step and an integration step, wherein in the laminated body forming step, on an upper surface and a lower surface of a fluororesin layer having a modified surface, a first and second reinforcing resin layers having a coefficient of thermal expansion smaller than that of the fluororesin layer are respectively stacked through a first thermosetting adhesive, on the first reinforcing resin layer and/or the second reinforcing resin layer, a conductor layer is stacked through a second thermosetting adhesive, to form a laminated body, and in the integration step, the laminated body is heated and integrated at a temperature not lower than a curing temperature of the first and second thermosetting adhesives and lower than a melting point of the fluororesin layer.

Abstract: Provided is a stretchable wiring board including: a base material having stretchability; a wiring line having at least a portion coated and formed on the base material with a conductive stretchable material; and an uneven engaging portion that is electrically connected to the wiring line and has a protrusion or a recess configured to engage with a connection terminal of an external device.

Abstract: The present invention provide an adhesive composition which is suitable for laminating a polyimide film with a copper foil in a double-sided flexible copper-clad laminate to be used for a flexible printed wiring board. The adhesive composition comprises a polyamide-imide resin, an epoxy resin, and a phosphorus-type flame retardant, wherein 15 to 40 parts by mass of the epoxy resin is compounded to 85 to 60 parts by mass of the polyamide-imide resin; a glass transition temperature of the polyamide-imide resin is 250° C. or higher; an acid value of the polyamide-imide resin is 50 to 150 mgKOH/g; the epoxy resin is liquid at 25° C.; 15 to 60 parts by mass of the phosphorus-type flame retardant is compounded to 100 parts by mass in total of the polyamide-imide resin and the epoxy resin; and 50% by mass or more of the phosphorus-type flame retardant is a phosphinic acid derivative of a phenanthrene type.

Abstract: The invention provides a method of manufacturing a printed circuit board. The printed circuit board (100) has a conductor layer (ground layer (70)), a signal layer (25) having a signal line (20) provided so as to oppose the conductor layer (ground layer (70)), and an insulating resin layer (60) disposed between the conductor layer (ground layer (70)) and the signal layer (25), the insulating resin layer (60) has voids in an overlapping location, in a plan view, with the signal line (20), and the voids (40) are communicated with the outside of the printed circuit board (100).

Abstract: A method for manufacturing a multilayer printed circuit board includes: preparing a first wiring substrate having a first insulating resin film having a first circuit pattern formed on a first main surface, and a first protective film releasably bonded to a second main surface; partially removing the first protective film and the first insulating resin film to form a bottomed via hole having the first circuit pattern exposed on a bottom surface; filling the bottomed via hole with a conductive paste; disposing a second protective film on the first protective film to cover the bottomed via hole filled with the conductive paste; removing an unnecessary portion of the first wiring substrate after the second protective film is disposed on the first protective film; and peeling off the first protective film and the second protective film from the first wiring substrate after the unnecessary portion is removed.

Abstract: An ultrasonic bonding jig includes: a base; and a protrusion portion which has a protrusion portion end surface approximately parallel to the base and which has a pair of first walls, the pair of first walls being disposed upright approximately perpendicular to the base from opposed sides of the protrusion portion end surface. A bonding structure includes a bonding portion of a metal plate and a base material. The bonding portion has a recessed portion with a closed bottom on a surface of the metal plate, and the recessed portion has a pair of walls approximately perpendicular to the surface of the metal plate.

Abstract: A printed wiring board 1 for high frequency transmission according to an embodiment of the present invention includes: an insulating base material 10; a signal line 21 extending in a longitudinal direction of the insulating base material 10; ground wirings 31, 32 extending in the longitudinal direction while being spaced apart from the signal line 21 by a predetermined distance; a ground layer 40 formed on a major surface 10b; a plurality of ground connection vias 51 electrically connecting the ground wiring 31 and the ground layer 40; and a plurality of ground connection vias 52 electrically connecting the ground wiring 32 and the ground layer 40. A width of the ground wirings 31, 32 is smaller than a land diameter of the ground connection vias 51, 52. Then, the ground connection vias 51 and the ground connection vias 52 are arranged not to overlap each other in a width direction perpendicular to the longitudinal direction throughout a cable portion 90.

Abstract: Provided is a pressure sensor that is suitable for measuring a wide range of pressures and has a small footprint. The pressure sensor is constituted by a wiring sheet 10 having: a plurality of sensor devices U1 and U2 including electrodes 19a and 19b, and a conductive film 15 disposed opposite to the electrodes 19a and 19b, and stacked in a direction in which the conductive film 15 is disposed against the electrodes 19a and 19b; a common input line 21 for inputting electrical signals to the plurality of sensor devices U1 and U2; and a common output line 22 for outputting the electrical signals from the plurality of sensor devices.

Abstract: In an electric connector, a waterproof member having an internal waterproof portion and an external waterproof portion is provided in a main body portion. The internal waterproof portion and the external waterproof portion are integrated. Accordingly, the internal waterproof portion covers exposed portions of an upper contact and a lower contact and prevents water intrusion along the upper contact and the lower contact. In addition, the external waterproof portion prevents water intrusion between the electric connector and an inner wall of an accommodating space of an electronic device by surrounding the entire circumference of the main body portion. Since the internal waterproof portion and the external waterproof portion are integrated in this manner, both internal waterproofing and external waterproofing can be realized with the simple configuration of the single waterproof member in the electric connector.

Abstract: There are provided a position recognition apparatus for printed circuit board (PCB), a position recognition and processing apparatus, and a printed circuit board manufacturing method. A position recognition apparatus for PCB configured to recognize a mounting position of an LED package on a PCB, the LED package being including a phosphor emitting fluorescence in operation, includes: an illuminating means configured to irradiate the PCB with light containing a blue component; an observation filter configured to selectively pass at least blue light of reflected light from the PCB and fluorescence from the phosphor and cut light in a wavelength region longer than a wavelength of the blue light; an imaging means configured to capture an image of the light passed by the observation filter; and an image processing means configured to calculate a position of the phosphor on the PCB, based on image data captured by the imaging means.

Abstract: Provided is a stretchable circuit board including: a stretchable base material having stretchability; a film base material overlapping with part of a one-surface-side surface of the stretchable base material and having lower stretchability than that of the stretchable base material; a stretchable wiring line formed on the one-surface-side surface of the stretchable base material; and an adhesive layer formed on one surface side or the other surface side of the stretchable base material. The adhesive layer is formed on both of an overlapping region where the stretchable base material overlaps with the film base material and a non-overlapping region where the stretchable base material does not overlap with the film base material.

Abstract: The present invention aims at providing a cover structure of a tactile sensor and a tactile sensor that can secure sufficient adhesion between a sensor body and a covering layer without providing an adhesive layer and have no possibility of causing a sensor to make detection error due to the covering layer formed thereon. A cover structure of a tactile sensor according to the present invention includes a sensor body 2 and a covering layer 3 made of elastic body molded on the sensor body 2. The covering layer 3 includes at least two layers of an outer layer 32 disposed as the outermost layer and an inner layer 31 disposed to come in contact with the sensor body 2 and having a higher adhesiveness and a lower hardness than those of the outer layer 32, and is integrally molded with the sensor body 2 by the cast molding.

Abstract: Provided is a method for manufacturing a multilayer printed circuit board includes: S1) preparing a first wiring substrate having a first insulating resin film having a first main surface and a second main surface opposite to the first main surface, a first circuit pattern formed on the first main surface, and a first protective film releasably bonded to the second main surface; S2) partially removing the first protective film and the first insulating resin film to form a bottomed via hole having the first circuit pattern exposed on a bottom surface; S3) filling the bottomed via hole with a conductive paste; S4) disposing a second protective film on the first protective film to cover the bottomed via hole filled with the conductive paste; S5) removing an unnecessary portion of the first wiring substrate after the second protective film is disposed on the first protective film; S6) peeling off the first protective film and the second protective film from the first wiring substrate after the unnecessary portion

Abstract: A printed wiring board 1 for high frequency transmission according to an embodiment of the present invention includes: an insulating base material 10; a signal line 21 extending in a longitudinal direction of the insulating base material 10; ground wirings 31, 32 extending in the longitudinal direction while being spaced apart from the signal line 21 by a predetermined distance; a ground layer 40 formed on a major surface 10b; a plurality of ground connection vias 51 electrically connecting the ground wiring 31 and the ground layer 40; and a plurality of ground connection vias 52 electrically connecting the ground wiring 32 and the ground layer 40. A width of the ground wirings 31, 32 is smaller than a land diameter of the ground connection vias 51, 52. Then, the ground connection vias 51 and the ground connection vias 52 are arranged not to overlap each other in a width direction perpendicular to the longitudinal direction throughout a cable portion 90.