Patents Assigned to Nippon Mektron, Ltd.
  • Publication number: 20220404214
    Abstract: A temperature measurement device includes: a case fixed to a measurement target product; a flexible printed circuit board attached to the case; and a thermistor element mounting portion having a thermistor element to be electrically connected to a wiring provided on the flexible printed circuit board, the case has a holding portion for holding the thermistor element mounting portion and a support portion for supporting the holding portion, the holding portion is connected through a hinge portion to a case body provided with the support portion, and the holding portion is supported by the support portion in such a manner that the holding portion is folded back to bend the hinge portion.
    Type: Application
    Filed: March 2, 2022
    Publication date: December 22, 2022
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Shunsuke TOMITA, Tomoki KANAYAMA, Yuki KOMURO, Yusuke HASHIMOTO
  • Publication number: 20220294135
    Abstract: A crimp terminal-equipped flexible printed circuit board includes: a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil; multiple crimp terminals including crimp pieces crimped to penetrate the first flexible printed circuit board and bent to bite into part of the circuit; and an insulating reinforcing film partially integrally provided on an area of the base film where the multiple crimp pieces penetrate.
    Type: Application
    Filed: November 15, 2021
    Publication date: September 15, 2022
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Masanori HIRATA, Shunsuke AOYAMA, Yu MIURA, Kenji KIYA
  • Publication number: 20220236332
    Abstract: Provided is a voltage monitoring module which includes: a land; and a metal plate arranged on the land and soldered to the land, in which a through-hole is partially formed at a location of the metal plate corresponding to the land, a non-formation area is formed at a location of the land corresponding to part of the through-hole, and no conductor is formed in the non-formation area.
    Type: Application
    Filed: December 7, 2021
    Publication date: July 28, 2022
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Hajime GYOTOKU, Kazuki IKEMIYA, Shuzo YAMADA
  • Patent number: 11382211
    Abstract: A flexible printed circuit board includes: a trunk portion; and a pair of branch portions as two portions branched from the trunk portion and arranged on a battery including multiple arrayed cells, in which for at least one branch portion of the pair of branch portions, bending is performed using a pair of parallel bending lines extending apart from the other branch portion as extending apart from the trunk portion, and the at least one branch portion is bent such that a direction of bending at one bending line of the pair of parallel bending lines and a direction of bending at the other bending line are directions opposite to each other.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: July 5, 2022
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Shunsuke Tomita, Tomoki Kanayama, Shuzo Yamada
  • Publication number: 20220201849
    Abstract: A stretchable circuit board includes a stretchable base material; a stretchable conductive pattern formed on at least one main surface of the stretchable base material and having stretchability; and a reinforcing base having higher rigidity than the stretchable base material, wherein the reinforcing base reinforces the stretchable base material by being directly or indirectly laminated on the stretchable base material so as to surround at least a part of a formation region of the stretchable conductive pattern in the stretchable base material in a plan view.
    Type: Application
    Filed: September 7, 2021
    Publication date: June 23, 2022
    Applicant: NIPPON MEKTRON, LTD.
    Inventor: Masayuki IWASE
  • Patent number: 11343901
    Abstract: A printed-circuit board includes: a film-shaped thermoplastic base member having plasticity; a pattern fuse formed from a metal foil layer provided on a principal surface of the base member; a cover member covering at least part of the pattern fuse from an opposite side of the base member; and a first heat-resistant protection film provided on a region overlapping with at least part of the pattern fuse and covering the pattern fuse from a cover member side.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: May 24, 2022
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Kenji Kiya, Tomoki Kanayama
  • Patent number: 11310917
    Abstract: Provided is a method for manufacturing a substrate for flexible printed wiring board, comprising a laminated body forming step and an integration step, wherein in the laminated body forming step, on an upper surface and a lower surface of a fluororesin layer having a modified surface, a first and second reinforcing resin layers having a coefficient of thermal expansion smaller than that of the fluororesin layer are respectively stacked through a first thermosetting adhesive, on the first reinforcing resin layer and/or the second reinforcing resin layer, a conductor layer is stacked through a second thermosetting adhesive, to form a laminated body, and in the integration step, the laminated body is heated and integrated at a temperature not lower than a curing temperature of the first and second thermosetting adhesives and lower than a melting point of the fluororesin layer.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: April 19, 2022
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Toshihiro Higashira, Fuki Hatano
  • Publication number: 20220117085
    Abstract: Provided is a method for forming a through-hole including: forming a laminated body including a fluororesin layer having a first main surface and a second main surface, a first adhesive layer, a first reinforcing resin layer and a first conductor layer provided on the first main surface, a second adhesive layer, a second reinforcing resin layer and a second conductor layer provided on the second main surface; forming an opening in the first conductor layer and irradiating the opening with a laser beam to form a bottomed conduction hole with the second conductor layer exposed on a bottom surface of the conduction hole, wherein a thermal decomposition temperature of the second cured adhesive layer is lower than those of the first reinforcing resin layer and the second reinforcing resin layer, and a thickness of the second cured adhesive layer is 10 ?m or more and 200 ?m or less.
    Type: Application
    Filed: October 5, 2021
    Publication date: April 14, 2022
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Toshihiro HIGASHIRA, Fuki HATANO
  • Publication number: 20220077536
    Abstract: Provided is a wiring material which is advantageous for space saving while ensuring seismic resistance of a flexible circuit board. A wiring material 7 including a flexible circuit board 10 in which a plurality of batteries 3A to 3L arranged in one direction is connected to one another via a bus bar 20 and an arrangement direction of the batteries 3A to 3L is a longitudinal direction of the flexible circuit board 10, includes: a narrow connecting portion 18 connected to the bus bar 20; and a main body 68 that is connected to the connecting portion 18 and includes a portion wider than the connecting portion 18. The connecting portion 18 is configured to have a longitudinal extending portion 18a that projects from the main body 68 in the longitudinal direction and extends in the longitudinal direction.
    Type: Application
    Filed: March 18, 2020
    Publication date: March 10, 2022
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Shuzo YAMADA, Tsukasa WATANABE, Shunsuke TOMITA, Tomoki KANAYAMA
  • Publication number: 20220053636
    Abstract: A wiring body includes: a core insulating base material having a first main surface and a second main surface; a signal line and a first power supply line provided on the first main surface; a second power supply line provided on the second main surface and electrically connected to the first power supply line; a first dielectric layer laminated on the first main surface so as to embed the signal line and the first power supply line; a first ground layer provided on the first dielectric layer; a second dielectric layer laminated on the second main surface so as to embed the second power supply line; and a second ground layer provided on the second dielectric layer and sandwiching at least the signal line together with the first ground layer.
    Type: Application
    Filed: May 17, 2021
    Publication date: February 17, 2022
    Applicant: NIPPON MEKTRON, LTD.
    Inventor: Fumihiko MATSUDA
  • Publication number: 20220046766
    Abstract: Provided is a tubular heater whose attachment process is facilitated and whose heating efficiency is high. Features of the tubular heater are that the tubular heater includes a tubular elastic body 200 and a flexible printed circuit board 100 provided integrally with the elastic body 200 and formed with a heating circuit and a heating unit 110 of the flexible printed circuit board 100 formed with the heating circuit is provided in the elastic body 200 in a state in which the heating unit 110 is exposed on an inner peripheral side and extends along an inner peripheral surface of the elastic body 200 with tip ends of the heating unit 110 being separated from each other with a clearance S in a circumferential direction.
    Type: Application
    Filed: April 17, 2020
    Publication date: February 10, 2022
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Tatsuro HAYASHI, Shota SEKI, Hirokazu IWAKI, Takashi SASAKI
  • Publication number: 20220045396
    Abstract: Provided are a support member and a battery module in consideration of variations in dimensions of the battery. At the same time, stress concentration on the support member is alleviated. A sliding portion 127 of one of adjacent support cases 121 of the plurality of support cases 121 connected to each other is slidably housed in the main body portion 122 of the other support case 121. Apart of the sliding portion 127 of the one support case 121 is pulled out from the main body portion 122 of the other support case 121. Thus, a distance between the one support case 121 and the other support case 121 is increased. At least a part of the sliding portion 127 of the one support case 121 is housed in the main body portion 122 of the other support case 121. Thus, the distance between the one support case 122 and the other support case 122 is decreased.
    Type: Application
    Filed: September 3, 2019
    Publication date: February 10, 2022
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Shunsuke TOMITA, Tomoki KANAYAMA
  • Publication number: 20220042857
    Abstract: Provided is a temperature measuring device which includes: a flexible printed circuit board with wiring; a thermistor element; a heat collecting plate; and a pressing member. The flexible printed circuit board is configured to be attached to a case that is fixed to an object to be measured, the thermistor element is electrically connected to the wiring, the heat collecting plate is disposed on a side opposite to the thermistor element via the flexible printed circuit board so as to be pressed against a temperature measuring point in the object to be measured, and the pressing member is made of a foam material and is configured to be compressed when the case is fixed to the object to be measured and to press the heat collecting plate against the object to be measured.
    Type: Application
    Filed: June 4, 2021
    Publication date: February 10, 2022
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Tsukasa WATANABE, Shunsuke TOMITA, Shuzo YAMADA, Kenji KIYA
  • Patent number: 11225990
    Abstract: A welding method includes overlapping a thin metal plate with a base material, and setting an annular welding schedule line on a welding schedule portion of the thin metal plate; forming a welding line such that a continuous irradiation with a laser light from a fiber laser is performed while moving the laser light along the welding schedule line, and while vibrating the laser light across the welding schedule line; and setting a length of the welding line such that an entire inside of the welding schedule line is welded.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: January 18, 2022
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi Miyashiro, Yoichi Suruga, Shuhei Koyano
  • Patent number: 11219123
    Abstract: Provided is a printed circuit board which includes: a first dielectric layer including a first principal surface and a second principal surface on a side opposite to the first principal surface; a first adhesive layer formed on the first principal surface; a first metal foil pattern formed on the first adhesive layer and forming a signal line; and a second metal foil pattern formed on the second principal surface and forming a ground layer, in which the first metal foil pattern has a higher specific conductivity than a specific conductivity of the second metal foil pattern.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: January 4, 2022
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Fumihiko Matsuda, Yoshihiko Narisawa, Kenji Kumagai, Daisuke Shiokawa, Yuki Ogi, Akihiko Toyoshima, Masami Uchino, Isao Arase, Hiroshi Takeuchi
  • Publication number: 20210360747
    Abstract: Provided is a heater which includes a base film having a metal foil on a surface of the base film, and a resistor. The metal foil forms a heater circuit that generates heat when energized, and the heater circuit is connected in series with the resistor.
    Type: Application
    Filed: March 31, 2021
    Publication date: November 18, 2021
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Shunsuke AOYAMA, Kazuyuki AZUMA
  • Publication number: 20210313719
    Abstract: A flexible printed wiring board with crimp terminal includes: a flexible printed wiring board having a base film, a circuit including a metal foil provided on a surface of the base film, and a cover film attached to the base film so as to sandwich the circuit; and a crimp terminal with a plurality of crimping pieces that penetrates the flexible printed wiring board by being crimped and is bent to bite into a part of the circuit. A part of the circuit is exposed without the cover film being provided in a partial region of the flexible printed wiring board, and at least some of the crimping pieces are arranged in the partial region, and thus bite into a part of the circuit without penetrating the cover film.
    Type: Application
    Filed: February 23, 2021
    Publication date: October 7, 2021
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Shuzo YAMADA, Yu MIURA, Tomoki KANAYAMA
  • Patent number: 11137437
    Abstract: Provided is a probe device used for electrical inspection of a printed wiring board, the probe device including at least one probe group including a plurality of wire probes configured to be able to simultaneously abut against a wire provided on the printed wiring board and extending in a specified direction, the plurality of wire probes abutting against the wire along the direction and being electrically connected to each other.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: October 5, 2021
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Shoji Takano, Fumihiko Matsuda, Yoshihiko Narisawa
  • Publication number: 20210307118
    Abstract: Provided is a heater which includes a flexible printed wiring board, in which the flexible printed wiring board includes a base film, a first metal foil, and a second metal foil, the first metal foil forms a heater circuit portion that generates heat when energized, on a first surface of the base film, and the second metal foil forms a heat conductive foil portion that maintains a non-energized state, on a second surface of the base film.
    Type: Application
    Filed: February 23, 2021
    Publication date: September 30, 2021
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Garo MIYAMOTO, Shunsuke AOYAMA
  • Publication number: 20210307155
    Abstract: A heater includes: a flexible printed wiring board including a base film and a metal foil provided on one side of the base film; a heater circuit portion that is formed from the metal foil and generates heat when energized; and a heat conductive foil portion that is formed from the metal foil at a position away from the heater circuit portion and is maintained in a non-energized state.
    Type: Application
    Filed: February 8, 2021
    Publication date: September 30, 2021
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Shunsuke AOYAMA, Kenji KIYA