Patents Assigned to Nippon Mektron, Ltd.
  • Publication number: 20190050701
    Abstract: An attachment tag includes a stretchable circuit board having stretchability, a stretchable wiring line provided on a first main surface of the stretchable circuit board and having stretchability, an identification signal generator connected to the stretchable wiring line and configured to generate an identification signal containing identification information, a transmitter configured to transmit the identification signal generated by the identification signal generator, and an adhesive layer provided on a second main surface, different from the first main surface, of the stretchable circuit board and exhibiting adhesiveness.
    Type: Application
    Filed: July 23, 2018
    Publication date: February 14, 2019
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Akio YOSHIDA, Mitsunori SASAKI
  • Patent number: 10194527
    Abstract: [Problem] Provided is a method for manufacturing a stretchable circuit board, which can facilitate positioning of an external terminal and a stretchable wiring, and increase manufacturing yield of a stretchable circuit board. [Solving Mean] A stretchable circuit board is manufactured through: a step in which an external terminal 31 is formed on a main surface 33b located on one side of a film base 33; a step in which a stretchable wiring portion 55 is formed on a main surface 53a located on one side of a stretchable base 53; and a step in which the stretchable wiring portion 55 is positioned with the external terminal 31, and pressure and heat are applied to the film base 33 and the stretchable wiring portion 55 to join them, whereby the external terminal 31 and the stretchable wiring portion 55 are connected with each other.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: January 29, 2019
    Assignee: NIPPON MEKTRON, LTD.
    Inventor: Masayuki Iwase
  • Publication number: 20190029108
    Abstract: The invention provides a method of manufacturing a printed circuit board. The printed circuit board (100) has a conductor layer (ground layer (70)), a signal layer (25) having a signal line (20) provided so as to oppose the conductor layer (ground layer (70)), and an insulating resin layer (60) disposed between the conductor layer (ground layer (70)) and the signal layer (25), the insulating resin layer (60) has voids in an overlapping location, in a plan view, with the signal line (20), and the voids (40) are communicated with the outside of the printed circuit board (100).
    Type: Application
    Filed: July 27, 2018
    Publication date: January 24, 2019
    Applicant: NIPPON MEKTRON, LTD.
    Inventor: Fumihiko Matsuda
  • Publication number: 20190009357
    Abstract: An ultrasonic bonding jig includes: a base; and a protrusion portion which has a protrusion portion end surface approximately parallel to the base and which has a pair of first walls, the pair of first walls being disposed upright approximately perpendicular to the base from opposed sides of the protrusion portion end surface. A bonding structure includes a bonding portion of a metal plate and a base material. The bonding portion has a recessed portion with a closed bottom on a surface of the metal plate, and the recessed portion has a pair of walls approximately perpendicular to the surface of the metal plate.
    Type: Application
    Filed: March 16, 2018
    Publication date: January 10, 2019
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi MIYASHIRO, Yoichi SURUGA, Shuhei KOYANO
  • Publication number: 20180369953
    Abstract: An ultrasonic bonding method includes: stacking a metal plate and a base material; pressing the metal plate to the base material by an ultrasonic bonding jig; forming a plurality of recessed portions, a flat portion among recessed portions, and an annular flat portion on the metal plate by the ultrasonic bonding jig, the flat portion among recessed portions being disposed among the plurality of recessed portions, the annular flat portion surrounding the plurality of recessed portions; and vibrating the ultrasonic bonding jig while the ultrasonic bonding jig presses the metal plate.
    Type: Application
    Filed: March 16, 2018
    Publication date: December 27, 2018
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi MIYASHIRO, Shuhei KOYANO, Yoichi SURUGA
  • Patent number: 10162137
    Abstract: A mounting apparatus for mounting an optical element on a wiring board having a reflecting mirror part of an optical waveguide on its back side comprises a mounting table that supports the wiring board by a holding area, a mounting nozzle that holds the optical element and mounts it on the wiring board, a light source that emits light for illuminating the reflecting mirror part by transmission through the holding area, an image pickup apparatus that captures a transmitted light image of the reflecting mirror part, and a control apparatus that determines a mounting position of the optical element based on the transmitted light image, thereby achieving high density mounting without providing a light introducing part for positioning in mounting the optical axis.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: December 25, 2018
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Toru Mizuno, Hiroshi Ikeda, Tatsunori Otomo, Toshinobu Miyagoshi, Shoji Takano, Fumihiko Matsuda, Garo Miyamoto
  • Publication number: 20180362815
    Abstract: The present invention provide an adhesive composition which is suitable for laminating a polyimide film with a copper foil in a double-sided flexible copper-clad laminate to be used for a flexible printed wiring board. The adhesive composition comprises a polyamide-imide resin, an epoxy resin, and a phosphorus-type flame retardant, wherein 15 to 40 parts by mass of the epoxy resin is compounded to 85 to 60 parts by mass of the polyamide-imide resin; a glass transition temperature of the polyamide-imide resin is 250° C. or higher; an acid value of the polyamide-imide resin is 50 to 150 mgKOH/g; the epoxy resin is liquid at 25° C.; 15 to 60 parts by mass of the phosphorus-type flame retardant is compounded to 100 parts by mass in total of the polyamide-imide resin and the epoxy resin; and 50% by mass or more of the phosphorus-type flame retardant is a phosphinic acid derivative of a phenanthrene type.
    Type: Application
    Filed: November 9, 2016
    Publication date: December 20, 2018
    Applicants: TOYOBO CO., LTD., NIPPON MEKTRON, LTD.
    Inventors: Takehisa YANE, Hideyuki KOYANAGI, Manabu OHRUI, Satoshi EBIHARA
  • Publication number: 20180335060
    Abstract: A welding method includes overlapping a thin metal plate with a base material, and setting an annular welding schedule line on a welding schedule portion of the thin metal plate; forming a welding line such that a continuous irradiation with a laser light from a fiber laser is performed while moving the laser light along the welding schedule line, and while vibrating the laser light across the welding schedule line; and setting a length of the welding line such that an entire inside of the welding schedule line is welded.
    Type: Application
    Filed: January 22, 2018
    Publication date: November 22, 2018
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi MIYASHIRO, Yoichi SURUGA, Shuhei KOYANO
  • Patent number: 10136514
    Abstract: An extensible flexible printed circuit board sets one or a plurality of flexible printed circuit boards each including a plurality of conductive layers and an insulating layer as a base circuit board, and includes: component mounting parts which are provided at least at parts of the base circuit board, and capable of mounting electronic components; an extensible conductive part which is provided at least at a part of the base circuit board, includes a plurality of joint parts each intersecting a center line in an extension/contraction direction and a plurality of curved parts each continuing from an end part of each joint part and curve, and exhibits extensibility by the curved parts curving to open or close; and a covering member whose material is a flexibly deformable elastomer, and which covers the component mounting parts and the extensible conductive part.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: November 20, 2018
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Akio Yoshida, Kiyoshi Igarashi, Shingo Muromoto, Taisuke Kimura, Nobuyuki Shintaku
  • Patent number: 10104774
    Abstract: Provided is a flexible printed wiring board capable of increasing the number of wires even when the board is used in a narrow arrangement space and enhancing the degree of freedom for design while maintaining the board in a self-supported state. A flexible printed wiring board 100 is used in a state, in which one and another ends in a longitudinal direction are fixed respectively to one and another members that move in relation to each other in a state of being bent to be curved in the longitudinal direction. The flexible printed wiring board includes wiring board units 100A and 100B in which a plurality of wires are formed on a flexible insulating substrate and which are molded in a state of being curved in a lateral direction, and adjacent wiring board units are partially connected at side edges thereof in the lateral direction.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: October 16, 2018
    Assignee: NIPPON MEKTRON, LTD.
    Inventor: Fumihiko Matsuda
  • Patent number: 10084211
    Abstract: To be small-sized/light in weight, and to easily cope with the variation of an inter-electrode pitch of battery cells. A flexible printed circuit with bus bars of one embodiment includes a flexible printed wiring board having a flexible insulating base material and a plurality of wiring patterns provided on one main surface of the flexible insulating base material and provided with land parts for bus bar connection at one end, and a plurality of bus bars and fixed to the land parts for the bus bar connection with an adhesive. The plurality of bus bars and are electrically connected to the respectively corresponding land parts for the bus bar connection in block by a plating layer formed on the bus bar and the land part for the bus bar connection.
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: September 25, 2018
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Hiroshi Nomoto, Koichiro Yoshizawa
  • Patent number: 10076025
    Abstract: A stretchable circuit board includes plural stretchable bases, and plural stretchable wiring portions, at least one of which is provided on each of main surfaces, facing each other, of the plural stretchable bases, in which the stretchable wiring portions provided on the main surfaces are electrically continuous with each other through a connecting portion.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: September 11, 2018
    Assignee: NIPPON MEKTRON, LTD.
    Inventor: Masayuki Iwase
  • Patent number: 10048141
    Abstract: Provided is a pressure sensing element configured to be flexible, and capable of demonstrating a stable electrical reliability over a long period; and, a pressure sensor having such pressure sensing element. A pressure sensing element (100) has an electro-conductive pressure sensing film (14), a sensor electrode (12) provided at a position faced to the pressure sensing film (14), and an insulating layer (13) which creates a predetermined distance “A” between the pressure sensing film (14) and the sensor electrode (12) so as to keep them apart from each other, the pressure sensing film (14) being a resin film containing carbon particles (140); and, a pressure sensor (200) has the pressure sensing element (100), and a detection unit (210) which is electrically connected with the pressure sensing element (100) so as to detect contact resistance between the pressure sensing film (14) and the sensor electrode (12).
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: August 14, 2018
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Masayuki Iwase, Keizo Toyama, Kazuyuki Ozaki, Hirokazu Ohdate, Taisuke Kimura, Ryoichi Toyoshima
  • Patent number: 10034370
    Abstract: A stretchable circuit board includes: a stretchable portion 50 that includes a stretchable base 53 haying stretchability and a stretchable wiring 55 formed on a first main surface 53a of the stretchable base 53 and having stretchability; and a non-stretchable portion 30 that includes a base substrate 34 having stretchability lower than that of the stretchable base 53 and a draw-out wiring 35 formed on a main surface 32b of the base substrate 34, in which the main surface 53a of the stretchable portion 53 and the main surface 32b of the base substrate 34 are joined with each other, and the stretchable wiring 55 and the draw-out wiring 35 are electrically connected with each other. In addition, the main surface 32b of the base substrate has a rough surface with projections and depressions.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: July 24, 2018
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Masayuki Iwase, Keizo Toyama
  • Publication number: 20180202946
    Abstract: A substrate inspection device for inspecting a flexible printed board to determine whether the transparent adhesive material is properly applied thereto comprises: a substrate reading device which irradiates the flexible printed board with visible light to acquire image data; an adhesive material position determination unit which determines a position of adhesive material CAD data corresponding to the transparent adhesive material with respect to blue color image data among the image data corresponding to blue light which is readily absorbed by polyimide, to create adhesive material alignment data in which the adhesive material CAD data is superposed; an edge enhancing unit which performs processing, on the blue color image data, to enhance an edge of the transparent adhesive material; and a straight line determination unit which determines whether the edge of the transparent adhesive material is present in edge enhanced data in which the edge of the transparent adhesive material is enhanced.
    Type: Application
    Filed: December 16, 2016
    Publication date: July 19, 2018
    Applicant: NIPPON MEKTRON, LTD.
    Inventor: Kenichi MISHIMA
  • Patent number: 10004148
    Abstract: A wiring substrate is manufactured by attaching an adhesive protective film to a metal-foiled laminate sheet, forming bottomed via holes by partially removing the film and an insulating film, filling conductive pastes into the holes, and peeling the film. A wiring substrate is manufactured by forming an adhesive protective layer so as to cover a patterned metal foil on a metal-foiled laminate sheet, forming bottomed step via holes by partially removing the layer and an insulating film, filling conductive pastes into the holes, and peeling off a protective film. The wiring substrate and the second wiring substrate are laminated in such a way that protruding parts of the pastes come into contact with respective protruding parts of the pastes.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: June 19, 2018
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Shoji Takano, Fumihiko Matsuda
  • Patent number: 9961766
    Abstract: A stretchable circuit board includes a stretchable base, a stretchable wiring portion, a reinforcement base having in-plane rigidity higher than that of the stretchable base, and a draw-out wiring portion. The stretchable wiring portion having stretchability is formed on a main surface located on at least one side of the stretchable base. The draw-out wiring portion is formed at least on a main surface that is one side of the reinforcement base. The main surface of the reinforcement base is overlaid with a part of an area where the stretchable wiring portion is formed, in which the main surface faces the main surface of the stretchable base. A part of the stretchable wiring portion and a part of the draw-out wiring portion are joined together, and they are electrically continuous.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: May 1, 2018
    Assignee: NIPPON MEKTRON, LTD.
    Inventor: Masayuki Iwase
  • Publication number: 20180116049
    Abstract: The stretchable circuit board (100) includes: a stretchable base (10); a stretchable wiring portion (20) formed on the stretchable base (10); a reinforcement base (30) having in-plane rigidity higher than that of the stretchable base (10); a draw-out wiring portion (40) formed on the reinforcement base (30), and electrically continuous with the stretchable wiring portion (20); and an elastomer layer (50) formed on the reinforcement base (30). The reinforcement base (30) overlaps with a partial area (10a) of the stretchable base (10). An other area (10b) of the stretchable base (10) is exposed from the reinforcement base (30). The stretchable wiring portion (20) extends on the other area (10b) and over the partial area (10a). The elastomer layer (50) and the stretchable base (10) are layered and joined with each other.
    Type: Application
    Filed: January 30, 2017
    Publication date: April 26, 2018
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Masayuki Iwase, Takeo Wakabayashi, Eiji Mizuno
  • Publication number: 20180092206
    Abstract: A stretchable circuit board includes: a stretchable portion 50 that includes a stretchable base 53 haying stretchability and a stretchable wiring 55 formed on a first main surface 53a of the stretchable base 53 and having stretchability; and a non-stretchable portion 30 that includes a base substrate 34 having stretchability lower than that of the stretchable base 53 and a draw-out wiring 35 formed on a main surface 32b of the base substrate 34, in which the main surface 53a of the stretchable portion 53 and the main surface 32b of the base substrate 34 are joined with each other, and the stretchable wiring 55 and the draw-out wiring 35 are electrically connected with each other. In addition, the main surface 32b of the base substrate has a rough surface with projections and depressions.
    Type: Application
    Filed: August 30, 2017
    Publication date: March 29, 2018
    Applicant: NIPPON MEKTRON, LTD.
    Inventors: Masayuki Iwase, Keizo Toyama
  • Publication number: 20180077794
    Abstract: [Problem] Provided is a method for manufacturing a stretchable circuit board, which can facilitate positioning of an external terminal and a stretchable wiring, and increase manufacturing yield of a stretchable circuit board. [Solving Mean] A stretchable circuit board is manufactured through: a step in which an external terminal 31 is formed on a main surface 33b located on one side of a film base 33; a step in which a stretchable wiring portion 55 is formed on a main surface 53a located on one side of a stretchable base 53; and a step in which the stretchable wiring portion 55 is positioned with the external terminal 31, and pressure and heat are applied to the film base 33 and the stretchable wiring portion 55 to join them, whereby the external terminal 31 and the stretchable wiring portion 55 are connected with each other.
    Type: Application
    Filed: August 24, 2017
    Publication date: March 15, 2018
    Applicant: NIPPON MEKTRON, LTD.
    Inventor: Masayuki Iwase