Abstract: Disclosed is a vulcanizable fluororubber composition comprising (a) a tetrafluoroethylene/perfluoroalkyl vinyl ether copolymer, (b) an organic peroxide, (c) a co-crosslinking agent and (d) hydrotalcite. The copolymer (a) preferably contains an iodine atom or a bromine atom. The vulcanizable fluororubber composition preferably further comprises carbon black or titanium oxide. When the vulcanizable fluororubber composition is vulcanized, the resulting vulcanizate has excellent compression set and is relatively non-toxic.

Abstract: Vinylidene fluoride and chlorotrifluoroethylene are copolymerized in the presence of a compound represented by the general formula I: InBrmR  (I) wherein R represents a fluorohydrocarbon group, a chlorofluorohydrocarbon group, a chlorohydrocarbon group or a hydrocarbon group, and n is 0, 1 or 2 and m is 0, 1 or 2 provided that n+m≧2. This provides a process for producing a fluorinated copolymer which enables providing a fluorinated copolymer crosslinking product having mechanical properties satisfactory for practical use as sealants even if no inorganic additive is added thereto.

Abstract: Many boards 7 to be processed are disposed within a metal chamber 1 in an isolated state, and many ground electrode plates 9 are disposed near by both surfaces of the boards 7 so as to be at the same potential as the chamber 1. While a microwave generated by a magnetron 3 from an upper portion of the chamber 1 is applied in the chamber 1, both surfaces of the boards 7 are processed at a time with plasma by using glow discharges produced between the boards 7 and plates 9 due to a difference in high-frequency potential between the boards 7 and plates 9 under presence of reaction gas.

Abstract: A connection structure of a suspension for a magnetic head suitable for assembly automation is provided. The connection structure of a suspension for a magnetic head comprises a suspension (1) for a magnetic head which includes a circuit wiring pattern (4) for connecting to the terminal side of a magnetic head and is clasped by and supported between an actuator arm (9) and a base plate (10), a relay board (7) for connecting the circuit wiring pattern to a read/write amplifier-board, and a connecting portion consisting of a pair of terminals (6) and (8) provided at portions of the suspension for a magnetic head and the relay board which are clasped by the actuator arm and the base plate, and wherein the connecting portion is formed by positioning the pair of terminals opposite one another and bringing them into mutual contact.

Abstract: A desired circuit wiring pattern is formed by plating a conductive layer having excellent resistance at least to an etching solution on a metal layer which is removed in the post-process by etching. A surface protective layer having a hole for exposing part of the circuit wiring pattern is formed on both sides of the circuit wiring pattern at a predetermined position as an external connection terminal portion. The circuit wiring pattern can be formed in multiple layers by coating the conductive layer with a circuit wiring layer of another conductive material and a bump is formed to fill the hole as required.

Abstract: A method of manufacturing a magnetic head suspension having a circuit wiring pattern member such that a circuit wiring pattern is formed integral with a suspension via a flexible insulating base member, comprising the steps of: preparing a laminated plate composed of a flexible insulating base member (2), a conductive layer (6 or 3) formed on one surface thereof, and an elastic metal layer (5 or 1) formed on the other surface thereof; forming a desired circuit wiring pattern (3) in the conductive layer (6) of the laminated plate and an elastic suspension (1) in the elastic metal layer (5) thereof simultaneously, in accordance with photo-fabrication method including both-side simultaneous exposure method; forming a bonding metal layer (10) on the circuit wiring pattern (3) by plating; forming a cover coat layer (11) so as to cover the bonding metal layer; further forming a metal mask (13 or 13A) by forming a surface metal layer (12) on the cover coat layer and by etching the surface metal layer (12) or else by

Abstract: A magnetic head suspension assembly, wherein a wiring member for connecting a magnetic head element with a read/write amplifier circuit board is integrally formed with the suspension for supporting the magnetic head element. The suspension is equipped integrally with a circuit wiring pattern via a flexible insulating base material. The flexible insulating base material is made as wide as the circuit wiring pattern. The top surface of the circuit wiring pattern has a surface protecting layer which is wider than the circuit wiring pattern.

Abstract: A flexible circuit board, an end of which is uniformly connected to the inside of a springy metal layer, which has been bent to a U shape, and the rest of which extends in a predetermined width away from the springy metal layer. The flexible circuit board is equipped with bump-shaped connecting terminals on the opposed bent sections, each connecting terminal having a first side connected to the ends of the circuit wiring pattern formed on the flexible circuit board and a second generally opposed side projecting outwardly from the flexible circuit board. The bump-shaped terminals are electrically connected to the terminal of the magnetic head suspension, which is made integral with circuit wiring, by the clamping force of the springy metal layer.

Abstract: A method of manufacturing a magnetic head suspension having a circuit wiring pattern member, comprises the steps of: preparing a laminated plate composed of a flat flexible insulating base member (2), a conductive layer (9 or 3) formed on one surface thereof, and an elastic metal layer (8 or 1) formed on the other surface thereof; photo-etching the conductive layer of the laminated plate, to form a metal mask (9) of a desired flexible insulating base member shape; removing the exposed flexible insulating base member (2) to such a thickness that the elastic metal layer (8 or 1) is at least not exposed; photo-etching the formed metal mask (9), to form a desired circuit wiring pattern (3); further etching the flexible insulating base member (2), to remove a part of the flexible insulating base member (2) still remaining on the surface of the elastic metal layer (8 or 1) in the preceding step, by using the formed circuit wiring pattern (3) as a mask; forming a surface protecting layer (4) on the surface of the fo

Abstract: A chip adhesion preventing device is capable of preventing chips from adhering to the drill shank of a drill held on a spindle (1) included in a boring machine. Fluid passages (17, 23) are formed in the spindle (1) and a work holding member (19), respectively, and nozzle holes (18 and 22) are formed in the spindle (1) and the work holding member (19) so as to be connected to the outlet ends of the fluid passages (17 and 23), respectively, and to be directed toward the shank (13) of the drill (3). A high-pressure fluid is jetted through the nozzle holes (18, 22) toward the drill shank (13) to blow off chips (15) adhering to the drill shank (13).

Abstract: A magnetic head suspension, wherein the interconnection wiring is integrated with a spring-like metal suspension member, is manufactured by first preparing a laminated plate comprised of a flexible insulating base sandwiched between a resilient metal layer and a layer of an electrical conductor. The electrical conductor layer and resilient metal layer are respectively formed into the desired circuit wiring pattern and a suspension member, unnecessary portions of the insulating base are removed, the wiring pattern is provided with a protective layer and the suspension member is mechanically formed into a desired final configuration.

Abstract: A desired circuit wiring pattern is formed by forming by plating means a conductive layer having excellent resistance at least to an etching solution on a metal layer which is removed in the post-process by etching means using a resist layer. A surface protective layer having a hole for exposing part of the circuit wiring pattern is formed on both sides of the circuit wiring pattern at a predetermined position as an external connection terminal portion. The circuit wiring pattern can be formed in multiple layers by coating the conductive layer with a circuit wiring layer of another conductive material and a bump is formed to fill the hole as required.

Abstract: A method of manufacturing a magnetic head junction board wherein a laminated plate having a springy metal layer and a conductive layer is prepared. A circuit wiring pattern is formed on the conductive layer by photoetching and the springy metal layer is formed into a predetermined shape by etching. The circuit wiring pattern is provided with a surface protecting layer which leaves holes exposed at the ends of the circuit wiring pattern. Then, the holes are filled with conductive metal to form bump-shaped terminals such that the ends on one side jut out of the surface protecting layer. Lastly, the springy metal layer is bent into a predetermined shape so that the bump-shaped terminals face against each other. Alternative process are also disclosed.

Abstract: An active reception antenna with a coplanar waveguide having a high actual gain in the frequency band as broad as 100% or larger of the central frequency. The reception active antenna with a coplanar waveguide has: a pair of coplanar waveguide functioning as a feeder, the coplanar waveguide including a center conductor and two ground conductors printed on one surface of a dielectric film; and an antenna element conductor connected to the coplanar waveguide, the antenna element conductor being printed on the surface of the dielectric film, wherein the feed points of the antenna element conductor are disposed near the ends of the feeder, an active circuit including a field effect transistor is mounted between the feed points and the ends of the feeder, the impedance of the antenna element conductor and the feeder is matched together, and a signal received by the antenna element conductor is amplified and supplied to the feeder.

Abstract: A flexible circuit has a backing including a reinforcement structure which has a cable retaining portion rising essentially perpendicular with respect to a backing surface, and a projection at a side face of the cable retaining portion for securing a cable extending from a circuit pattern to the cable retaining portion. The projection of the cable retaining portion is engaged with a hole of the cable at the location where said cable contacts the cable retaining portion.

Abstract: A magnetic head suspension assembly, wherein a wiring member for connecting a magnetic head element with a read/write amplifier circuit board is integrally formed with the suspension for supporting the magnetic head element. The suspension is equipped integrally with a circuit wiring pattern via a flexible insulating base material. The flexible insulating base material is made as wide as the circuit wiring pattern. The top surface of the circuit wiring pattern has a surface protecting layer which is wider than the circuit wiring pattern.

Abstract: A method of manufacturing a magnetic head suspension assembly, wherein a wiring member for connecting a magnetic head element with a read/write amplifier circuit board is integrally formed with the suspension which includes the steps of (1) forming a flexible insulating base material on one surface of a springy metal layer by using a non-photosensitive polyimide resin layer or a photosensitive insulating resin layer; (2) producing a circuit wiring pattern on the top of the flexible insulating base material by plating and by using an electrically conductive metal thin film; (3) for forming a surface protecting layer on the surface of the circuit wiring pattern; (4) the springy metal layer; and (5) bending the springy metal layer to form a desired suspension.

Abstract: A method of manufacturing a magnetic head suspension, wherein a wiring member for connecting a magnetic head element with a read/write amplifier circuit board is integrally formed with the suspension, which includes the step of: (1) forming a laminated plate having a flexible insulating base material which has an electrically conductive layer on one surface and a springy metal layer on the other surface; (2) photoetching the electrically conductive layer of the laminated plate to form a metal mask having a desired shape which does not cover an exposed area of the flexible insulating base material; (3) removing the flexible insulating base material from the exposed area; (4) photoetching the metal mask to produce a circuit wiring pattern; (5) producing a surface protecting layer on the surface of the circuit wiring pattern; and (6) photoetching the springy metal layer and bending the springy metal layer to form a suspension having a desired shape.

Abstract: A photosensitive insulation bonding layer is formed on a conducting layer. The photosensitive insulation bonding layer is subjected to exposure treatment to produce an exposed area and an unexposed area. Another conducting layer is formed on the outer surface of the photosensitive insulation bonding layer which has undergone the exposure treatment, then both conducting layers are photoetched to produce desired wiring patterns. In the next step, the unexposed area is removed from the photosensitive insulation bonding layer by development so as to form an access opening for connecting a circuit component to the wiring patterns. Then, the exposed area of the photosensitive insulation bonding layer is turned into an insulating layer by curing.

Abstract: A structure of the flexing section of a multilayer flexible circuit board wherein at least one layer of a flexible insulation base material is bonded, via an adhesive agent layer, between a plurality of wiring conductors on which required wiring patterns are formed with conductive foil, the flexible insulation base material of the flexing section of the multilayer flexible circuit board being provided with a non-bonded portion so that it is not bonded with the wiring conductors or another flexible insulation base material at least on one surface.