Abstract: A flexible circuit board with high connection reliability and a manufacturing method thereof, wherein the flexible circuit board has a bent section formed thereon, can be deformed flexibly, and wherein a wiring layer will not be peeled off or ruptured even when deformation is repeated onto the flexible circuit board, heat is radiated from electronic parts, or minute wiring is formed on the flexible circuit board. The flexible circuit board is provided with an insulating film comprised of liquid crystal polymer, a wiring layer formed upon the insulating film, and an insulating layer comprised of liquid crystal polymer formed upon the wiring layer. The flexible circuit board has a bent section with a radius of curvature of R (mm) formed on at least one location thereof, and is made to be deformable in a state with the radius of curvature of the bent section maintained at R (mm).

Abstract: There is provided a photomask capable of improving alignment accuracy with respective photomasks disposed on the front and rear faces of a substrate. A photomask has a drawing pattern for exposure formed on one face opposing a substrate, a first alignment mark for alignment with a substrate side mark formed on the substrate, the first alignment mark being provided in a region of the one face, the region opposing the substrate when the substrate is retained and the drawing pattern is not formed in the region, and a second alignment mark for alignment with a third alignment mark provided on another photomask, the second alignment mark being provided in a region which does not oppose the substrate when the substrate is retained.

Abstract: To provide a seal structure having seal members which can be easily inserted into insertion holes of a housing, and achieve an excellent sealing performance of the seal members, the seal structure is comprised of a housing provided with insertion holes to which a flexible wiring substrate is inserted, and seal members which are integrally formed on the flexible wiring substrate are made of a rubber elastic material in a bush-shape, and hermetically seal gaps between the insertion holes and the flexible wiring substrate, wherein projected portions are provided on parts of the flexible wiring substrate at positions where the seal members are integrally formed.

Abstract: A lighting device which can illuminate a large range with a simple configuration, and in which the LEDs or the mounting portions thereof are not likely to be damaged even when vibrations occur as a light source device which uses an LED as a light source, and a manufacturing method thereof are provided. The present invention includes a deformable flexible circuit board having an insulating film made of thermoplastic resin, a wiring layer formed on the insulating film, and an insulating layer formed on the wiring layer and made of thermoplastic resin, and in which a bent portion with a curvature radius “R” (mm) is formed at at least one position, and a plurality of LEDs mounted on the flexible circuit board.

Abstract: A lighting unit, e.g. an LED bulb or a straight LED luminaire, which illuminates a wide range and is configured with low cost. In a light-emitting diode lamp, a board assembly is disposed in a lamp main body, and light-emitting diodes are attached to the board assembly. The board assembly comprises a plurality of flexible printed circuit boards. Each flexible printed circuit board includes a base in the form of a flat plate, respective connections to a power supply portion of the light-emitting diode lamp are provided at two ends of the base, and the base is bent at a plurality of points of a middle portion to form a top surface portion and side surface portions. The flexible printed circuit boards are three-dimensionally assembled such that the top surface portions cross each other and such that one of the top surface portions lies on top of another.

Abstract: In a switch module which is arranged in opposition to a key substrate, the switch module is provided which is able to reduce an amount of light leaking out from the vicinity of an end of a light guiding member in the direction of key parts, so that the key parts can be illuminated in a uniform manner by the light which advances in the interior of the light guiding member. A switch module is provided with a circuit substrate that has a metal dome sheet mounted on a surface thereof which is arranged in opposition to a key substrate, a light guiding sheet that is arranged between the key substrate and the circuit substrate, an LED, and a reflector that makes the light emitted from the LED incident into the light guiding sheet from an end thereof, wherein key parts are able to be illuminated by the switch module.

Abstract: A lid member with a waterproof function opening and closing an opening portion formed in a housing is structured by a rubber-like elastic material seal portion provided with a projection portion which is integrally formed in one surface of a resin main body of the lid member and is stored within the opening portion, an annular projection portion which is integrally formed in an outer peripheral surface of the projection portion and comes into close contact with a peripheral surface of the opening portion, and a reinforcing portion which extends from the annular projection portion to the vicinity of a junction portion of the outer peripheral surface with the main body, and a thermoplastic elastomer retention portion which exists so as to come into close contact with an outer peripheral surface of the reinforcing portion, and is integrally formed in a side of the main body.

Abstract: A sealing structure to seal a housing for electronic equipment such as a cellular phone, and which provides reliable sealing for the housing, and at the same time can attain to improve design with a simple construction. A sealing structure, which seals a housing, is provided with a seal member mounted on the housing, a substrate integrally molded with the seal member, and having at least a part thereof lying in the inside of the housing in a state where the seal member is mounted on the housing, and a light source element arranged on the substrate board, wherein the seal member is transparent or translucent, and it is constructed such that the light source element is arranged in a region of hermetic sealing formed by the seal member, whereby at least a part of the seal member emits light by the light radiated from the light source element.

Abstract: There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.

Abstract: The present invention provides a flexible circuit board with a heat dissipation layer on which bending processing can be carried out easily, while achieving its slimming down, and which can maintain the flatness of the heat dissipation layer. The flexible circuit board, at least, has a wiring layer 3a adapted to be electrically connected to a circuit element, an insulating layer 2, and a heat dissipation layer 3b, and which is characterized in that said wiring layer 3a is formed of a copper foil which has a tensile strength of 250 MPa or less and a thickness of 50 ?m or less, and said heat dissipation layer is formed of a copper foil which has a tensile strength of 400 MPa or more and a thickness of 70 ?m or more.

Abstract: There is provided a laser processing method of forming via holes 23 and 24 by removing processed layers including a flexible insulating base member 1, in which conformal masks 7 and 8a are provided on the surface, and an adhesive layer 12 having a higher absorbance in a wavelength area of processing laser and a lower decomposition temperature than the insulating base member 1, the method including radiating one shot of pulse light having a first energy density that can remove the insulating base member 1 by one shot without causing the deformation and penetration of a conducting film 2A, and subsequently radiating pulse light having a second energy density that is lower than the first energy density and can remove the rest of the processed layers by a predetermined number of shots without causing the deformation and penetration of the conducting film 2A.

Abstract: Provided is a seal structure which can reduce the thickness of an electronic device, can be easily assembled and disassembles, and can exhibit an excellent seal performance. Thus, the seal structure for an electronic device, which seals a gap between a flexible wiring substrate inserted to a through-hole provided in a case member of an electronic device and the through-hole, is comprised of an annular gasket composed of a rubber elastic material, a part of which is integrally molded with the flexible wiring substrate, and a retainer plate for retaining the gasket in conjunction with the case member.

Abstract: A flexible circuit board and a method for production thereof in which in cases where elastic wiring in movable parts is required, the wiring can be made to expand and contract with a simple arrangement, and the circuit board is excellent in weight and size reduction, and breaking or disconnection and exfoliation of a wiring layer do not take place easily, even in cases where the circuit board is deformed in a repeated manner. The flexible circuit board which has an insulating film made of a thermoplastic resin, a wiring layer formed on the insulating film, and an insulating layer made of a thermoplastic resin and formed on the wiring layer. A spiral part shaped into a spiral shape is provided in at least a part of the flexible circuit board, and the flexible circuit board is constructed to be expandable and contractable, and/or torsionally deformable in the spiral part.

Abstract: Alight emitting device and a light receiving device are in a bare chip form and are a light emitting device of surface emitting type and a light receiving device of surface receiving type having an electrode on an opposite surface of a light emitting portion and a light receiving portion respectively, the light emitting device, the light receiving device, and an optical waveguide are mounted on one surface of a flexible printed wiring board body, the light emitting portion of the light emitting device, an optical waveguide core, and the light receiving portion of the light receiving device are arranged substantially coaxially, and the light emitting device and the light receiving device are mounted in such a way that a light emitting/receiving direction is substantially 90° with respect to an orthogonal direction of a surface of the flexible printed wiring board body.

Abstract: The key module for the mobile device includes a key top 6; a base plate 2 on which a fixed-side contact 7 is disposed; a dome 4 that is disposed on the fixed-side contact 7; a dome sheet 5 that covers the dome 4; an LED module 3 disposed on the base plate 2; and a light guide plate 1 that is disposed on the dome sheet 5. Such a configuration causes light emitted by the LED module 3 propagates within the light guide plate, and exits the light from an exit surface of the light guide plate on the key top 6 side. The light guide plate 1 is formed by inkjet printing a dot pattern in white ink onto a surface of a base material formed from a thermosetting polyurethane elastomer sheet, which surface is opposite to the exit surface of the light guide plate.

Abstract: A lighting unit, e.g. an LED bulb or a straight LED luminaire, which illuminates a wide range and is configured with low cost. In a light-emitting diode lamp, a board assembly is disposed in a lamp main body, and light-emitting diodes are attached to the board assembly. The board assembly comprises a plurality of flexible printed circuit boards. Each flexible printed circuit board includes a base in the form of a flat plate, respective connections to a power supply portion of the light-emitting diode lamp are provided at two ends of the base, and the base is bent at a plurality of points of a middle portion to form a top surface portion and side surface portions. The flexible printed circuit boards are three-dimensionally assembled such that the top surface portions cross each other and such that one of the top surface portions lies on top of another.

Abstract: A flexible wiring board is provided having a wiring structure which can reduce transmission loss by reducing impedance mismatching even if being folded in a three-dimensional manner. In a flexible wiring board 10 having a characteristic impedance control circuit 20, the flexible wiring board has a planar projection shape of a folded spot 20A in the characteristic impedance control circuit after folding in an arc state along a tangent.

Abstract: A switch module is provided with a circuit substrate that has a metal dome sheet mounted on a surface thereof which is arranged in opposition to a key substrate, a light guiding sheet that is arranged between the key substrate and the circuit substrate, an LED, and a reflector that makes the light emitted from the LED incident into the light guiding sheet from an end thereof, wherein key parts are able to be illuminated by the switch module. At an inner side of the reflector in the light guiding sheet, there is formed a printed pattern of white ink for scattering light on an optical path of the light which transmits through a first surface from the vicinity of an edge portion of the reflector.