Abstract: A flexible wiring board is provided having a wiring structure which can reduce transmission loss by reducing impedance mismatching even if being folded in a three-dimensional manner. In a flexible wiring board 10 having a characteristic impedance control circuit 20, the flexible wiring board has a planar projection shape of a folded spot 20A in the characteristic impedance control circuit after folding in an arc state along a tangent.

Abstract: A switch module is provided with a circuit substrate that has a metal dome sheet mounted on a surface thereof which is arranged in opposition to a key substrate, a light guiding sheet that is arranged between the key substrate and the circuit substrate, an LED, and a reflector that makes the light emitted from the LED incident into the light guiding sheet from an end thereof, wherein key parts are able to be illuminated by the switch module. At an inner side of the reflector in the light guiding sheet, there is formed a printed pattern of white ink for scattering light on an optical path of the light which transmits through a first surface from the vicinity of an edge portion of the reflector.

Abstract: In a switch module which is arranged in opposition to a key substrate, the switch module is provided which is able to reduce an amount of light leaking out from the vicinity of an end of a light guiding member in the direction of key parts, so that the key parts can be illuminated in a uniform manner by the light which advances in the interior of the light guiding member. A switch module is provided with a circuit substrate that has a metal dome sheet mounted on a surface thereof which is arranged in opposition to a key substrate, a light guiding sheet that is arranged between the key substrate and the circuit substrate, an LED, and a reflector that makes the light emitted from the LED incident into the light guiding sheet from an end thereof, wherein key parts are able to be illuminated by the switch module.

Abstract: For cushioning a shock to prevent problems such as a reading error, a ramp for a magnetic disc apparatus is made of a resin material for forming a ramp main body and a material having higher rigidity than the resin material, disc facing surfaces in the disc insertion portion for inserting a magnetic disc is provided with disc contact portions made of the high rigidity material, a bottom surface portion of a concave portion of the disc insertion portion is constructed by a combination of a bottom surface portion made of the resin material and a bottom surface portion made of the high rigidity material, and a step structure is provided by arranging the bottom surface portion made of the high rigidity material at a position moved rearward in a depth direction of the concave portion in comparison with the bottom surface portion made of the resin material.

Abstract: A waterproof gasket for a small size electronic appliance of the invention has straight portions (1A) and corner portions (1B) alternately in a peripheral direction, a main seal portion (11) and a seat seal portion (12) brought into close contact with a bottom surface of a gasket retention groove are formed, a shoulder portion (13) protruding in a width direction between said main seal portion (11) and the seat seal portion (12) so as to be brought into close contact with an inner side surface of a groove shoulder of said gasket retention groove is formed in said straight portion (1A), and a recession portion (14) retracting in a width direction relatively from said shoulder portion (13) between said main seal portion (11) and the seat seal portion (12) is formed in said corner portion (1B). Accordingly, a partial compression reaction force increase is prevented in the corner portion.

Abstract: A method for manufacturing a printed-wiring board having an organic resin insulating layer and a metal wiring layer and having a film-like resistive element formed on the metal wiring layer thereof, the method including: disposing a metal wiring layer on one surface of one organic resin insulating layer 1 to form an organic resin printed-wiring board 4; forming a pair of electrodes 5 on the metal wiring layer of the organic resin printed-wiring board; forming a film-like resistive element 7 between the electrodes; applying a temperature and a pressure of a laminating press to the side of the metal wiring layer in the wiring board without use of a laminating adhesive agent to change a resistance value of the film-like resistive element; trimming the film-like resistive element for adjusting a resistance value; providing a circuit member 12 having at least one layer of insulating layer; and laminating the circuit member with a laminating adhesive agent 13 in between so as to contact with a layer of the organic

Abstract: The insulation base side of single-sided FPC is turned to the die side, and the mounting surface side of ground circuit is turned to the upper side, and the FPC is placed on die (a). When the portion of ground circuit where the conduction is realized and metal reinforcing plate are punched by punch of which the clearance dimension is made to be 50 to 95% of the thickness of the material to be punched, hole sagging will be formed (b). The insulation base 1 side is turned up, electrically conductive adhesive and metal reinforcing plate are laminated in this order, heating pressing is performed with the press apparatus for metal reinforcing plate to be laminated (c). Thereby, laminated FPC is formed (d). At this time, since electrically conductive adhesive is injected into hole sagging by press pressing, the electrical connection of metal reinforcing plate and ground circuit can be attained by the interlaminar conduction by means of electrically conductive adhesive, and there is also no residual air.

Abstract: A microstrip line for a printed wiring board such as a flexible printed wiring board which includes a sandwiched thin insulating layer and cannot use a solid grounding conductor, the microstrip line being such that shape of grounding conductors relative to signal lines remains unchanged even in the presence of a curved shape and that overlapping areas of signal lines and grounding conductors located opposite to each other remain unchanged even in case of exposure misalignment or stack misalignment. A printed wiring board with a microstrip line structure in which signal lines are curved include wire-type grounding conductors located across an insulating layer from the signal lines, characterized in that wiring pitch of the grounding conductors is 1/n of width of the signal lines (where n is a natural number of 1 or 2).

Abstract: A method for easily making a barrier for preventing overflow of interlayer insulating resin in a cable-fitted multi-layer FPC that uses bumps for connecting the layers, and a barrier having a structure that can easily be made. In a method for manufacturing a multi-layer flexible printed circuit board including a circuit section, a cable section that is connected to the circuit section, the circuit section having a multi-layer structure of insulating resin arranged between multiple layers of metal foil, a barrier, that stops the insulating resin from overflowing, has a two-row configuration and is formed on a metal foil that constitutes an outermost conductive layer in the multi-layer flexible printed circuit board, and the metal foil and the insulating resin are laminated to form the multi-layer flexible printed circuit board.

Abstract: A light guide plate that uses a resin film as a material for the light guide plate, that has a reflecting or scattering pattern formed by printing, and that guides a light propagating in the film to exit and emerge from the front surface thereof. The light guide plate is thinner and highly flexible, and has high reliability and durability. A base material of the light guide plate is formed from a thermosetting polyurethane sheet with a thickness of 0.4 mm or less. When a dot pattern is formed by ink-jetting, a white UV curable ink, for which the thermosetting polyurethane exhibits a swellability such that the thermosetting polyurethane increases by 10% or more in weight as a result of being soaked in the ink for one hour at a room temperature, is used as the ink.

Abstract: A switch module including a light source element is provided that obtains slimming down and a sufficient click feeling and suitably irradiates a key portion, while suppressing manufacturing cost. A switch module is disposed to face a key portion. The switch module includes a transparent FPC board, a transparent conductive film, an electrode, a metal dome which is in contact with a part of the transparent conductive film and which is allowed to come into contact with the electrode by being deformed, and an LED. Light emitted from the LED and guided in a direction orthogonal to a thickness direction of the board in the transparent FPC board is reflected by a reflecting portion provided on the transparent FPC board, in a direction of the key portion.

Abstract: The key module for the mobile device includes a key top 6; a base plate 2 on which a fixed-side contact 7 is disposed; a dome 4 that is disposed on the fixed-side contact 7; a dome sheet 5 that covers the dome 4; an LED module 3 disposed on the base plate 2; and a light guide plate 1 that is disposed on the dome sheet 5. Such a configuration causes light emitted by the LED module 3 propagates within the light guide plate, and exits the light from an exit surface of the light guide plate on the key top 6 side. The light guide plate 1 is formed by inkjet printing a dot pattern in white ink onto a surface of a base material formed from a thermosetting polyurethane elastomer sheet, which surface is opposite to the exit surface of the light guide plate.

Abstract: In a flip shop mounting method by no-flow underfill in which resin 54 is pre-coated on a substrate 52, and a semiconductor 50 with bump is mounted on the substrate 52 to join a pad electrode 53 on the substrate 52 to the bump 51, the substrate 52 is placed on an upper surface of a base 11 of a reflow jig 10, the resin 54 highly filled with filler 55 is applied onto the substrate 52, the semiconductor 50 with bump is mounted at a predetermined position over the substrate 52, a press plate 21 is placed on an upper portion of the semiconductor 50, a spacer 13 is interposed between a lower surface of the press plate 21 and an upper surface of the base 11 to regulate an amount of press force of the press plate 21, and horizontal movement of the press plate 21 is regulated by positioning guide pins 15 on the upper surface of the base 11.

Abstract: There is provided a method of producing a printed circuit board incorporating a resistance element capable of adjusting resistance after the resistance element has been formed and assuring a high accurate resistance. A method of producing a printed circuit board incorporating a resistance element using carbon paste includes the steps of: forming through holes 5, 6, 25 and 26 or a bottomed hole in a double-sided copper clad laminate; applying noble metal plating into the through hole or the bottomed hole; filling the through hole or the bottomed hole with carbon paste; subjecting the carbon paste with which the thorough hole or the bottomed hole is filled to noble metal plating, conducting treatment and plating to form a conductive layer; forming an opening 18 in the conductive layer on the end of the through hole filled with the carbon paste; and performing trimming through the opening to adjust the resistance of the resistor formed by the carbon paste.

Abstract: In a flip shop mounting method by a no-flow underfill in which resin is pre-coated on a substrate 52, and, thereafter, a semiconductor 50 with bump is mounted on the substrate 52 to join a pad electrode 53 on the substrate 52 to the bump 51, a resin 54a highly filed with the filler 55 is applied to a region except for the pad electrode 53 on the substrate 52, a resin 54b being free from the filler is applied to a pad electrode 53 portion on the substrate 52, and, thereafter, the semiconductor 50 with bump is mounted at a predetermined position on the substrate 52.

Abstract: The invention includes a shielding film, which does not have breakage of a metal layer, and has excellent abrasion resistance and blocking resistance, and does not crack. The cover film 7 is provided on one surface of a separation film 6a, and an adhesive layer 8a is formed on the surface of the cover film 7 opposite to the separation film 6a via the metal layer. The cover film 7 has at least one hard layer 7a and at least one soft layer 7b, and the surface of the cover film 7 facing the separation film 6a is composed of the hard layer 7a.

Abstract: The invention includes a shielding film, which does not have breakage of a metal layer, and has excellent abrasion resistance and blocking resistance, and does not crack. The cover film 7 is provided on one surface of a separation film 6a, and an adhesive layer 8a is formed on the surface of the cover film 7 opposite to the separation film 6a via the metal layer. The cover film 7 has at least one hard layer 7a and at least one soft layer 7b, and the surface of the cover film 7 facing the separation film 6a is composed of the hard layer 7a.