Abstract: A process for producing a lithium niobate single crystal which comprises restricting the variation of the Curie point due to the effect of impurities within a specific range in the accurate evaluation of the composition of the lithium niobate single crystal by the use of the Curie point. To produce a lithium niobate single crystal by using, singly or in combination, lithium carbonate having a purity of 99.99% or higher and simultaneously satisfying the condition that the contents therein of elements Na, K, Mg, and A1 are 5.0 ppm or less, 2.0 ppm or less, 0.5 ppm or less, and 0.9 ppm or less, respectively, and niobium pentoxide having a purity of 99.99% or higher and simultaneously satisfying the condition that the contents therein of elements Na, K, Mg, Al, and Cl are 3.0 ppm or less, 1.0 ppm or less, 0.5 ppm or less, 0.9 ppm or less, and 3.0 ppm or less, respectively, according to an ordinary method.

Abstract: This invention provides an electrostatic micro-actuator whose movable element can keep stable motion even at a low speed by sealing a high viscosity fluid having a high dielectric constant between the movable element and fixed electrodes and by shaping the movable element so as to be stable in the fluid.The electrostatic micro-actuator according to the present invention employs a fundamental construction wherein the high viscosity fluid is sealed between the movable element and the fixed electrodes, and the movable element is shaped so as to be stable in the fluid, so that the movable element keeps stable motion even at a low speed. When combined with one another in parallel and in series, such electrostatic micro-actuators can easily constitute a macro-system useful for various fields of applications.

Abstract: This invention provides a planar micro-actuator in which power feed to slider electrodes is facilitated, whose reliability is remarkably improved, and by which a sub-system can be reliably realized.In a planar micro-actuator of the type wherein an insulating fluid is sealed between stators so disposed as to oppose each other with a predetermined gap and a slider is movably disposed between the stators, the stators are equipped with power feed paths, the slider is equipped with metal bumps in electrical contact with the power feed paths, and power is fed to the slider through the power feed paths and through the metal bumps. Guide grooves for guiding the metal bumps are preferably formed in the power feed paths, and each power feed path is disposed on the electrode of the stator through an insulating layer to thereby improve the wiring density. By such a structure, the size and weight of the planar micro-actuator can be reduced while preventing undesirable deviation of the slider.

Abstract: A flexible circuit wiring board having protruding, closely spaced leads, which are intended to be attached to a circuit device, is fabricated by forming a conductor pattern on a first surface of an insulating substrate, adhereing a protection layer to the conductor pattern and employing a laser to selectively etch away the substrate. The etching process leaves a reinforcing coating of the protective layer on the leads at least in the portions thereof which lie at the boundary of the area from which the substrate has been removed.

Abstract: A flexible circuit wiring board having protruding, closely spaced leads, which are intended to be attached to a circuit device, is fabricated by forming a conductor pattern on a first surface of an insulating substrate, adhereing a protection layer to the conductor pattern and employing a laser to selectively etch away the substrate. The etching process leaves a reinforcing coating of the protective layer on the leads at least in the portions thereof which lie at the boundary of the area from which the substrate has been removed.

Abstract: A flexible multi-layer circuit wiring board which is capable of constituting finger lead-like terminals that are little liable to be deformed even when the circuit conductors protruding like finger leads are finely formed and is capable of maintaining good flexibility at a bent portion. Circuit conductors 2 composed of an electrically conducting metal having a large Young's modulus are disposed at the ends of one surface of a flexible insulating base member 1 to form finger lead-like terminals 3, required circuit wiring conductors 4 composed of an electrically conducting metal rich in flexibility are disposed on the other surface of the flexible insulating base member 1 inclusive of a bent portion A of the circuit wiring board, and through-hole connection portions 5 are formed to electrically connect required portions of the circuit conductors 2 and the circuit wiring conductors 4.

Abstract: This invention provides a method of forming a circuit wiring pattern which cannot be formed by a prior art method such as etching or plating. This method comprises a step of forming trenches for forming a circuit wiring pattern at predetermined positions on at least one of the surface of an insulating base material and then filling a conductive material into the trenches, a step of removing conductor layers in such a manner that the conductor layers formed by the step described above exist only in the trenches formed in the insulating base material and gap portions of the circuit wiring pattern comprising the conductor layers formed in the trenches of the insulating base material are exposed, and a step of forming an insulating surface protection layer.

Abstract: An IC-mounting flexible circuit board and the process of producing the same in which the process comprises the steps of forming bump protrusions passing through a flexible circuit board to be electrically conductive with a circuit wiring pattern in such a way that the bump protrusions are allowed to protrude from the back surface of the flexible circuit board, and arranging to have the surface of each bump protrusion coated with junction metal in accordance with the structure of the protrusion, so that a bare IC chip is simply bonded to the bump protrusions of the flexible circuit board by means of heat fusion or ultrasonic bonding.An excimer laser means is preferably used for boring small holes in an insulating base to form bump protrusions, i.e., IC pad junction protrusions on the flexible circuit board. Such an IC pad junction protrusion is formed by a plating means such as soldering or the filling of a conductive member.

Abstract: A method for the manufacture of a multilayer printed circuit board on which integrated circuit chips may be directly mounted includes producing holes at predetermined locations to enable electrical connections between a chip and conductive layers of the circuit board to be established via the holes. Electrically conductive bump members, which protrude outwardly from the circuit board, are formed in registration with the holes. The bump members cooperate with an electrically conductive plating layer or filler that is deposited so as to be in intimate contact with a conductive layer(s) exposed during the production of each hole.

Abstract: A multilayer printed circuit board on which integrated circuit chips may be directly mounted has holes at predetermined locations, electrical connections between a chip and conductive layers of the circuit board being accomplished via the holes. The electrical connections are in the form of bump members which protrude outwardly from the circuit board. The bump members cooperate with an electrically conductive plating layer or filler that is in intimate contact with a conductive layer(s) exposed in the formation of each hole.

Abstract: Herein disclosed is an IC mounting circuit substrate which comprises: a predetermined circuit conductor pattern formed on one face of an insulating layer; IC pad junctioning bumps junctioned electrically to predetermined portions of said circuit conductor pattern and projecting to the outside of a circuit substrate through said insulating layer; and a transparent insulating coating formed at the side of said circuit conductor pattern for transmitting an irradiation beam for heating and melting said bumps. As a fundamental process for mounting an IC on the IC mounting circuit substrate thus constructed, there is adopted a process for connecting the pads of said IC chip and said bumps electrically while heating and melting said bumps by the action of the irradiation beam supplied concentratedly from the side of said transparent insulating coating to said bump portions with said IC chip being arranged over said bumps.

Abstract: A process for producing a PTC device comprising the steps of forming a laminate comprising a PTC composition and at least two electrode plates having the PTC composition sandwiched therebetween, opposing the surface of a lead plate to be electrically connected to each of the electrodes, to the surface of each of the electrode plates of the laminate while contacting at a narrow area, and then passing a current between the electrode and the lead via the narrow contact surface to weld them. By this process, there is obtained a PTC device having, at a portion of the joining interface between each electrode plate and each lead plate, a nugget formed by melting both the plates. This PTC device has a low contact resistance between the PTC composition and the electrode plates.

Abstract: A fluorine-containing elastomer composition comprising a fluorine-containing elastomer, at least one of oxide and hydroxide of divalent metal, a polyhydroxyaromatic compound, and a quaternary ammonium salt compound represented by the general formula: ##STR1## wherein R' is a piperidino or a pyrrolidinyl radical, and if desired, further containing 1,8-diazabicyclo-[5,4,0]-undec-7-ene or 1,5-diazabicyclo[4,3,0]-non-5-ene, has good storage stability as green elastomer composition and gives distinguished physical properties to the vulcanized products.

Abstract: A PTC device with a laminate having a PTC composition and at least two electrode plates having the PTC composition sandwiched therebetween, superposing, on the surface of each of the electrode plates of the laminate, a lead plate to be electrically connected to the electrode, joining the electrode plate and the lead plate by spot welding, and during or prior to the spot welding process, forming at least one through hole penetrating through the electrode plate and the lead plate in the center of a weld.

Abstract: A method for producing a hybrid multi-layered circuit substrate which utilizes prefabricated flexible printed circuit(s) which are rigidized in areas which define high density hybrid circuits. The hybrid circuit regions are formed by disposing copper-lined sheets on both surfaces of the flexible circuit, adhesively bonding the copper-lined sheets to the flexible circuit, forming through-hole conductors and etching a circuit pattern in the copper layer of the lined sheets. The copper-lined sheets are initially general coextensive in size and shape with the flexible circuit and are subsequently severed so that the copper-lined sheets remain only in the hybridized portions of the product. Separation is achieved by mechanically punching along predetermined boundaries and is facilitated by providing either any elongated narrow through-hole at the boundary of the hybrid circuit from which the flexible circuit will extend the end product or by forming a groove in the copper-lined sheets at such boundary.

Abstract: A novel perfluoropolyether containing 0.1 to 10% by weight of halogen atoms as bonded in the molecule is obtained by reacting tetrafluoroethylene with oxygen in a fluorinated solvent or a chlorofluorinated solvent under ultraviolet irradiation in the presence of a halogenated hydrocarbon chain transfer agent having a chain transfer coefficient with respect to methyl methacrylate of at least 5.times.10.sup.-5.

Abstract: A PTC composition comprising at least one polymer, from 5% to 45% by volume of electrically conductive or semiconductive particles having a room temperature electric conductivity of at least 10.sup.2 [s/m] dispersed in said polymer, and from 0.2% to 20% by volume of thermally conductive particles having a room temperature electric conductivity of no more than 10.sup.-3 [s/m] and a thermal conductivity of at least 20 [w/m.multidot.k] dispersed in said polymer. A PTC device using such a PTC composition has a high ratio of peak resistance to room temperature resistance, and exhibits high safety.

Abstract: A process for producing a PTC device comprising the steps of forming a laminate comprising a PTC composition and at least two electrode plates having the PTC composition sandwiched therebetween, opposing the surface of a lead plate to be electrically connected to each of the electrodes, to the surface of each of the electrode plates of the laminate while contacting at a narrow area, and then passing a current between the electrode and the lead via the narrow contact surface to weld them. By this process, there is obtained a PTC device having, at a portion of the joining interface between each electrode plate and each lead plate, a nugget formed by melting both the plates. This PTC device has a low contact resistance between the PTC composition and the electrode plates.

Abstract: A process for producing a PTC device comprising the steps of forming a laminate comprising a PTC composition and at least two electrode plates having the PTC composition sandwiched therebetween, superposing, on the surface of each of the electrode plates of the laminate, a lead plate to be electrically connected to the electrode, joining the electrode plate and the lead plate by spot welding, and during or prior to the spot welding process, forming at least one through hole penetrating through the electrode plate and the lead plate in the center of a weld. This process can minimize the heat damage of the PTC composition and the resulting PTC device has a low contact resistance.

Abstract: A flexible circuit board and method of making the same is presented wherein the circuit board includes conductive through-holes for installation of components and includes a sloping electrolytic plating portion between the through-hole portions and remaining flexible portions of the circuit board.