Abstract: Systems and methods for digital predistortion (DPD) are disclosed herein. In an example embodiment, a digital front-end circuit includes a DPD block, power amplifier, and transmitter. The DPD block is configured to receive an input signal and to provide a first output signal, and includes a nonlinear model that is configured to generate a nonlinear model output signal based upon the input signal. The DPD block additionally includes a first mixing module that is configured to generate a mixing module output signal based upon the input signal and the nonlinear model output signal. The DPD block further includes a summation block that is configured to generate the first output signal at least in part as a first sum of the nonlinear model output signal and the mixing module output signal, and the first mixing module includes a plurality of first finite impulse response (FIR) filters.

Abstract: One example discloses an analog to digital converter (ADC), including: an analog comparator configured to receive an analog input signal and in response generate a comparator output signal; a set of digital to analog converter (DAC) elements configured to receive the analog input signal; wherein the DAC elements are configured to generate an analog DAC output signal in response to a digital code and the analog input signal; wherein the comparator is configured to receive the analog DAC output signal; a feedback circuit configured to generate a first feedback signal and a second feedback signal from the comparator output signal; a controller configured to enable a first set of controller elements in response to the first feedback signal; wherein the controller configured to enable a second set of controller elements in response to the second feedback signal; and wherein the controller elements are configured to generate the digital code.

Abstract: The disclosure relates to a communications system having a transmitter and receiver connected via a transmission line. An example communications receiver (202) comprises: a pair of input connections (211, 212) for connecting to a transmission line (203); a termination resistance (213) equal to a characteristic impedance (Zc) of the transmission line (203); an air core transformer (205) having an input coil (206) connected to the pair of input connections (211, 212) via the termination resistance (213); and a comparator circuit (208) connected to an output coil (207) of the air core transformer (205), the comparator circuit (208) configured to provide an output signal (504) responsive to detection of voltage pulses across the output coil (207).

Abstract: Radio frequency (RF) packages containing multilevel power substrates and associated fabrication methods are disclosed. In an embodiment, the method includes producing a multilevel substrate panel by obtaining a base panel level containing prefabricated base structures and having a surface through which metallic surfaces of the prefabricated base structures are exposed. A secondary panel level is formed on the base layer to include patterned metal features embedded in a secondary dielectric body and electrically contacting the exposed metallic surfaces of the prefabricated base structures at a direct plated interface. The presingulated array of multilevel power substrates is separated into singulated multilevel power substrates each including a base substrate level formed from a singulated piece of the base panel level and a secondary substrate level formed from a singulated piece of the secondary substrate level.

Abstract: An amplifier circuit comprising: an amplifier; an output limiter for providing a variable impedance comprising: a first and second limiter terminal; a transistor comprising a conduction channel; a first resistor coupled in parallel with the conduction channel; and a capacitor coupled in series with the conduction channel between the conduction channel and the first or second limiter terminal; and a feedback control unit comprising a comparator block configured to provide a control signal to the output limiter based on a comparison of the amplifier output signal and a setting voltage; wherein: the first limiter terminal is coupled to the amplifier input or output; the second limiter terminal receives a reference voltage; and wherein receipt of the control signal at the transistor provides for a variable impedance for the amplifier circuit dependent on the amplifier output signal.

Abstract: Systems and methods for producing quality indicators for phase-based distance estimations using narrowband radios are described. In an illustrative, non-limiting embodiment, a device may include: a processor; and a memory coupled to the processor, the memory having program instructions stored thereon that, upon execution by the processor, cause the device to: measure a transfer function of a radio frequency (RF) channel between the device and another device using narrowband radios; estimate a distance between the device and the other device based, at least in part, upon the transfer function; and determine a Distance Quality Indicator (DQI) corresponding to the distance based, at least in part, upon an evaluation of a spectral lobe of the transfer function.

Abstract: In accordance with a first aspect of the present disclosure, a radar unit is provided, comprising: a receiver circuit configured to receive a radar signal; a controller configured to control said receiver circuit, wherein said controller is configured to cause said receiver circuit to operate either in a complex receiver mode or in a real receiver mode. In accordance with a second aspect of the present disclosure, a method of operating a radar unit is conceived, comprising: receiving, by a receiver circuit comprised in the radar unit, a radar signal; controlling, by a controller comprised in said radar unit, said receiver circuit, wherein said controller causes said receiver circuit to operate either in a complex receiver mode or in a real receiver mode.

Abstract: A device for a radar sensor is disclosed, the device comprising: transmission circuitry configured to generate transmission signals with a linear frequency chirp modulation in a predetermined frequency band for output to a radar antenna; reception circuitry configured to receive reflection signals corresponding to reflection of the transmitted radar signals from one or more physical objects; and control circuitry configured to select a frequency range within said predetermined frequency band and/or a timing pattern for said transmission signals; wherein said device is configured to: receive a further signal from a further radar sensor; determine, from said further signal, a frequency range and/or timing pattern in use by said further radar sensor for transmission of further transmission signals; and select a frequency range within said predetermined frequency band and/or a timing pattern for said transmission signals which does not conflict with the frequency range and/or timing pattern of said further transm

Abstract: A method of forming a self-aligned waveguide is provided. The method includes forming a first alignment feature on a packaged semiconductor device and a second alignment feature on a waveguide structure. A solder material is applied to the first alignment feature or the second alignment feature. The waveguide structure is placed onto the packaged semiconductor device such that the second alignment feature overlaps the first alignment feature. The solder material is reflowed to cause the waveguide structure to align with the packaged semiconductor device.

Abstract: A method of forming a packaged semiconductor device includes attaching a backside surface of a semiconductor die to a major surface of a package substrate. A first conductive connector is formed over a portion of an active surface of the semiconductor die and a portion of the major surface of the package substrate. A first conductive connection between a first bond pad of the semiconductor die and a first substrate pad of the package substrate is formed by way of the first conductive connector. A bond wire connects a second bond pad of the semiconductor die to a second substrate pad of the package substrate. The first bond pad located between the second bond pad and an edge of the semiconductor die.

Abstract: A self-calibrating digital-to-analog converter (DAC) is disclosed. The self-calibrating DAC includes a DAC including a least significant bit (LSB) side resistor network and a most significant bit (MSB) side resistor network. At least the MSB side resistor network includes a plurality of trimmable resistors. A resistance to frequency converter coupled with an output of the DAC is included to generate a frequency fL based on a value of the LSB side resistor network or the MSB side resistor network. A monitor is included to generate a counter value by comparing fL with a high frequency clock having a constant frequency fH.

Abstract: A wireless network includes a client device and an access point (AP). The client device generates a data packet having a physical layer protocol data unit frame format. The client device transmits the data packet to the AP such that a plurality of long training fields (LTFs) of the data packet is transmitted at higher power as compared to a data field of the data packet, and a preamble portion of the data packet is transmitted at higher power as compared to the plurality of LTFs. Further, the data field includes various resource units (RUs) and one such RU is utilized for data transmission between the client device and the AP. The transmission of the data packet from the client device to the AP in the aforementioned manner results in the range extension of the wireless network.

Abstract: Embodiments of level shifters are disclosed. In an embodiment, a level shifter includes a transistor connected between an input terminal of the level shifter and an output terminal of the level shifter, a first resistor connected between a first terminal of the transistor and one of the input terminal of the level shifter and the output terminal of the level shifter, a capacitor connected between the input terminal of the level shifter and the output terminal of the level shifter, a current source connected between the output terminal of the level shifter and a fixed voltage, and a resistor divider connected between the first resistor and the output terminal of the level shifter.

Abstract: Aspects of the disclosure are directed to an apparatus having a multi-link device (MLD) including processing circuitry to communicate signals with one of a plurality of remote devices over multiple communications link. The MLD and the one of the remote devices operate in first and second communication-specific configurations as follows. A physical layer convergence procedure protocol data unit (PPDU) is transmitted in one of the links while a PPDU is communicated in another one of the links under a first configuration. A PPDU is communicated in a first one of the respective communications links with an ending time set based on a PPDU communicated in a second one of the respective communications links in a second configuration. Such approaches may be carried out based on capabilities relating to simultaneous transmission and reception of MLDs that are communicating.

Abstract: A communication system includes a digital data processor that produces a digital data sample and one or more control bits. A serialized transmit interface assembles the digital data sample and the control bit(s) into first and second data packets of a data frame, and sends the data frame over a signal line. A serialized receive interface receives the data frame and produces a reconstructed digital data sample and the control bit(s) from the first and second data packets. A control circuit coupled to the serialized receive interface produces a control signal from the control bit(s). The communication system may include a converter circuit, which produces an RF input signal by performing a digital-to-analog conversion of the reconstructed digital data sample, and by upconverting the resulting analog data sample signal to RF. A power amplifier amplifies the RF input signal and modifies operation of a sub-circuit based on the control signal.

Abstract: A device assembly includes a functional substrate having one or more electronic components formed there. The functional substrate has a cavity extending from a first surface toward a second surface of the functional substrate at a location that lacks the electronic components. The device assembly further includes a semiconductor die placed within the cavity with a pad surface of the semiconductor die being opposite to a bottom of the cavity. The functional substrate may be formed utilizing a first fabrication technology and the semiconductor die may be formed utilizing a second fabrication technology that differs from the first fabrication technology.

Abstract: A device package includes a die that includes a substrate having first and second surfaces. A sensor is formed at a sensor region of the first surface. A trench extends entirely through the substrate between the first and second surfaces, in which the trench at least partially surrounds the sensor region. An isolation material, formed at the first surface, may extend across the trench A ring structure is coupled to the first surface of the substrate to create a first cavity in which the sensor is contained, the ring structure being laterally displaced away from and surrounding the sensor region and the trench. A molded compound body may abut an outer wall of the ring structure. The molded compound body has a second cavity that is concentric with the first cavity to enable fluid communication between the sensor and an environment external to the device package.

Abstract: A thermal interface structure for transferring heat from an electronic component to a system heat sink includes a stack of one or more layers of a stiff thermal interface material and one or more layers of a compliant thermal interface material stacked on and connected to the one or more layers of the compliant thermal interface material. In some embodiments, the thermal interface structure also may include one or more layers of a shape memory alloy and/or a collapsible encasement.

Abstract: Aspects of the subject disclosure may include, for example, detecting placement of a receiver coil of a device upon a transmitter coil of a wireless charger, identifying a transmitter coil type of the transmitter coil, identifying a receiving coil type associated with the receiver coil of the device, comparing the transmitter coil type to the receiver coil type, generating a message to move the device to a different position of the wireless charger responsive to detecting a mismatch between the receiving coil type of the device and the transmitting coil type of the wireless charger. Other embodiments are disclosed.

Abstract: A system includes an ADC configured to generate a superposition signal by the ADC being configured to under-sample an input signal at a sampling frequency in which the input signal that is input to the analog to digital converter has a bandwidth and the sampling frequency is less than a Nyquist rate for the bandwidth of the input signal. The system includes a digital signal processor (DSP) configured to digitally process the superposition signal to separate the superposition signal into a plurality of bitstreams, where each of the plurality of bitstreams corresponds to information in a different one of a plurality of separable, distinct frequency bands within the input signal. The information in the superposition signal for at least one of the said plurality of bitstreams is present in the input signal at frequencies greater than the sampling frequency, and the DSP is configured to output said plurality of bitstreams.