Patents Assigned to NXP USA, INC.
  • Publication number: 20220321489
    Abstract: A mechanism is provided to maximize utilization of internal memory for packet queuing in network devices, while providing an effective use of both internal and external memory to achieve high performance, high buffering scalability, and minimizing power utilization. Embodiments initially store packet data received by the network device in queues supported by an internal memory. If internal memory utilization crosses a predetermined threshold, a background task performs memory reclamation by determining those queued packets that should be targeted for transfer to an external memory. Those selected queued packets are transferred to external memory and the internal memory is freed. Once the internal memory consumption drops below a threshold, the reclamation task stops.
    Type: Application
    Filed: March 31, 2021
    Publication date: October 6, 2022
    Applicant: NXP USA, Inc.
    Inventors: Bernard Francois St-Denis, John Pillar, Allen Lengacher
  • Patent number: 11463908
    Abstract: Some embodiments described herein provide a method for transmitting a preamble in accordance with a wireless local area network communication protocol. In some embodiments, a data frame may be obtained for transmission including a preamble compliant with the wireless local area network communication protocol. It may be determined that the preamble includes a first preamble portion that spans multiple symbol durations and a second preamble portion that spans a single symbol duration. The first preamble portion via beamforming may be transmitted based on a first beamforming matrix. When a transmission mode of the second preamble portion is beamforming, a second beamforming matrix may be generated based on the first beamforming matrix, each tone for the second preamble portion may be calculated based on the second beamforming matrix. Each calculated tone may be transmitted in accordance with the wireless local area network communication protocol.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: October 4, 2022
    Assignee: NXP USA, INC.
    Inventors: Yakun Sun, Hongyuan Zhang, Sudhir Srinivasa, Xiayu Zheng
  • Patent number: 11464059
    Abstract: A method for simultaneously communicating with multiple communication devices in a wireless local area network is described. Multiple uplink data units are received that are simultaneously transmitted by multiple second communication devices. The multiple uplink data units include a management data unit and a traffic data unit. An acknowledgment data unit is generated to acknowledge receipt of the multiple data units. The acknowledgment data unit includes (i) an indication that indicates that the acknowledgment data unit is intended for the multiple second communication devices, and (ii) respective acknowledgment information fields for the multiple second communication devices. The respective acknowledgment information fields include a first acknowledgment information field for the management data unit and a second acknowledgment information field for the traffic data unit.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: October 4, 2022
    Assignee: NXP USA, INC.
    Inventors: Liwen Chu, Lei Wang, Jinjing Jiang, Hongyuan Zhang, Hui-Iing Lou
  • Patent number: 11462505
    Abstract: A method of forming a packaged semiconductor device includes attaching a backside surface of a semiconductor die to a major surface of a package substrate. A first conductive connector is formed over a portion of an active surface of the semiconductor die and a portion of the major surface of the package substrate. A first conductive connection between a first bond pad of the semiconductor die and a first substrate pad of the package substrate is formed by way of the first conductive connector. A bond wire connects a second bond pad of the semiconductor die to a second substrate pad of the package substrate. The first bond pad located between the second bond pad and an edge of the semiconductor die.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: October 4, 2022
    Assignee: NXP USA, INC.
    Inventor: Jinbang Tang
  • Patent number: 11460542
    Abstract: Multi-channel radio frequency (RF) transmitter (100) and method of calibrating the transmitter are provided.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: October 4, 2022
    Assignee: NXP USA, INC.
    Inventors: Olivier Vincent Doare, Stephane Damien Thuries, Gilles Montoriol
  • Patent number: 11463903
    Abstract: A method for transmitting a resource request for an uplink (UL) multi-user (MU) transmission is described. A High Throughput (HT) Control field that includes buffer information corresponding to media access control (MAC) protocol data units (MPDUs) that are queued for transmission by a first communication device is generated by the first communication device. The buffer information indicates a number of bytes for the MPDUs that are queued for transmission. A resource request MPDU that includes the HT Control field is generated by the first communication device. The resource request MPDU is transmitted by the first communication device to a second communication device via a wireless communication channel to request an allocation of radio resources for the UL MU transmission by the second communication device.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: October 4, 2022
    Assignee: NXP USA, INC.
    Inventors: Liwen Chu, Hongyuan Zhang, Lei Wang, Yakun Sun, Jinjing Jiang, Hui-Ling Lou
  • Patent number: 11463182
    Abstract: An integrated circuit and a method of performing a built-in-self-test (BIST) procedure in an integrated circuit. The integrated circuit includes a plurality of radio circuits and a switching network for performing a built-in-self-test (BIST) procedure. The switching network includes a plurality of combiners, a plurality of transmitter connection switches, a combiner switch, a splitter switch, a plurality of splitters and a plurality of receiver connection switches. The switching network may also include a splitter bypass switch and/or a combiner bypass switch. The components of the switching network may operate to route signals between outputs and inputs of the radio circuit to implement the built-in-self-test procedure in one or more modes involving either parallel or sequential testing of the components of the radio circuits. A diagnostic mode is also envisaged.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: October 4, 2022
    Assignee: NXP USA, Inc.
    Inventors: Christophe Athanassiou, Jerome Mallet, Estelle Nguyen
  • Patent number: 11462494
    Abstract: A semiconductor device package having galvanic isolation is provided. The semiconductor device package includes a package substrate having a first inductive coil. A first semiconductor die is attached to a first major surface of the package substrate. The first semiconductor die includes a second inductive coil substantially aligned with the first inductive coil. A second semiconductor die is attached to the first major surface of the package substrate. A wireless communication link between the first semiconductor die and the second semiconductor die is formed by way of the first and second inductive coils.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: October 4, 2022
    Assignee: NXP USA, INC.
    Inventors: Burton Jesse Carpenter, Fred T. Brauchler
  • Patent number: 11462493
    Abstract: An electrostatic discharge (ESD) protection scheme is provided that reduces EMI noise propagation among functional circuit blocks of an integrated circuit (IC). Traditional ESD protection schemes include an ESD bus electrically tied to the substrate of an integrated circuit (e.g., a P-well) and substrate well regions associated with electromagnetic interference (EMI) aggressor and sensitive circuits. These electrical couplings can propagate EMI noise on the ESD bus throughout the circuit blocks of the IC. Embodiments provide an ESD bus that is not tied to the substrate well regions associated with EMI aggressor and sensitive circuits of the IC, but instead is a separate conductive layer electrically coupled to an external ground. In this manner, the device circuits are isolated from EMI noise carried in the ESD bus, thereby protecting the various functional blocks from such noise.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: October 4, 2022
    Assignee: NXP USA, INC.
    Inventors: Radu Mircea Secareanu, Michael A. Stockinger
  • Patent number: 11460301
    Abstract: An angular rate sensor includes first and second proof masses spaced apart from a surface of a substrate. One each of first and second drive systems is interconnected with one each of the first and second proof masses. The first and second drive systems enable drive motion of the first and second proof masses along both of first and second axes in an orbital drive direction at a drive frequency, the first axis being perpendicular to the surface of the substrate and the second axis being parallel to the surface of the substrate. The sensor is sensitive to angular velocity about a third axis oriented parallel to the surface of the substrate and perpendicular to the second axis, and the drive frequency of the drive motion of the first and second proof masses changes in response to the angular velocity of the angular rate sensor about the third axis.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: October 4, 2022
    Assignee: NXP USA, Inc.
    Inventor: Aaron A. Geisberger
  • Patent number: 11463134
    Abstract: Wi-Fi communication is further secured by perturbation of a spatial mapping matrix. In an embodiment channel state information is obtained from a receiving device in a wireless network through the wireless network. A first set of beam steering vectors is derived based on the channel state information to direct a radio signal to the receiving device. A second set of beam steering vectors is derived based on the channel state information to direct a radio signal other than to the receiving device. A perturbation matrix is generated. A spatial mapping matrix is formed by combining the first and the second set of beam steering vectors with a perturbation matrix. Data symbols to be transmitted are pre-coded to the receiving device using the spatial mapping matrix and transmitted through the wireless network to the receiving device.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: October 4, 2022
    Assignee: NXP USA, INC.
    Inventors: Sayak Roy, Ankit Sethi, Sudhir Srinivasa
  • Patent number: 11460566
    Abstract: A receiver unit is disclosed for use in a multiple-input-multiple output, MIMO, radar system having a plurality of transmitters each for transmitting one of a group of orthogonal digital-transmitter-signals on a carrier wave, the receiver unit configured and adapted to receive a raw-analog-signal on a carrier wave reflected from one or more target objects.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: October 4, 2022
    Assignee: NXP USA, Inc.
    Inventors: Gustavo Guarin Aristizabal, Ralf Reuter, Maik Brett
  • Patent number: 11463055
    Abstract: An amplifier includes a transistor, an input circuit coupled between an amplifier input and a transistor input terminal, and an output circuit coupled between a transistor output and a transistor output terminal. The input circuit includes an input-side harmonic termination circuit with a first inductor and a first capacitance in series between the transistor input terminal and ground. The output circuit includes a second inductor, an output-side harmonic termination circuit, and a shunt-L circuit. The second inductor is coupled between the transistor output terminal and the amplifier output. The output-side harmonic termination circuit includes a third inductor and a second capacitance in series between the amplifier output and ground. The shunt-L circuit includes a fourth inductor and a third capacitance connected in series between the amplifier output and ground.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: October 4, 2022
    Assignee: NXP USA, Inc.
    Inventors: Wenming Li, Tong Qiao, Yunfei Wang
  • Patent number: 11460969
    Abstract: A mutually capacitive touch sensor includes a first capacitor electrode and a second capacitor electrode. The second capacitor electrode is adjacent and spatially separated from the first capacitor electrode. An inner region is disposed between the first capacitor electrode and the second capacitor electrode, wherein the first capacitor electrode and the second capacitor electrode are arranged to surround the inner region. The inner region may include a hole for a backlight.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: October 4, 2022
    Assignee: NXP USA, Inc.
    Inventors: Yong Su, Yonggang Chen, Wenwei Jiang
  • Patent number: 11463056
    Abstract: An integrated circuit includes a multiplexer circuit configured to provide an output signal on a conductive line, a programmable gain amplifier having a non-inverting input connected to the conductive line to receive the output signal from the multiplexer, a slew rate adjust circuit connected at a first node on the conductive line between the multiplexer circuit and the programmable gain amplifier, a first switch including a first terminal connected to the first node and a second terminal connected to the input of the programmable gain amplifier, and a low pass filter connected between the first and second terminals of the first switch.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: October 4, 2022
    Assignee: NXP USA, Inc.
    Inventors: Carmelo Morello, Hanqing Xing, Ranga Seshu Paladugu, Soon G. Lim
  • Patent number: 11456227
    Abstract: A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: September 27, 2022
    Assignee: NXP USA, INC.
    Inventors: Michael B. Vincent, Antonius Johannes Matheus de Graauw, Giorgio Carluccio, Waqas Hassan Syed, Maristella Spella
  • Patent number: 11455026
    Abstract: A cascaded power system including master power management circuitry and slave power management circuitry. The master circuitry includes a master power regulator, comparator circuitry, and control circuitry. The power regulator provides a supply voltage during a normal mode and discharges the supply voltage during a low power mode. The slave circuitry provides a core voltage when enabled and otherwise discharges the core voltage. The comparator circuitry monitors the voltage levels of the supply and core voltages and the control circuitry performs handshaking with the slave circuitry based partly on the voltages to ensure smooth transitioning between the normal and low power modes. The control circuitry asserts a low power good signal when the supply and core voltages are discharged, and de-asserts the low power good signal when the supply and core voltages are fully charged. A processor may rely on the low power mode signal for transitioning between power modes.
    Type: Grant
    Filed: August 21, 2020
    Date of Patent: September 27, 2022
    Assignee: NXP USA, Inc.
    Inventors: Loic Hureau, Jean-Philippe Meunier, Daniel McKenna
  • Patent number: 11456188
    Abstract: A flexible semiconductor device includes a first tape having bonding pads and conductive traces formed. A semiconductor die having a bottom surface is attached to the first tape and electrically connected to the bond pads by way of electrical contacts. A second tape is attached to a top surface of the semiconductor die. The first and second tapes encapsulate the semiconductor die, the electrical contacts, and at least a part of the conductive traces.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: September 27, 2022
    Assignee: NXP USA, INC.
    Inventors: You Ge, Meng Kong Lye, Zhijie Wang
  • Patent number: 11456747
    Abstract: A method for multiphase frequency to voltage conversion includes generating for each cycle of an oscillating input, one of a plurality of non-overlapping clocks. A respective voltage in proportion to an input frequency of the oscillating input, is generated in response to each of the non-overlapping clocks, with a respective one of a plurality of frequency to voltage converters. Each of the respective voltages is summated to generate a voltage sum proportional to the input frequency.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: September 27, 2022
    Assignee: NXP USA, Inc.
    Inventor: Trevor Mark Newlin
  • Patent number: 11457448
    Abstract: A method and an apparatus for operating a Basic Service Set (BSS) are disclosed. A method involves announcing, by a first wireless device to a second wireless device, a BSS operating channel, wherein the first wireless device has at least one of a first transmission power capability and a first bandwidth capability, the second wireless device has at least one of a second transmission power capability that is less than the first transmission power capability and a second bandwidth capability that is narrower than the first bandwidth capability, and wherein the BSS operating channel is at least one of a punctured operating channel and an unpunctured operating channel, associating, by the second wireless device, with the first wireless device via the announcement of the BSS operating channel from the first wireless device, and exchanging frames between the first wireless device and the second wireless device in the BSS operating channel.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: September 27, 2022
    Assignee: NXP USA, Inc.
    Inventors: Liwen Chu, Rui Cao, Sudhir Srinivasa, Hongyuan Zhang, Huiling Lou, Young Hoon Kwon