Abstract: A contact image sensing module with movement detecting function has a main circuit substrate, a linear sensor array, at least a movement detecting element, a light source, a light-guiding device, and a detecting surface. The main substrate is a flex-rigid composite substrate having a structure making the linear sensor array have a tilted angle. The linear sensor array has at least a comparison sensor corresponding to at least a movement detecting element. The movement detecting element and the comparison sensor, respectively, draw a section of reference image data and a section of comparison image data from a sensed object. After processing a shift-times deciding equation and a speed deciding equation, the moving speed of the sensed object relating to the movement detecting element and the comparison sensor can be obtained. The structure of the light-guiding device makes the light from the light source to the sensed object more uniform.

Abstract: An RF envelope detection circuit that operations at low currents, high sensitivity, and high dynamic range. The circuit receives an AC signal at its input terminal and applies a signal on its output terminal that is a function of the envelope magnitude of the AC signal. To do so, a current source provides a current with an AC signal being superimposed thereon. A rectification circuit rectifies the AC component of this current. A voltage amplifier then amplifies the voltage for providing on the output terminal of the detection circuit. A current sink draws a current from the output terminal that has approximately the same magnitude as the current provided by the current source. A capacitor is coupled to the output terminal of the rectifier so as to store excess charge provided by the rectifier that is in excess of the magnitude of the current provided by the current source.

Abstract: An integrated high side switch with multi-fault protection. When a fault condition is detected, the switch is turned off. The switch includes a pair of transistors that are connected such that the source of the first transistor is connected with the source of the second transistor. The drain of the first transistor is thus connected to the supply voltage. A first current mirror generates a current sense output. A second current mirror generates an internal current to detect an over current fault condition. The transistors in the current mirrors are connected like the switch transistors. A high voltage operational amplifier and a transistor are used as feedback to insure that the voltage at the output of the current mirrors matches the voltage at the output of the switch. This ensures that the current mirrors generate scaled versions of the current flowing through the switch.

Abstract: Calibration of a sensor circuit that includes a sensor, a temperature measurement circuit and a signal processing path. The sensor senses a physical parameter to be measured and generates an electrical sensor output signal representing the physical parameter. The temperature measurement circuit outputs a measured temperature. The signal processing path is coupled to the sensor so as to receive the electrical sensor output signal and use the measured temperature to compensate for temperature variations in the electrical sensor output signal. During calibration, the output voltage of the signal processing path is measured at multiple temperatures, and at multiple values of the physical parameter being measured at each temperature while the signal processing path is disconnected from using the measured temperature of the temperature measurement circuit.

Abstract: A contact image-sensing module having fingerprint-scanning function is described. The image-sensing module has a flex/rigid composite substrate having a first rigid circuit substrate, a second rigid circuit substrate, a third rigid circuit substrate, and at least one flex circuit board. The first rigid circuit substrate, the second rigid circuit substrate, and the third rigid circuit substrate respectively and electrically connect to the flex circuit board in order to form a first composite substrate, a second composite substrate, and a third composite substrate. Each of the second composite substrate and the third composite substrate respectively is not located in the same plane and has a predetermined angle with respect to the plane where the first composite plane is located.

Abstract: A packaging structure of an optical motion sensor includes a packaging substrate, an optical detection module, and a packaging mask. The optical detection module is provided on the packaging substrate and is electrically connected with the packaging substrate. The packaging mask is disposed on the packaging substrate to package the optical detection module. Further, the packaging mask is provided therein with a transparent body and a hole formed on the packaging mask. Via the above structure, light, passes through the transparent body inside the hole, and thus shines the optical detection module. In this way, the optical detection module is isolated from dirt in the air, thereby reducing possible damage or interference and reducing the volume of the packaging structure.

Abstract: The power semiconductor of the invention consists of an n+ drain area; an n? epitaxial area; p? body and p+ body areas formed on top of the n? epitaxial area in a striped configuration; an n° epitaxial area formed on the n? epitaxial area and between the p? body and p+ body areas; a p-type edge area formed beneath the n° epitaxial area to connect with the two ends of the p+ body area; an n+ source area formed on two sides of the p? body area; gate dielectrics formed on top of the n+ body area, the p? body area, and the n° epitaxial area; and gate electrodes formed on the gate dielectrics. The p-type edge section of the power semiconductor of the invention consists of multiple sub-areas that prevent ruggedness current from concentrating on the p+ body area and thereby improve the ruggedness of the power semiconductor.

Abstract: An image sensor device for outputting digital signals and a method thereof are disclosed. The image sensor device has a sensor module, a photoelectric converter module, an encoder module and a decoder module integrated with each other. The digital signals are outputted by the photoelectric converter module, are transferred to the series outputs by the encoder module, and then the decoder module takes the place of the ADC for transferring the series outputs to parallel digital signal outputs. Hence the present invention improves the defects (such as transmission interference, transmission decay and power consumption) of the analog signal, and removes the ADC from the image sensor device for reducing production costs. Furthermore, the image sensor device has some advantages for providing good image quality, easy assembly and reducing both power consumption and cost.

Abstract: An overvoltage protection device has a voltage-limiting region parallel to its central junction to produce a transverse junction breakdown. The spacing between the voltage-limiting region and the central junction defines the breakdown voltage. Via varying the size and location of the voltage-limiting region, the protection device can has various-breakdown voltages and lower breakover currents. Thereby, the sensitivity of the protection device can be improved.

Abstract: A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-layer rigid PCB. A portion of the multi-layer rigid PCB between the grooves is milled to expose a corresponding portion of the soft PCB to define an exposed area. The combined PCB is drilled through along two opposite sides of the grooves and the corresponding exposed area of the soft PCB. Breakable parts are formed at a center of the corresponding portion of the soft PCB and two opposite outside edges of the grooves.

Abstract: An image sensing module capable of fast transferring signal and a method thereof are proposed. The image sensing module comprises an optical sensor set, a plurality of readout circuits and a plurality of amplifying circuits. Each readout circuit has a plurality of input terminals and an output terminal. Each amplifying circuit has an input terminal and an output terminal. The input terminals of each readout circuit are connected with the optical sensor set. The output terminal of each readout circuit is connected to the input terminal of one of the amplifying circuits. These readout circuits simultaneously capture output signals of the optical sensor set and then transfer to corresponding amplifying circuits in a parallel way. These amplifying circuits then output the amplified signals one by one in an orderly and time-sharing way to accomplish quick transmission of signals of the image sensing module.

Abstract: A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are electroplated on the inner edges of the conducting holes on the multi-layer soft and hard composite PCB. An image-sensing chip can thus be packaged on the chip package substrate with the soft circuit board used as external signal connection lines, thereby saving the manufacturing cost and increasing the yield thereof.

Abstract: A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are electroplated on the inner edges of the conducting holes on the multi-layer soft and hard composite PCB. An image-sensing chip can thus be packaged on the chip package substrate with the soft circuit board used as external signal connection lines, thereby saving the manufacturing cost and increasing the yield thereof.

Abstract: An optical mouse chip with silicon retina structure comprises an image sensor array, an accumulator and a comparing/selecting unit. The image sensor array senses a direction parameter of an image along each axis. The accumulator sums the direction parameters of the image along different axes. The comparing/selecting unit selects a largest one from the sum of direction parameters of the image along different axes to determine a moving direction of the image.

Abstract: A support structure of a power element includes a conductive mounting platform, a lead frame and a conductive lead. The conductive mounting platform includes an envelope engaging member, an interior conductive surface and an exterior conductive surface. The lead frame is with a first side and a second side. The first side is connected to at least one connecting element, which is connected to one side of the conductive mounting platform. The second side of the lead frame is with at least one conductive lead, including a first end and a second end that is connected with the second side of the lead frame so that the semiconductor device is secured on the interior conductive surface of the conductive mounting platform for establishing electrical connection. According to the aforementioned, the support structure can be easily assembled and manufactured.