Abstract: A support structure for a light-emitting diode utilizes the configuration of a sacrifice structure to achieve safe separation of a light-emitting diode from a carrier substrate. Specifically, when an external force is applied on the light-emitting diode or the carrier substrate, a breaking layer of the sacrifice structure is the first layer to be broken, so that the light-emitting diode and carrier substrate will become separated from each other.

Abstract: A microLED display includes a first main substrate, microLEDs disposed above the first main substrate, a first light blocking layer disposed above the first main substrate to define emission areas, a light guiding layer disposed in the emission areas, and a plurality of connecting structures disposed in the emission areas respectively and electrically connected with the microLEDs.

Abstract: A vacuum suction apparatus includes a semiconductor substrate with a top portion having grooves and a bottom portion having through holes, wherein each said groove correspondingly connects with at least one said through hole, and the groove has a width greater than a width of the through hole; and a cover plate disposed on a top surface of the semiconductor substrate. At least one edge of the vacuum suction apparatus has a vacuum chamber, which connects with the grooves. In another embodiment, the cover plate is replaced with a vacuum cover disposed above the semiconductor substrate, wherein the vacuum cover and the semiconductor substrate construct a vacuum chamber.

Abstract: A bottom emission microLED display includes a microLED disposed above a transparent substrate; a light guiding layer surrounding the microLED to controllably guide light generated by the microLED towards the transparent substrate; and a reflecting layer formed over the light guiding layer to reflect the light generated by the microLED downwards and to confine the light generated by the microLED to prevent the light from leaking upwards or sidewards.

Abstract: The present disclosure describes techniques to improve the resolution and reduce the distortion of structured light projection in miniature wide-angle VCSEL array projection modules used for 3D imaging and gesture recognition. The projector module includes a chief ray corrector optical element, which directs the VCSEL beams along the projector lens chief ray paths. The VCSEL structured illumination projector using the chief ray optical element corrector can create a high resolution, low distortion structured light pattern over an extended distance range greater that the projector lens image focal range. The corrector element is placed close to the VCSEL array. The corrector element can be implemented in various ways including, for example, a refractive lens, diffractive lens or microlens array, depending on the specific application requirements and optical configurations.

Abstract: A vacuum transfer device includes a semiconductor substrate, which has a first hole disposed in a top portion of the semiconductor substrate; a nozzle disposed in a bottom portion of the semiconductor substrate and protruding downward, the nozzle being aligned with the first hole; and a second hole disposed through the nozzle and in the semiconductor substrate to meet the first hole.

Abstract: A global shutter CMOS image sensor includes a photodiode, a floating diffusion region, and a storage diode disposed in the upper portion of the substrate. The storage diode is disposed between the photodiode and the floating diffusion region. A first transfer gate is disposed on the substrate between the photodiode and the storage node. A second transfer gate is disposed on the substrate between the storage diode and the floating diffusion region. A first dielectric layer is disposed on the substrate and covers the first transfer gate and the second transfer gate. A light-shielding layer is disposed on the first dielectric layer. A light pipe is disposed through the light-shielding layer and a portion of the first dielectric layer, and is correspondingly disposed above the photodiode. The light pipe has a higher refractive index than the first dielectric layer.

Abstract: A micro device transfer system includes a transfer head having pick-up electrodes for picking micro devices and thin-film transistors (TFTs) corresponding to the pick-up electrodes; a transfer head holder for holding the transfer head; a TFT driver board electrically connected to control the TFTs; a donor or acceptor substrate for carrying the micro devices; and a substrate holder for holding the donor or acceptor substrate.

Abstract: A Vertical Cavity Surface Emitting Laser (VCSEL) includes a reflecting surface of the VCSEL. A gain region is positioned on the distributed Bragg reflector that generates optical gain. The gain region comprises a first and second multiple quantum well stack, a tunnel junction positioned between the first and second multiple quantum well stack, and a current aperture positioned on one of the first and second multiple quantum well stack. The current aperture confines a current flow in the gain region. A partially reflective surface and the reflective surface forming a VCSEL resonant cavity, wherein an output optical beam propagates from the partially reflecting surface.

Abstract: A LED sensing system and a display panel sensing system are disclosed. The LED sensing system comprises LEDs and a driver. The LEDs are arranged in a LED array, and the driver is disposed on a central portion of the LED array and electrically connected to the LEDs respectively. The driver can receive an activation maintenance signal, and receive an input address, and turn on one of the LEDs corresponding to the input address, so as to obtain a magnitude of a voltage of the LED corresponding to the input address for determining performance of the LED and a yield rate of the LED array.

Abstract: The invention provides an optical fingerprint sensor including: an image sensing layer having an array composed of a plurality of sensing blocks; a collimating layer disposed on the image sensing layer and having a plurality of through holes penetrating from the top surface to the bottom surface of the collimating layer; a light guiding layer disposed in the collimating layer, and a glass cover layer disposed on the light guiding layer, the top surface of the glass cover layer receiving a finger touch, wherein the image resolution of the optical fingerprint sensor is defined by the number of sensing blocks, and there are a plurality of through holes directly above each of the sensing blocks.

Abstract: A bottom emission microLED display includes a microLED disposed above a transparent substrate; a light guiding layer surrounding the microLED to controllably guide light generated by the microLED towards the transparent substrate; and a reflecting layer formed over the light guiding layer to reflect the light generated by the microLED downwards and to confine the light generated by the microLED to prevent the light from leaking upwards or sidewards.

Abstract: A miniature illuminator is described which is suitable for assembly into mobile electronics devices such as cell phones and computer tablets. Features of the invention overcome the complexity of current miniature illuminators by using single molded structure which includes all the electrical feedthrough connections and has the features necessary for accurate mounting of optical components. The molded structure includes laser safety connections which provide an electrical interrupt signal when the illuminator is damaged in a way that could result in propagation of non-eye safe illuminator beams. In an alternate operation the illuminator provides a signal when a subject gets too close to the illuminator and would receive unsafe VCSEL illuminator beam. The laser safety feature is integrated into the molded Illuminator package so that separate electrically connected structures to achieve this function are eliminated.

Abstract: A micro light-emitting diode (microLED) display panel includes microLEDs; a substrate for supporting the microLEDs, the substrate being divided into a plurality of sub-regions; and a plurality of chip-on-film (COF) packages mounted on surfaces of the sub-regions respectively, a plurality of drivers being disposed on the COF packages respectively.

Abstract: An active pixel sensor is provided. The active pixel sensor includes a substrate, a plurality of sensing circuits, and a plurality of output circuits. The substrate is divided into a plurality of pixel rows. A plurality of pixel areas are disposed on the plurality of pixel rows. The plurality of sensing circuits are disposed in the pixel areas on the pixel rows excluding a specific pixel row among the plurality of pixel rows. The plurality of sensing circuits are further disposed on a plurality of pixel columns to form an array. Each of the plurality of sensing circuits includes a sensing element, a transfer transistor, and a floating diffusion node. The plurality of output circuits are disposed in the pixel areas on the specific pixel row. The sensing circuits on the same pixel column are coupled to the same output circuit.

Abstract: An image sensor device is provided. The image sensor device includes a substrate, a plurality of photoelectric conversion units for collecting image signals disposed in the substrate, a first dielectric layer disposed upon the substrate, a plurality of metal layers disposed in the first dielectric layer, a trench disposed in the first dielectric layer and located between the adjacent metal layers, a filling material filled in the trench, a second dielectric layer disposed upon the first dielectric layer, and a light source or a detected object disposed over the second dielectric layer. The metal layer adjacent to the substrate is defined as a first metal layer. The metal layer adjacent to the top of the first dielectric layer is defined as a top metal layer. The trench extends from the top of the first dielectric layer towards the substrate to the first metal layer.

Abstract: A coded pattern projector apparatus comprises a surface-emitting array of emitters comprising a plurality of emitters where each of the plurality of emitters generates one of a plurality of optical beams in response to an electrical drive signal applied to a respective electrical input of each of the plurality of emitters. A first optical element projects each the plurality of optical beams generated by the surface-emitting array of emitters. A second optical element collimates the plurality of optical beams in a first dimension and diverges the plurality of optical beams in a second dimension such that the plurality of optical beams form at least one stripe patterns. A controller has electrical outputs, each of the electrical outputs is connected to a respective electrical input of each of the plurality of emitters. The controller generates electrical drive signals that produce a coded stripe pattern.

Abstract: A microLED display panel includes a substrate being divided into a plurality of sub-regions for supporting microLEDs, and a plurality of drivers being correspondingly disposed on surfaces of the sub-regions respectively. The driver includes a low-dropout (LDO) regulator and a drive circuit. The LDO regulator receives a system power, according to which a regulated power is generated and provided for the drive circuit.

Abstract: An image processing method is provided. The method includes the steps of: receiving upper image data; calculating a first ratio using a target pixel and a plurality of first reference pixels in the upper image data; calculating a first diffusion coefficient according to the first ratio and a diffusion coefficient mapping equation; calculating a first pixel value of the target pixel according to the target pixel, the first reference pixels, and the first diffusion coefficient; receiving lower image data; calculating a second ratio using the target pixel and a plurality of second reference pixels in the lower image data, wherein the target pixel has the first pixel value; calculating a second diffusion coefficient according to the second ratio and the diffusion coefficient mapping equation; and calculating a second pixel value of the target pixel according to the target pixel, the second reference pixels, and the second diffusion coefficient.

Abstract: An ophthalmic lens processing apparatus is provided that includes a housing, a support structure, and ophthalmic lens processing components configured to perform an ophthalmic process on an ophthalmic lens. The housing includes a case and a user access member. The support structure includes a support plate received within and movably connected to the case. At least one of the ophthalmic lens processing components is mounted to and movable with the support plate. Also provided is a method of improving user accessibility to the at least one ophthalmic lens processing components of the ophthalmic lens processing apparatus.