Abstract: A method for forming a semiconductor device includes providing a wafer having a plurality of chip regions, in which each chip region includes a sensing array on a front side of the wafer. A plurality of through silicon vias is formed in the wafer from a back side of the wafer, in which the plurality of through silicon vias is electrically connected to the plurality of sensing arrays. A filter layer is formed on the plurality of sensing arrays after the plurality of through silicon vias is formed. A cover plate is attached to the front side of the wafer to cover the filter layer.

Abstract: A high dynamic range CMOS image sensor is disclosed. The pixels of the image sensor incorporate in-pixel memory. Further, the pixels may have varying integration periods. The integration periods are determined, in part, by the signal stored in the in-pixel memory from previous integration periods.

Abstract: A process to bond VCSEL arrays to submounts and printed circuit boards is provided. The process is particularly suited to large area thin and ultra-thin VCSEL arrays susceptible to bending and warping. The process integrates a flatness measurement step and applying appropriate combination of pressure prior to bonding the VCSEL array to the submount or a printed circuit using a vacuum flux-less bonding process. The process is very promising in making very good quality bonding between the VCSEL array and a submount or a printed circuit board. The process is applied to construct optical modules with improved flatness that may be integrated with other electronic components in constructing optoelectronic systems.

Abstract: Optical pump modules comprising VCSEL and VCSEL array devices provide high optical power for configuring fiber optic gain systems such as fiber laser and fiber amplifier particularly suited for high power operation. Pump modules may be constructed using two reflector or three reflector VCSEL devices optionally integrated with microlens arrays and other optical components, to couple high power pump beams to an optical fiber output port, particularly suited to couple light to an inner cladding of a double-clad fiber suitable for a high power gain element. Multiple-pumps may be combined to increase pump power in a modular fashion without significant distortion to signal, particularly for short pulse operation. The pump modules may be operated in CW, QCW and pulse modes to configure fiber lasers and amplifiers using single end, dual end, and regenerative optical pumping modes.

Abstract: Optical pump modules comprising VCSEL and VCSEL array devices provide high optical power for configuring fiber optic gain systems such as fiber laser and fiber amplifier particularly suited for high power operation. Pump modules may be constructed using two reflector or three reflector VCSEL devices optionally integrated with microlens arrays and other optical components, to couple high power pump beams to a fiber output port. The pump module having a fiber output port is particularly suited to couple light to an inner cladding of a double-clad fiber, often used to configure high power fiber laser and fiber amplifier. The pump modules may be operated in CW, QCW and pulse modes to configure fiber lasers and amplifiers using single end, dual end, and regenerative optical pumping modes. Multiple-pumps may be combined to increase pump power in a modular fashion without significant distortion to signal, particularly for short pulse operation.

Abstract: Optical pump modules comprising VCSEL and VCSEL array devices provide high optical power for configuring fiber optic gain systems such as fiber laser and fiber amplifier particularly suited for high power operation. Pump modules may be constructed using two reflector or three reflector VCSEL devices optionally integrated with microlens arrays and other optical components, to couple high power pump beams to a fiber output port. The pump module having a fiber output port is particularly suited to couple light to an inner cladding of a double-clad fiber, often used to configure high power fiber laser and fiber amplifier. The pump modules may be operated in CW, QCW and pulse modes to configure fiber lasers and amplifiers using single end, dual end, and regenerative optical pumping modes. Multiple-pumps may be combined to increase pump power in a modular fashion without significant distortion to signal, particularly for short pulse operation.

Abstract: VCSEL arrays with planar electrical contacts readily adaptable for surface mounting are provided. Monolithic VCSEL arrays are configured in array patterns on two and three-dimensional surfaces for configuring optical illuminator modules. Illuminator modules are easily expandable by increasing the array size or by modularly arranging more arrays with or without a transparent substrate, in different shapes by tiling array modules monolithically on a common substrate, or by tiling small modules. The surface mountable illuminator modules are easily assembled on a thermally conductive surface that may be air or liquid cooled for efficient heat dissipation. Array modules may be integrated with other electronic circuits such as current drivers, sensors, controllers, processors, etc.

Abstract: Touch screen sensor systems that incorporate VCSELs or VCSEL arrays to provide illumination beams for sensing the position of objects such as a finger or stylus in a two dimensional space is provided. Normally the touch sensor is used with a display screen so that objects in the display screen are identified by positioning a finger or stylus at the object's position. The invention describes improved illumination methods using VCSELs that realize higher resolution in position sensing. VCSELs can also be integrated with detectors on a common substrate which provides both illumination and detection functions for the touch sensor system. Different methods to suitably couple light from VCSEL arrays directly, or through guided light paths such as fibers and waveguide arrays are provided to configure a touch sensor in different applications.

Abstract: Illuminator module comprising VCSEL arrays with planar electrical contacts, readily adaptable for surface mounting, is provided. Monolithic VCSEL arrays are configured in array patterns on two and three-dimensional surfaces. Illuminator modules are easily expandable by increasing the array size or by modularly arranging more arrays with or without a transparent substrate. Different shapes of illuminator modules may be configured by tiling array modules monolithically on a common substrate, or by tiling small modules. The surface mountable illuminator modules are easily assembled on a thermally conductive surface that may be air or liquid cooled for efficient heat dissipation. Array modules may be integrated with other electronic circuits such as current drivers, sensors, controllers, processors, etc.

Abstract: The present invention relates to an ophthalmic holding mechanism for holding an eyeglass frame. The holding mechanism includes a base, a clamping mechanism configured for releaseably securing a lens mount of an eyeglass frame, and an actuator operatively associated with the clamping mechanism for causing linear and rotational movement thereof. The clamping mechanism is moveably coupled to the base for linear and rotational movement about an axis of rotation relative to the base, wherein the clamping mechanism is rotatable about first and second spaced pivot points. The present invention also relates to a method of tracing a lens mount of an eyeglass frame.

Abstract: The present invention is directed to a method of calibrating drill depth of an ophthalmic processing device. A number of drill cycles are selected for drilling an expected number of holes in a lens blank. The selected number of drill cycles is performed. The drill depth of each consecutive drill cycle varies incrementally. An actual number of locations the drill bit contacted the lens blank during the drill cycles is compared to the expected number of holes. The drill depth is adjusted depending on the compared values. A method of calibrating drill hole size is also disclosed.

Abstract: A high dynamic range CMOS image sensor is disclosed. The pixels of the image sensor incorporate in-pixel memory. Further, the pixels may have varying integration periods. The integration periods are determined, in part, by the signal stored in the in-pixel memory from previous integration periods.

Abstract: Optical pump modules using VCSEL arrays are provided to pump optical gain media for achieving high power laser output in CW, QCW and pulse operation modes for operation. Low divergence and symmetric far-field emission from VCSELs are particularly suitable for compact arrays. VCSEL arrays configured as laser pump modules are operable at high temperatures with practically no degradation over a long period of time. VCSEL pump modules are adaptable for side- or end-pumping configurations to pump high power lasers in CW, QCW and pulse mode. Power output from VCSEL pump modules is scalable. Incorporating microlens arrays with the VCSEL arrays improve brightness of the pump modules. High power and high temperature operation of VCSEL modules make it suitable for making compact high power solid state lasers that are operable in small spaces such as, ignition of internal combustion engines, stationary power generation engines and pulsed detonation engines.

Abstract: The present invention relates to an ophthalmic holding mechanism for holding an eyeglass frame. The holding mechanism includes a base, a clamping mechanism configured for releaseably securing a lens mount of an eyeglass frame, and an actuator operatively associated with the clamping mechanism for causing linear and rotational movement thereof. The clamping mechanism is moveably coupled to the base for linear and rotational movement about an axis of rotation relative to the base, wherein the clamping mechanism is rotatable about first and second spaced pivot points. The present invention also relates to a method of tracing a lens mount of an eyeglass frame.

Abstract: A Mach-Zehnder optical modulator with a series push-pull traveling wave electrode uses a balanced coplanar stripline with lateral ground planes. Two signal electrodes extend along the center of the optical modulator adjacent and parallel to the optical waveguides in a series push-pull configuration. The ground planes run parallel to the signal electrodes, but are spaced laterally outward from the signal electrodes.

Abstract: The present invention is directed to a method of calibrating drill depth of an ophthalmic processing device. A number of drill cycles are selected for drilling an expected number of holes in a lens blank. The selected number of drill cycles is performed. The drill depth of each consecutive drill cycle varies incrementally. An actual number of locations the drill bit contacted the lens blank during the drill cycles is compared to the expected number of holes. The drill depth is adjusted depending on the compared values. A method of calibrating drill hole size is also disclosed.

Abstract: An electrical waveguide transmission device accepts a differential electrical input signal (e.g., S+ and S?) propagating along two separate signal conductors with grounded electrical return paths, and outputs the differential input signal to a series push-pull traveling wave electrode Mach-Zehnder optical modulator over a pair of output conductors that act as a return path for each other and provide a desired characteristic impedance matching that of the Mach-Zehnder optical modulator.

Abstract: A light emitting diode (LED) package including a transparent substrate, a transparent wiring layer, and at least one LED device is provided. The transparent wiring layer is disposed on the transparent substrate. The LED device is disposed on the transparent substrate and electrically connected to the transparent wiring layer.

Abstract: The present invention is directed to a method of calibrating drill depth of an ophthalmic processing device. A number of drill cycles are selected for drilling an expected number of holes in a lens blank. The selected number of drill cycles is performed. The drill depth of each consecutive drill cycle varies incrementally. An actual number of locations the drill bit contacted the lens blank during the drill cycles is compared to the expected number of holes. The drill depth is adjusted depending on the compared values. A method of calibrating drill hole size is also disclosed.

Abstract: A light source apparatus includes at least a light-emitting module. The light-emitting module includes a hollow rod-shaped base and a plurality of LED chips. The hollow rod-shaped base has an outer surface and an inner surface opposite to the outer surface, in which the inner surface surrounds a space. The LED chips are disposed in flip chip bonding way on the outer surface of the hollow rod-shaped base, in which the LED chips are disposed surrounding the space.