Abstract: A luminescent powder (1) with luminescent particles (2) having an average luminescent-particle size (3) selected from the range of from 0.1 ?m inclusive to 5.0 ?m inclusive. The luminescent particles comprise primary particles (4) having an average primary-particle size (5) selected from the range of from 0.1 ?m inclusive to 1.0 ?m inclusive. The primary particles which, for example, consist of a cerium-doped yttrium-aluminum garnet (Y3Al5O12), are agglomerated to form the luminescent particles. A method for producing the luminescent powder has the following steps: a) preparing at least one precursor of the primary particles, b) producing the primary particles from the precursor of the primary particles, and c) forming the luminescent particles of the luminescent powder from the primary particles. The precursor for Y3Al5O12 is, for example, a powder mixture of hydroxides.

Abstract: In a radiation-emitting semiconductor chip (2) with a beam shaping element, the beam shaping element is a hollow body (1) with a light exit opening (7). In a first embodiment, the semiconductor chip (2) has a light entry opening (8) opposite the light exit opening (7), the semiconductor chip (2) adjoining said light entry opening. In a second embodiment, the semiconductor chip (2) is arranged within the hollow body (1). At least a portion of the radiation (3) emitted by the semiconductor chip (2) is reflected at a wall (6) of the hollow body (1) toward the light exit opening (7).

Abstract: An LED light source has a housing having a base. A core projects from the base; is substantially cylindrical and is surrounded by tubes. The core and the base are arrayed about a longitudinal axis. A circuit board in the base supports LEDs. Each of the LEDs is positioned with one of the tubes in a one-to-one relationship at one end of the core. A heat sink is positioned in a heat-transferring relationship with the circuit board and a first reflector is attached to another end of the core. To direct the light emitted by the LEDs from the source to the reflector, the interior of the tubes can be plated with a highly reflective material. In one embodiment, each of the tubes is fitted with a light guide, each light guide extending from a position immediately above one of the LEDs to a position adjacent the reflector.

Abstract: A surface emitting semiconductor laser device, having at least one monolithically integrated pump radiation source (20), in which the pump radiation source (20) has at least one edge emitting semiconductor structure (9) that is suitable for emission of electromagnetic radiation whose intensity profile transversely with respect to the emission direction (z) of the semiconductor structure follows a predeterminable curve. Such a surface emitting semiconductor laser device emits electromagnetic radiation having a particularly good beam quality.

Abstract: An embodiment of the present invention pertains to an electronic device such as a passive matrix display, an alpha-numeric display, a detector array, or a solar cell array. The electronic device includes multiple organic optoelectronic devices and one or more of these organic optoelectronic devices are protected from shorts. Each of the one or more organic optoelectronic devices that is protected from a short has one of its electrodes coupled to a first current limiting device and optionally has another electrode coupled to a second current limiting device. Also, one of the electrodes of that organic optoelectronic device, the first current limiting device, or the second current limiting device is patterned.

Abstract: A surface-mountable miniature luminescent diode with a chip package which has a leadframe (16) and a semiconductor chip (22) which is arranged on the leadframe (16) and is in electrical contact with it and which contains an active, radiation-emitting region. The leadframe (16) is formed by a flexible multi-layered sheet (12, 14).

Abstract: A housing is specified for an electronic component having at least two connecting parts (4a, 4b), which are partially in contact with the housing. The conductivity of at least subareas of the housing are set in a defined manner and current paths through the housing are formed between the connecting parts. The housing thus has a defined resistance (2), which is connected in parallel with an electronic component (1), and provides ESD protection for the component (1).

Abstract: A lamp assembly comprising: a side-emitting LED light source, a planar substrate having a first side and a second side, said LED light source being mounted in a center region of said first side, leaving an edge region of the first side extending circumferentially around said LED light source; said substrate having a portion of high thermal conductivity in thermal contact with said LED light source; a reflector having a reflective surface defining a concave cavity with an opening in a direction toward a field to be illuminated and having a through passage extending into said cavity; said LED light source being extended through said passage and having light emitting surfaces facing said reflective surface, said edge region being circumferentially sealed to said reflector, and electrical connections extending through said planar substrate connecting said LED light source to a supply of electrical power.

Abstract: A lamp (10) has a cup-shaped body (12) with a bottom (14) with a sidewall (16) defining a top (18). The body (12) is thermally conductive. A reflective coating (20) is provided on the inside surface bottom (14) and side wall (16) for reflecting light from a side emitting LED (22) that is mounted on a thermally conductive, electrically insulating coupling (24) and is centered on the bottom (14). A lens (26) for directing light emitted from the LED (22) in a desired direction is provided and preferably is a Fresnel optic. The lens (26) can close the opening (18) or it can be formed as an integral part of bottom (14) or it can be added to the bottom (14). Alternatively, the lens (26) can be solid with the lens elements either external or internal. Electrical connections (28, 30) to the LED extend through the cup-shaped body (14).

Abstract: A UV-emitting phosphor blend is provided which comprises a mixture of at least two UVA-emitting phosphors selected from SrB4O7:Eu, YPO4:Ce, and BaSi2O5:Pb wherein the sum of the weight percentages of the phosphors in the mixture equals 100%. The phosphor blend may additionally contain an amount of SrCe0.08MgAl11O18 in an amount from 0 to 12 wt. % of the mixture. Tanning lamps containing these blends exhibit increases in initial UVA output and UVA maintenance.

Abstract: In a method of fabricating a radiation-emitting semiconductor chip based on AlGaInP, comprising the method steps of preparing a substrate, applying to the substrate a semiconductor layer sequence comprising a photon-emitting active layer, and applying a transparent decoupling layer comprising(Gax(InyAl1-y)1-xP wherein 0.8?x and 0?y?1, it is provided according to the invention that the substrate is made of germanium and that the transparent decoupling layer is applied at low temperature.

Abstract: A tungsten-tin composite for green (lead-free) ammunition is provided wherein the composite is made with a spheroidized tungsten powder and has mechanical properties similar to those of lead. The composite may be fully densified at pressures less than about 250 MPa and is suitable for pressing complex projectile shapes to near net size.

Abstract: An assembly (10) comprises a base (12), a first body (14) projecting from the base (12) in a first direction (16); an opening (18) in the base adjacent (12) the first body (14); a second body (20) projecting from the base (12) in a second direction (22) and containing a slot (24); a spring-clip (30) comprising a substantially U-shaped body (32) having first and second legs (34, 36), connected by a bight (38), the first leg (34) being longer than the second leg (36); the first leg (34) including a cammed leading edge (40) and a locking aperture (42) and being fitted into the opening (18) and extending in the first direction (16); the second leg (36) being inserted into the slot (24) and including retention barbs (44) for maintaining the second leg (36) in the slot (24); and a third body (46) formed to mate with the first body (14), the third body (46) including a locking lug (48) that engages the locking aperture (42).

Abstract: An optoelectronic component with an epitaxial semiconductor layer sequence having an active zone that emits electromagnetic radiation, and at least one electrical contact region having at least one radiation-transmissive electrical contact layer, which contains ZnO and is electrically conductively connected to an outer semiconductor layer. The contact layer is provided with watertight material in such a way that it is substantially protected against moisture.

Abstract: A ceramic arc tube assembly and a method for making a ceramic arc tube are described which simplify the manufacture of ceramic arc tubes by reducing the number of handling and heat treatments required to assemble arc tubes prior to the final sintering operation. In particular, the invention uses transient assembly buttons during intermediate assembly steps which are removed prior to the final sintering operation.

Abstract: An LED lamp (10) having a substantially concave heat sink (12) having a raised, frusto-conical center (14) surrounded by an outer rim (16). The heat sink (12) is preferably aluminum or other metal and at least the frusto-conical center preferably has a reflective coating. To further aid in heat removal the outer rim (16) can be provided with a plurality of apertures (16a). A side-emitting LED (18) is mounted on the frusto-conical center (14). A cover (26) is fixed to the outer surface (22) and defines a volume (28) between the frusto-conical center (14) and the cover (26). A circuit (30) is located within the volume (28) and an electrical connection (32) provides connection to the LED (18). In another embodiment a cover (26a) is provided with studs (54) and a reflector (42a) is provided with studs (56) that engage barbs (50) formed in a heat sink (12a).

Abstract: An embodiment of an encapsulated organic optoelectronic device is described. The encapsulated device includes an organic optoelectronic device on a substrate and that organic optoelectronic device has a cathode. The encapsulated device further includes a diffusion layer that is on the organic optoelectronic device and that diffusion layer covers exposed areas of the organic optoelectronic device. An adhesive layer is on the substrate and is around a perimeter of the diffusion layer. An encapsulation lid is on the adhesive layer, and a getter is on the encapsulation lid such that the getter overlies the organic optoelectronic device. The diffusion layer slows a rate of absorption of reactive gasses by the cathode and increases a proportion of the reactive gasses absorbed by the getter relative to the cathode.

Abstract: An arrangement of a microoptical component on a substrate, containing an adjustment connection which is provided between the component and the substrate and containing a first and a second connection element, which, matching one another, have first and second surfaces which are in contact and allow adjustment in different relative positions. This arrangement allows particularly simple adjustment of a microoptical component, for example, in the beam path of an optical component.