Abstract: Surface-mountable semiconductor component having a semiconductor chip (1), at least two external electrical connections (31/314/41, 32/324/42), which are electrically conductively connected to at least two electrical contacts of the semiconductor chip (1), and an encapsulation material (50). The two external electrical connections are arranged at a film (2) having a thickness of less than or equal to 100 ?m. The semiconductor chip (1) is fixed at a first main surface (22) of the film (2) and the encapsulation material (50) is applied on the first surface (22).
Abstract: An incandescent lamp that emits infrared light and a method of making the lamp includes a filament assembly inside a polycrystalline aluminum oxide (PCA) envelope, where the filament assembly preferably has a coiled tungsten filament, solid metal ends of tungsten or molybdenum attached to the coiled tungsten filament, and leads at distal ends of the solid metal ends. End caps are attached to ends of the envelope and have openings through which a respective one of the leads extends, where the leads are each made of an electrically conductive material having a coefficient of thermal expansion compatible with the end caps, such as niobium. The leads are attached to the end caps with glass-ceramic sealing frits. The end caps and sealing frits seal a suitable gas inside the envelope.
Type:
Application
Filed:
June 27, 2005
Publication date:
September 29, 2005
Applicant:
OSRAM SYLVANIA INC.
Inventors:
Jeffrey Neil, Victor Perez, Lewis Palmer, Joseph Lester
Abstract: A ceramic discharge vessel is provided wherein the vessel comprises a hollow body for enclosing a discharge and the hollow body is made of a polycrystalline dysprosium oxide containing a luminescent dopant that emits one or more visible light wavelengths when stimulated by radiation generated by the discharge. Preferably, the polycrystalline dysprosium oxide has been doped with one or more of europium, cerium, or terbium in an amount from about 0.1 to about 10 percent by weight on an oxide basis.
Type:
Application
Filed:
June 24, 2005
Publication date:
September 29, 2005
Applicant:
OSRAM SYLVANIA INC.
Inventors:
George Wei, Walter Lapatovich, Joanne Browne, Kailash Mishra, Madis Raukas
Abstract: An encapsulation for an electrical device is disclosed. The encapsulation comprises plastic substrates which are laminated onto the surface of the electrical device. The use of laminated plastics is particularly useful for flexible electrical devices such as organic LEDs.
Type:
Grant
Filed:
July 9, 1999
Date of Patent:
September 27, 2005
Assignees:
Osram Opto Semiconductor GmbH & Co. OHG, Institute of Materials Research and Engineering
Inventors:
Ewald Karl Michael Guenther, Wei Wang, Soo Jin Chua
Abstract: An embodiment of an encapsulated OLED device is described. This embodiment of the encapsulated OLED device is formed by: fabricating multiple OLED devices on a substrate; depositing at least one planarization layer on the OLED devices; hardening the at least one planarization layer in a patterned manner such that the hardened region substantially covers the OLED device; removing areas of the at least one planarization layer that are not hardened; and selectively depositing at least one barrier layer over the hardened region.
Abstract: An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage.
Type:
Grant
Filed:
December 17, 1999
Date of Patent:
September 27, 2005
Assignee:
Osram Opto Semiconductors GmbH
Inventors:
Ewald Karl Michael Guenther, Hagen Klausmann
Abstract: A radiation-emitting semiconductor component comprising a semiconductor body (3) with a first active zone (1) and a second active zone (2) arranged above the first active zone, the first active zone being provided for generating a radiation having a first wavelength ?1 (11) and the second active zone being provided for generating a radiation having a second wavelength ?2 (22), the radiation having the first wavelength ?1 being coherent and the radiation having the second wavelength ?2 being incoherent.
Abstract: A method for producing a surface mounting optoelectronic component comprises the following steps: readying a base body with the optoelectronic transmitter and/or receiver arranged in a recess of the base body, filling the recess of the base body with a transparent, curable casting compound, and placing the optical device onto the base body, whereby the optical device comes into contact with the casting compound.
Type:
Grant
Filed:
May 16, 2003
Date of Patent:
September 20, 2005
Assignee:
Osram GmbH
Inventors:
Günter Waitl, Robert Lutz, Herbert Brunner
Abstract: Recesses interrupt an active layer on a semiconductor chip to improve the coupling out of light. As a result, side faces of the active layer appear, as seen from a light-generating point, at a large solid angle and the paths of light in the active layer are shortened.
Abstract: An embodiment of the present invention pertains to an electrode that includes a metal oxide layer, and a conductive layer on that metal oxide layer. The metal oxide layer is an alkali metal oxide or an alkaline earth metal oxide that is formed by: (1) decomposing a compound that includes (a) oxygen and (b) an alkali metal or an alkaline earth metal, or (2) thermally reacting at least two compounds where one of the at least two compounds includes the alkali metal or the alkaline earth metal, and another one of the at least two compounds includes oxygen. The metal oxide layer can also be formed by thermally reacting at least two compounds where one of those compounds includes (a) oxygen and (b) an alkali metal or an alkaline earth metal.
Abstract: In an optically pumpable surface-emitting semiconductor laser device with a vertical emitter with a radiation-generating active layer, at least one modulation radiation source for modulating the output power of the surface-emitting semiconductor device is provided. The modulation radiation source is formed by an edge-emitting semiconductor structure with an active layer, and which is disposed such that during operation it radiates into the radiation-generating active layer of the vertical emitter. This produces an easily modulatable surface-emitting laser source of high power and high beam quality. A pumping radiation source for optically pumping the active layer of the vertical emitter is preferably provided in the semiconductor laser device.
Type:
Grant
Filed:
March 28, 2003
Date of Patent:
September 20, 2005
Assignee:
Osram GmbH
Inventors:
Werner Späth, Johann Luft, Stephan Lutgen, Norbert Linder, Tony Albrecht, Ulrich Steegmüller
Abstract: A measuring arrangement for measuring product parameters of a component in the epitaxial layer (28) of a wafer comprises measuring probe (3) on whose contact side (23) a recess (24) is installed, into which an electrolyte can be poured. The electrolyte produces an electrical connection between a contact body (11), which is charged with a signal from a pulsed-current source, and the surface (22) of the wafer (2). A detector (16) serves for detecting the light which is emitted by the component.
Type:
Grant
Filed:
February 19, 2002
Date of Patent:
September 20, 2005
Assignee:
Osram GmbH
Inventors:
Wolfgang Gramann, Raimund Oberschmid, Werner Späth, Wolfgang Teich
Abstract: A semiconductor laser device, having an epitaxial semiconductor body (40) with a waveguiding layer (22), which contains an active radiation-generating layer (20), a laser-active emitter region (12), disposed in the epitaxial semiconductor body (40) and having a primary direction (30), which essentially corresponds to the exit direction of the laser radiation from the emitter region, and an amplifier region (14), adjoining the emitter region (12) in the semiconductor body (40) in the primary direction (30), for amplifying the laser radiation. The emitter region (12) and the amplifier region (14) form active regions in the semiconductor material. The waveguiding layer (22) is removed in some regions of the semiconductor body (40) outside the active regions (12, 14), in such a way that flanks (18; 32; 36) of the semiconductor body (40) that are produced by the removal form a shallow angle ? with the plane in which lies the waveguiding layer.
Abstract: A fluorescent lamp (10) has an elongated glass envelope (12) with a mount structure (14) sealing each end (16) of the envelope (12). The mount structure (14) comprises a glass base (18) with two spaced apart lead-in wires (20, 22) sealed into the glass base (18) and extending into the envelope (12). An electrode (24) is connected between the lead-in wires (20, 22) within the envelope (12) and an electrode shield (26) surrounds the electrode (24). The electrode shield (26) has an open top (26a) and an open bottom (26b) and a wall (26c) that is substantially equidistantly spaced from the electrode (24). A support member (28) is attached only to the shield wall (26c) and to one of the lead-ins, for example, (22), thereby making the shield (26) electrically active when the lamp is operating.
Abstract: A device having at least one radiation-emitting semiconductor component (1), the semiconductor component being assigned at least one electrical heating element (2) designed for heating the semiconductor component. Furthermore, a method for the temperature stabilization of the operating temperature of a radiation-emitting semiconductor component (1) of a device is specified, the semiconductor component being assigned an electrical heating element (2), by means of which the semiconductor component is heated when the operating temperature of the semiconductor component falls below a predetermined desired value of the operating temperature. The semiconductor component can be assigned a temperature sensor (4) for monitoring the operating temperature of the semiconductor component.
Type:
Application
Filed:
February 24, 2005
Publication date:
September 15, 2005
Applicant:
Osram Opto Semiconductors GmbH
Inventors:
Stefan Morgott, Ulrich Steegmuller, Klaus Friepes
Abstract: The invention relates to an illumination unit having an electric lamp which has a lamp vessel having a sealed-off end in the form of a glass base, and having an envelope which at least partially surrounds the lamp vessel and rests on the lamp vessel such that the glass base protrudes from the envelope.
Abstract: A semiconductor laser has a semiconductor body with first and second main areas, preferably each provided with a contact area, and also first and second mirror areas. An active layer and a current-carrying layer are formed between the main areas. The current-carrying layer has at least one strip-type resistance region, which runs transversely with respect to the resonator axis and whose sheet resistivity is increased at least in partial regions compared with the regions of the current-carrying layer that adjoin the resistance region.
Type:
Grant
Filed:
June 12, 2003
Date of Patent:
September 13, 2005
Assignee:
Osram GmbH
Inventors:
Bruno Acklin, Martin Behringer, Karl Ebeling, Christian Hanke, Jörg Heerlein, Lutz Korte, Johann Luft, Karl-Heinz Schlereth, Werner Späth, Zeljko Spika
Abstract: A plurality of light-emitting diode light sources of the same kind are produced simultaneously. Each light source includes a light-emitting diode chip and a luminescence conversion element, which converts the wavelength of at least part of an electromagnetic radiation emitted by the light-emitting diode chip. In a first process, a layer composite with a light-emitting diode layer sequence applied to a carrier substrate is provided. The wafer is provided with trenches and then inserted into a cavity of a mold. A molding compound, which contains a luminescence conversion material, is driven in, so that the trenches are at least partly filled with the molding compound. The mold is then removed and the light-emitting diode light sources are separated from the layer composite. In a second process, instead of the layer composite, a plurality of light-emitting diode chips which are applied to a common carrier in a regular arrangement are provided.
Abstract: An optical device has a plurality of optical elements lined up in a row laterally. The optical elements in each case have a light entry surface, a light exit surface, and an associated optical axis. The light entry surfaces are in each case formed convexly in the manner of a lens in a central region surrounding the optical axis. The central region is in each case surrounded by an annular reflector, which is preferably composed of a plurality of individual reflectors.