Abstract: A method for producing a semiconductor body is disclosed. In an embodiment, the method includes providing a semiconductor body, applying a first mask layer and a second mask layer to the semiconductor body and forming at least one second mask opening in the second mask layer and at least one recess in the semiconductor body in a region of the at least one first mask opening in the first mask layer, wherein the recess comprises a side face and a bottom face and the recess forms an undercut with the second mask opening. The method further includes applying a passivation layer unpatterned to the second mask layer and to the side face and the bottom face of the at least one recess and removing the passivation layer so that the passivation layer remains at least in part on the side face of the at least one recess.

Abstract: A package for an electronic component includes a housing and a leadframe embedded in the housing. The leadframe includes a first section, a second section and a third section which are electrically isolated from one another. The first section and the second section each include an L-shape.

Abstract: Electronic component with a support comprising a first inorganic insulating layer and a second inorganic insulating layer, between which a metal core is arranged, a first, a second and a third electrically conductive structure which are arranged on a top surface of the carrier, a first and a second electrical contact point and a thermal contact point, which are arranged on a bottom surface of the carrier, a component and an electrical protection element which are arranged on the side of the top surface of the carrier, in which the first electrically conductive structure is electrically conductively connected to the first electrical contact point, the second electrically conductive structure is electrically conductively connected to the second electrical contact point, the third electrically conductive structure is electrically conductively connected to the thermal contact point, the component is electrically conductively connected to the first and second electrically conductive structures, the electrical prot

Abstract: A device includes a plurality of optoelectronic semiconductor components and a connection carrier on which the optoelectronic semiconductor components are arranged, wherein the optoelectronic semiconductor components each have a semiconductor body including an active region configured to generate and/or receive radiation; the optoelectronic semiconductor components have a molded body through which a first electrical contact and a second electrical contact to electrically contact the semiconductor bodies are fed; the molded body has a side face delimiting the semiconductor components in a lateral direction; and the connection carrier and the side face of the molded body are covered at least in regions by a radiation-impermeable cover layer.

Abstract: A method of producing at least one connection carrier includes: A) providing a carrier plate with a planar top face; B) applying at least one electrically insulating insulation strip to the top face and cohesively connecting the carrier plate and the insulation strip; and C) applying at least one electrically conductive conductor strip to an adhesive surface of the insulation strip and cohesively connecting the insulation strip and the conductor strip, wherein the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip.

Abstract: A method for producing an apparatus, an apparatus and an optoelectronic component are disclosed. In an embodiment the method includes providing a carrier, depositing an amorphous ALD layer on the carrier using an ALD method and recrystallizing the amorphous ALD layer into a crystalline layer.

Abstract: A method for controlling a chromaticity of total light provided by a lighting system includes detecting the total light by a sensor system, determining a component of the total light that is attributable to uncontrolled light, and selecting a calibration for a sensor based on the uncontrolled light, and using the calibration to adjust the output of the sensor system. The calibration tables may be based on spectral responsivity of the sensors in the sensor system and calibration functions rather than physical light sources. Relative intensities of controllable light sources having different xy values are then adjusted to cause the total light provided by the lighting system to approximate a target chromaticity. A daylighting system implementing this method includes controllable light sources with different xy values. The intensities of the controllable light sources are adjusted to augment sunlight to control the chromaticity of total light provided by the daylighting system.

Abstract: A method of preventing an analysis of the material composition of an organic optoelectronic component includes: A) providing an organic optoelectronic component having a functional component part and a camouflage layer, and B) determining an overall analysis spectrum of the organic optoelectronic component by IR or X-ray radiation, wherein the overall analysis spectrum is composed of a first analysis spectrum of the functional component part and a second analysis spectrum of the camouflage layer, and determination of the first and/or second analysis spectrum from the overall analysis spectrum is made more difficult or prevented so that, due to the camouflage layer, determination of the material composition of the functional component part is made difficult or prevented.

Abstract: A lighting module includes a base, at least one electrically powered light radiation source carried by said base, a plurality of lamina electrical contacts connected to said light radiation source, and having respective proximal ends fixed to said base and respective distal ends elastically pressed against one face of said base, wherein the distal ends of said lamina electrical contacts have respective mutually offset contact areas.

Abstract: Various implementations disclosed herein includes a method for operating lighting fixtures in horticultural applications. The method may include receiving a user input of a desired irradiance for a first color channel of one or more lighting fixtures that irradiates a plant bed, in which each of the one or more lighting fixtures comprises at least one light emitting diode (LED) array, determining, for each of the one or more lighting fixtures, a PWM setting of the first color channel such that each of the one or more lighting fixtures irradiate the plant bed at the desired irradiance based on calibration data stored in each of the one or more lighting fixtures, and applying, to each of the one or more lighting fixtures, the determined PWM setting of the first color channel.

Abstract: The invention relates to a method for supplying an electrical load with electrical energy from a voltage source, in which an electrical charge storage for storing electrical charge is supplied with a preset electrical current by means of a constant current circuit connected to a voltage source, wherein a regulated electrical potential is provided for the load by means of a linear regulator circuit connected to the charge storage, wherein the charge storage is supplied with an electrical bypass current by means of a bypass circuit in parallel with the current of the constant current circuit, wherein the bypass circuit is controlled by means of a control signal of a control unit, wherein an electrical charge storage voltage at the charge storage is captured and the control signal is provided depending on the captured charge storage voltage.

Abstract: A display device with a semiconductor layer sequence includes an active region provided for generating radiation and a plurality of pixels. The display device also includes a carrier. The active region is arranged between a first semiconductor layer and a second semiconductor layer. The semiconductor layer sequence includes a recess, which extends from a major face of the semiconductor layer sequence facing the carrier through the active region into the first semiconductor layer and is provided for electrical contacting of the first semiconductor layer. The carrier includes a number of switches, which are each provided for controlling at least one pixel.

Abstract: A platelet for an optoelectronic device, a method for producing an optoelectronic device and an optoelectronic device are disclosed. In an embodiment, a platelet includes silicone and chemical compounds located on at least one surface of the platelet, wherein each chemical compound comprises an anchor group and a head group, wherein the chemical compounds are bonded to the silicone by the anchor group, and wherein an adhesion on the at least one surface is reduced by the head groups of the chemical compounds.

Abstract: A method of producing an optoelectronic component includes providing a carrier including a top side; creating at the top side of the carrier a region that is recessed with respect to a mounting region of the top side to form a step between the mounting region and the recessed region; arranging at the top side of the carrier a metallization extending over the mounting region and the recessed region; creating a separating track in the metallization, wherein the metallization is completely severed at least in sections in the mounting region and is at least not completely severed in the recessed region; and arranging an optoelectronic semiconductor chip above the mounting region of the top side, wherein the optoelectronic semiconductor chip is aligned at the separating track.

Abstract: Disclosed is a method for producing a plurality of semiconductor chips (10). A composite (1), which comprises a carrier (4) and a semiconductor layer sequence (2, 3), is provided. Separating trenches (17) are formed in the semiconductor layer sequence (2, 3) along an isolation pattern (16). A filling layer (11) limiting the semiconductor layer sequence (2, 3) toward the separating trenches (17) is applied to a side of the semiconductor layer sequence (2, 3) facing away from the carrier (4). Furthermore, a metal layer (10) adjacent to the filling layer (11) is applied in the separating trenches (17). The semiconductor chips (20) are isolated by removing the metal layer (10) adjacent to the filling layer (11) in the separating trenches (17). Each isolated semiconductor chip (20) has one part of the semiconductor layer sequence (2, 3), and of the filling layer (11). Also disclosed is a semiconductor chip (10).

Abstract: A lighting device may include an elongated body having at least one light emission surface. The body has at least one longitudinal groove extending along the elongated body. The groove has a tapered cross-section with a restricted mouth portion for receiving and retaining in the groove a complementary coupling element having a restricted stem portion and an enlarged head portion.

Abstract: Various embodiments may relate to a lighting system including a string of light sources connected in series between a first terminal and a second terminal, wherein at least one electrical contact of the string of light sources is accessible. The system further includes a protection circuit that protects the light sources from an electrostatic discharge applied to the electrical contact that is accessible. In particular, the protection circuit includes at least one TVS diode or set of antiparallel diodes connected to the second terminal, and for each electrical contact a respective capacitor connected between the respective electrical contact and a TVS diode or set of antiparallel diodes, in such a way that an electrostatic event applied to an electrical contact is discharged through the respective capacitor and the respective TVS diode or set of antiparallel diodes towards the second terminal.

Abstract: An optoelectronic component is provided with a carrier; a zinc oxide layer arranged on the carrier and having the first and second regions, wherein the first region is a first electrode structure which is doped with aluminum so that the first region is transparent and electrically conductive; an organic optically functional layer structure arranged at least partially over the first electrode structure; and a second electrode structure arranged at least partially over the organic optically functional layer structure. The first and second electrode structures electrically contact the organic optically functional layer structure. The zinc oxide layer has a lower doping in the second region than the first electrode structure. The zinc oxide layer is configured in the second region as a varistor layer structure, which is arranged between the first and second electrode structures and contacts the two electrode structures. The varistor layer structure adjoins the optically transparent first region.

Abstract: An organic light-emitting component is specified, comprising a translucent substrate (1), on which a translucent electrode (3) is arranged, comprising on the translucent electrode (3) an organic functional layer stack comprising organic functional layers having at least one organic light-emitting layer (5) and comprising a further electrode (7), wherein the at least one organic light-emitting layer (5) comprises emitter molecules having an anisotropic molecular structure which are oriented anisotropically, and wherein all the organic light-emitting layers (5, 51, 52, 53) of the organic light-emitting component are at a distance of greater than or equal to 20 nm and less than or equal to 100 nm from the further electrode (7).

Abstract: An organic light-emitting device and a method for producing an organic light emitting device are disclosed. In an embodiment the device includes a substrate and at least one layer sequence arranged on the substrate and suitable for generating electromagnetic radiation. The at least one layer sequence includes at least one first electrode surface arranged on the substrate, at least one second electrode surface arranged on the first electrode surface and an organic functional layer stack having organic functional layers between the first electrode surface and the second electrode surface. The organic functional layer stack includes at least one organic light-emitting layer, wherein the at least one organic light-emitting layer is configured to emit light, wherein the organic functional layer stack includes at least one inhomogeneity layer, and wherein a thickness of the at least one inhomogeneity layer varies in a lateral direction.