Patents Assigned to OSRAM
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Patent number: 10098227Abstract: A support structure for lighting devices, the support structure includes a ribbon-like support member with electrically conductive lines with mounting locations for electrically powered light radiation sources. The structure includes a sequence of adjacent units having opposed end regions and is severable between mutually facing end regions of adjacent units in the sequence. The units include, at the end regions, at least one electrical connection formation. The electrical connection formation includes a proximal portion electrically coupled to the electrically conductive lines of the respective unit, and a distal portion electrically insulated from the proximal portion. The distal portion is electrically coupled to the distal portion of an electrical connection formation provided in an adjacent unit to the respective unit in the sequence of adjacent units and is separable therefrom by severing the support structure.Type: GrantFiled: April 8, 2016Date of Patent: October 9, 2018Assignee: OSRAM GmbHInventors: Alessio Griffoni, Franco Zanon
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Patent number: 10097265Abstract: Techniques are disclosed for position-based actions using light-based communication (LCom). LCom signals can be used to encode or otherwise provide data which in turn can be used to help determine the position of a device receiving those LCom signals. Therefore, LCom can be used to facilitate various actions based on, for example, the position of an LCom receiver determined using data received via the LCom signals. There are numerous use cases for position-based actions using LCom, such as security applications, check-in applications, payments based on location, permissions, and access to information that can all be tied to a location. Actions may include temporarily disabling or enabling the LCom receiver hardware or software (such as disabling device cameras in high security areas), providing another security layer as a result of knowing the device position, and using the LCom receiver position as a part of a larger process.Type: GrantFiled: March 25, 2015Date of Patent: October 9, 2018Assignee: OSRAM SYLVANIA Inc.Inventors: Anant Aggarwal, Christian Breuer, Barry Stout
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Publication number: 20180284953Abstract: Techniques are disclosed for controlling a remotely programmable light fixture using a mobile computing device in communication with the light fixture via a network. The device is configured to receive an image of an environment that includes the light fixture. Using the received image, the device is configured to generate a graphical user interface (GUI) based on the image. The GUI is configured to define an area of the image for selecting the light fixture. The defined area is associated with the light fixture and is configured to select the light fixture in response to a user input. The GUI is further configured to receive a selection of a light setting for the selected light fixture and transmit an adjustment of the light setting to the selected light fixture via the network.Type: ApplicationFiled: March 28, 2017Publication date: October 4, 2018Applicant: OSRAM SYLVANIA Inc.Inventors: Charles Brunault, Alan Sarkisian
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Publication number: 20180288839Abstract: A constant output current LED driver is disclosed. The driver is capable of operating with a wide range of input direct current (DC) voltage, and is configured with a full bridge inverter, an auxiliary circuit, and a voltage current converter. The full bridge inverter and auxiliary circuit collectively operate to provide a phase shift controller for the LED driver system. The LED driver operates under zero voltage switching (ZVS) for all switches in the LED driver circuit for all of the input voltage levels and for all of the output voltage levels. By maintaining ZVS in all conditions, the system can operate at very high frequency and be compact yet still achieve high power density. The resulting topology is applicable for a wide range of constant output current LED drivers. Switchable loads other than LEDs can also be driven.Type: ApplicationFiled: April 4, 2017Publication date: October 4, 2018Applicant: OSRAM SYLVANIA Inc.Inventor: Alireza Safaee
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Publication number: 20180287026Abstract: An optoelectronic component includes at least one optoelectronic semiconductor chip, wherein the semiconductor chip is arranged on a leadframe section, the leadframe section includes a stiffening structure projecting away laterally from the leadframe section, and the lead-frame section, the stiffening structure and the semiconductor chip are embedded in an electrically insulating housing.Type: ApplicationFiled: October 5, 2016Publication date: October 4, 2018Applicant: OSRAM Opto Semiconductors GmbHInventor: Daniel Richter
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Publication number: 20180285650Abstract: Techniques are disclosed for detecting changes in occupancy as well as the number of occupants within an area. Detection of one or more occupants entering or leaving the area may be accomplished using a sensor having a quantity of pixels. The pixels may be configured to receive thermal energy emitted from one or more objects present in the area, including from one or more occupants. In response to receiving the emitted thermal energy, the sensor may be configured to create thermal images of the area. These thermal images may include a plurality of thermal intensity values associated with one or more pixels of the sensor. Two or more thermal images can be compared to identify a change in thermal intensity values. A change in the occupancy of the area may be determined by based on the identified change in thermal intensity values.Type: ApplicationFiled: March 31, 2017Publication date: October 4, 2018Applicant: OSRAM SYLVANIA Inc.Inventors: Sajin George, Anant Aggarwal, Yang Li, Christian Breuer
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Patent number: 10088116Abstract: A lighting device includes a laminar support member bendable at bending lines extending in a common direction, the bending lines partitioning the laminar support member in a plurality of stripes. The plurality of stripes includes at least one first stripe with electrically-powered light radiation sources therealong and at least one second stripe free from light radiation sources forming a side wing for the at least one first stripe.Type: GrantFiled: May 6, 2016Date of Patent: October 2, 2018Assignee: OSRAM GmbHInventors: Sridharan Venk, Dina Pasqualini, Alessandro Scordino
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Patent number: 10091889Abstract: A process of producing a component includes providing a substrate having an electrically conductive surface in the form of an electrically conductive layer; subdividing the layer with the aid of a laser process into a first electrically autonomous region and a second electrically autonomous region, wherein an electrically insulating region is formed in the electrically conductive layer to electrically separate the electrically autonomous regions; forming an electrical potential difference between the first electrically autonomous region and the second electrically autonomous region; and applying an electrically charged substance or an electrically charged substance mixture onto the first electrically autonomous region and/or the second electrically autonomous region, wherein the electrically autonomous region and/or an amount of the applied electrically charged substance or of the electrically charged substance mixture are adjusted by the electrical potential difference.Type: GrantFiled: May 28, 2013Date of Patent: October 2, 2018Assignee: OSRAM Opto Semiconductors GmbHInventors: Ion Stoll, Matthias Sabathil
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Patent number: 10090198Abstract: Disclosed is a method for separating a substrate (1) along a separation pattern (4), in which method a substrate (1) is provided and an auxiliary layer (3) is applied to the substrate, said layer covering the substrate at least along the separation pattern. The substrate comprising the auxiliary layer is irradiated, such that the material of the auxiliary layer penetrates the substrate along the separation pattern in the form of an impurity. The substrate is broken along the separation pattern. A semiconductor chip (15) is also disclosed.Type: GrantFiled: August 6, 2014Date of Patent: October 2, 2018Assignee: OSRAM Opto Semiconductors GmbHInventor: Mathias Kaempf
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Patent number: 10091890Abstract: A process of producing a component includes providing a substrate having an electrically conductive surface in the form of an electrically conductive layer; subdividing the layer with the aid of a scratching process into a first electrically autonomous region and a second electrically autonomous region, wherein an electrically insulating region is formed in the electrically conductive layer to electrically separate the electrically autonomous regions; forming an electrical potential difference between the first electrically autonomous region and the second electrically autonomous region; and applying an electrically charged substance or an electrically charged substance mixture onto the first electrically autonomous region and/or the second electrically autonomous region, wherein the electrically autonomous region and/or an amount of the applied electrically charged substance or of the electrically charged substance mixture are adjusted by the electrical potential difference.Type: GrantFiled: March 20, 2018Date of Patent: October 2, 2018Assignee: OSRAM Opto Semiconductors GmbHInventors: Ion Stoll, Matthias Sabathil
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Patent number: 10090365Abstract: An organic device is disclosed. In an embodiment the organic device includes an organic component designed to emit and/or detect radiation, wherein the organic component has a first layer stack and a radiation passage surface and an organic protection diode having a second layer stack, wherein the organic protection diode is arranged directly after the organic component in a stacking direction (Z), and wherein the organic protection diode is designed to protect the organic component from an electrostatic discharge and/or from a polarity reversal of the organic component.Type: GrantFiled: September 9, 2015Date of Patent: October 2, 2018Assignee: OSRAM OLED GMBHInventors: Arndt Jaeger, Tobias Pohl-Zander, Arne Fleissner
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Publication number: 20180274750Abstract: Metalenses and technologies incorporating the same are disclosed. In some embodiments, the metalenses are in the form of a hybrid multiregion collimating metalens that includes a first region and a second region, wherein the hybrid multiregion collimating metalens is configured to collimate (e.g., visible) light incident thereon. In some instances the first region includes an array of first unit cells that contain subwavelength spaced nanostructures, such that the first region functions as a subwavelength high contrast grating (SWHCG), whereas the second region includes an array of second unit cell, wherein the array of second unit cells includes a near periodic annular arrangement of nanostructures such that the second region approximates the functionality of a locally periodic radial diffraction grating. Lighting devices including such metalenses are also disclosed.Type: ApplicationFiled: March 15, 2018Publication date: September 27, 2018Applicants: Osram Sylvania Inc., President and Fellows of Harvard CollegeInventors: Steve Byrnes, Francesco Aieta, Federico Capasso, Alan Lenef
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Patent number: 10084158Abstract: The invention relates to an optoelectronic component (100) comprising an organic light emitting diode (1) designed for emitting radiation and/or heat, a substrate (2), on which the organic light emitting diode is arranged, wherein the substrate (2) comprises a first substrate material (21) and at least one substrate cavity (22) which is filled with a second substrate material (23) different than the first substrate material (21), wherein the second substrate material (23) is designed to dissipate the heat emitted by the organic light emitting diode (1).Type: GrantFiled: May 20, 2016Date of Patent: September 25, 2018Assignee: OSRAM OLED GmbHInventors: Evelyn Trummer-Sailer, Simon Schicktanz, Tobias Pohl-Zander
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Patent number: 10082270Abstract: A light-emitting module including a light-emitting component and a resilient body is provided. The light-emitting component includes a light-emitting layer structure for generating light and includes a light-emitting main face through which the generated light leaves the light-emitting component. The resilient body, which is arranged over the light-emitting main face, is connected firmly to the light-emitting component, includes at least one light-deviating region, and includes a free-lying surface which includes at least one surface element, which lies at a distance greater than or equal to 4 mm from the light-emitting layer structure.Type: GrantFiled: September 22, 2015Date of Patent: September 25, 2018Assignee: OSRAM OLED GMBHInventors: Thomas Wehlus, Daniel Riedel, Nina Riegel, Silke Scharner, Johannes Rosenberger, Arne Fleissner
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Publication number: 20180269117Abstract: A method for producing an optoelectronic device is disclosed. The method include preforming an inductive excitation of a current by an inductive component of the optoelectronic device such that the optoelectronic device emits electromagnetic radiation, measuring of at least one electro-optical characteristic of the optoelectronic device and applying a converter material to an emission side of the optoelectronic device, wherein a quantity of the converter material is determined from the measurement of the electro-optical characteristic.Type: ApplicationFiled: September 15, 2016Publication date: September 20, 2018Applicants: OSRAM Opto Semiconductors GmbH, OSRAM Opto Semiconductors GmbHInventors: Robert Schulz, Christian Leirer, Korbinian Perzlmaier
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Patent number: 10079223Abstract: A conductive pathway mounted on an electrically insulating sheet having an upper face and an opposed lower face, said sheet having a plurality of pairs of apertures; a plurality of electrically conductive clips, each clip being separated spatially from an adjacent said clip; each electrically conductive clip comprising a first body portion and first and second depending legs defining a sheet-receiving recess therebetween, said first body portion being disposed in contacting relation with said upper face of said sheet and said legs being disposed in contacting relation with said lower face of said sheet; each leg of one of said electrically conductive clips extending through one of said apertures of a pair of said apertures from said upper face to said lower face; and a plurality of electrical components each mounted in conductive relationship to two adjacent said conductive clips and bridging said insulating sheet.Type: GrantFiled: November 17, 2016Date of Patent: September 18, 2018Assignee: OSRAM SYLVANIA Inc.Inventors: Richard Speer, Kenneth Grossman
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Patent number: 10079329Abstract: According to the present disclosure, optoelectronic semiconductor chip includes at least one n-doped semiconductor layer, at least one p-doped semiconductor layer and one active layer arranged between the at least one n-doped semiconductor layer and the at least one p-doped semiconductor layer. The p-doped semiconductor layer is electrically contacted by means of a first metallic connection layer, and a reflection-enhancing dielectric layer sequence is arranged between the p-doped semiconductor layer and the first connection layer, which dielectric layer sequence includes a plurality of dielectric layers with different refractive indices.Type: GrantFiled: October 20, 2015Date of Patent: September 18, 2018Assignee: OSRAM OPTO Semiconductors GmbHInventors: Fabian Kopp, Christian Eichinger, Korbinian Perzlmaier
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Publication number: 20180261648Abstract: An optoelectronic semiconductor component is specified that has a semiconductor chip having a main side, the main side comprising a plurality of emission fields that are arranged next to one another. The emission fields are individually and independently actuatable and, during operation, they are each used to couple radiation out of the semiconductor chip. The main side has reflective partitions mounted on it that are arranged between adjacent emission fields and at least partially surround the emission fields in a plan view of the main side. In addition, the main side has a conversion element mounted on it, having an underside, which faces the semiconductor chip, and an averted top. The partitions are formed from a different material from the semiconductor material of the semiconductor chip and jut out from the semiconductor chip in a direction away from the main side.Type: ApplicationFiled: December 2, 2015Publication date: September 13, 2018Applicant: OSRAM Opto Semiconductors GmbHInventors: Britta Göötz, Walter Wegleiter, Stefan Grötsch
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Publication number: 20180261735Abstract: A radiation-emitting optoelectronic semiconductor component and a method for producing the same are disclosed. In an embodiment the semiconductor component includes a radiation passage surface, through which light produced during the operation of the semiconductor component passes, a first barrier layer arranged on a top side of the radiation passage surface and in direct contact with the radiation passage surface, a conversion element arranged on the top side of the first barrier layer, a second barrier layer arranged on the top side of the conversion element and on the top side of the first barrier layer, wherein the first barrier layer and the second barrier layer together completely enclose the conversion element, and wherein the first barrier layer and the second barrier layer are in direct contact with each other at some points.Type: ApplicationFiled: December 1, 2015Publication date: September 13, 2018Applicant: OSRAM Opto Semiconductors GmbHInventors: Thomas SCHWARZ, Frank SINGER, Stefan ILLEK, Michael ZIZLSPERGER, Britta GÖÖTZ
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Publication number: 20180261734Abstract: A method for producing optoelectronic devices and a surface-mountable optoelectronic device are disclosed. In an embodiment the method includes applying semiconductor chips laterally adjacent one another on a carrier, wherein contact sides of the chips face the carrier, and wherein each semiconductor chip comprises contact elements for external electrical contacting which are arranged on the contact side of the semiconductor chip and applying an electrically conductive layer on at least sub-regions of the sides of the semiconductor chips not covered by the carrier, wherein the electrically conductive layer is formed contiguously, and wherein protective elements prevent direct contact of the contact elements with the electrically conductive layer. The method further includes electrophoretically depositing a converter layer on the electrically conductive layer and removing the electrically conductive layer from regions between the converter layer and the semiconductor chips.Type: ApplicationFiled: May 11, 2016Publication date: September 13, 2018Applicants: OSRAM Opto Semiconductors GmbH, OSRAM Opto Semiconductors GmbHInventors: Siegfried Herrmann, Ion Stoll, Georg Roßbach