Abstract: What is specified is a method for producing a layer structure (10) as a buffer layer of a semiconductor component, said method comprising the following steps: a) provision of a carrier (1), which has a silicon surface (1a), b) deposition of a first layer sequence (2), which comprises a seeding layer (21) containing aluminum and nitrogen, on the silicon surface (1a) of the carrier (1) along a stacking direction (H) running perpendicular to a main plane of extent of the carrier (1), c) three-dimensional growth of a 3D-GaN layer (3), which is formed with gallium nitride, on a top surface (2a) of the first layer sequence (2) which is remote from the silicon surface (1a), d) two-dimensional growth of a 2D-GaN layer (4), which is formed with gallium nitride, on the outer surfaces (3a) of the 3D-GaN layer (3) which are remote from the silicon surface (1a).

Abstract: A light-emitting element includes at least one flat light emitter having a first electrical contact portion formed on a side surface, and a housing partially surrounding the side surface of the flat light emitter, the housing including a second electrical contact portion formed on an inner surface of the housing and configured to mate with the first electrical contact portion.

Abstract: The invention relates to an organic optoelectronic component comprising a substrate (101) on which a first electrode (102), then an organic functional layer stack (103) having at least one organic optoelectronic layer, and then a second electrode (104) are successively arranged. A thin film encapsulation (107) is arranged over the second electrode (104) and in addition to the second electrode (104), at least one first intermediate layer (121) having a hardness which is different from the layer which is directly adjacent thereto is arranged between the organic functional layer stack (103) and the thin-film encapsulation (107).

Abstract: A light-emitting device includes a carrier, an organic layer sequence arranged on the carrier and having at least one emitter layer containing a light-emitting material configured to emit light of a first wavelength range, a first electrode and a second electrode, and a multiplicity of nanostructures, wherein the nanostructures have a refractive index smaller than a refractive index of the light-emitting material of the emitter layer and at least some of the nanostructures project into the emitter layer or pierce through the emitter layer.

Abstract: A method of processing an optoelectronic component includes a light source having at least one luminous area formed by one or a plurality of light emitting diodes and a receptacle device that receives the light source, including determining a deviation of an actual position of the light source at the receptacle device from a desired position of the light source at the receptacle device, and forming at least one marking at the receptacle device that indicates the deviation.

Abstract: An electronic device and a method for producing an electronic device are disclosed. In an embodiment the electronic device includes a first component and a second component and a sinter layer connecting the first component to the second component, the sinter layer comprising a first metal, wherein at least one of the components comprises at least one contact layer which is arranged in direct contact with the sinter layer, which comprises a second metal different from the first metal and which is free of gold.

Abstract: In various embodiments, a lamp is provided. The lamp may include two mutually opposite end sections, which each form an electrical contact of the lamp. In each case at least one semiconductor light source is arranged in the region of the end sections. The lamp has an operating apparatus for the semiconductor light sources. The operating apparatus has electrical components, which are arranged in the region of a first section of the lamp, and the operating apparatus has at least one further electrical component, which is arranged in the region of the second end section of the lamp.

Abstract: An optoelectronic component may include a first electrode having one outer electrode segment formed at a lateral edge of the first electrode, and one inner electrode segment formed apart from the lateral edge of the first electrode, an electrically conductive current distribution structure formed above the first electrode and having one outer substructure extending over the outer electrode segment, and one inner substructure extending over the inner electrode segment and electrically insulated from the outer substructure, one current lead extending from the lateral edge of the first electrode toward the inner substructure, electrically coupled to the inner substructure, electrically insulated from the outer substructure and which structure corresponds to the current distribution structure, an insulation structure, which covers the current distribution structure and the current lead, an organic functional layer structure, and a second electrode above the organic functional layer structure.

Abstract: A semiconductor illuminating device is disclosed. The device includes an LED configured for emitting blue primary radiation and an LED phosphor arranged and configured such that it emits secondary light that forms at least one component of the illumination light, wherein the LED phosphor comprises a red phosphor for emitting red light as a component of the secondary light and a green phosphor for emitting green light as a component of the secondary light, wherein the green light has a color point located above a first straight line having a slope m1 and a y-intercept n1 in a CIE standard chromaticity diagram, with the slope m1=1.189 and the y-intercept n1=0.226, and wherein the components of the illumination light are at such a ratio to one another that the illumination light has a color temperature of at most 5500 K.

Abstract: In various embodiments, an electronic operating device for light sources is provided. The electronic operating device may include an input part for inputting an input voltage and an output part for outputting an output voltage and an output current for the light sources. The electronic operating device is configured to operate the output part as a voltage source for a period of time after the input voltage has been applied, and subsequently to operate the output part as a current source after this period of time.

Abstract: A connector release tool (100) includes a shaft (102) having a proximal end (104) defining a handle (106) and an operative distal end (108) defining a shroud portion (110). The shroud portion (110) includes sidewalls (112) extending away from the distal end (108) and terminating at a datum surface (114) and a channel (116) defined therebetween. The shroud portion (110) further includes a plurality of contact pins (118) extending away from the distal end (108) and into the channel (116) of the shroud portion (110), each contact pin (118) adapted to engage an associated push-button connector of a terminal block (20) and allow removal of one or more wires (24) coupled to the terminal block (20).

Abstract: A connected lighting fixture network system has a plurality of multi-channel lighting fixtures that communicate over a network. Each lighting fixture (device) may access a plurality of services that reside within an application layer of the device, or on a server accessible to the device. A controller is coupled to the device and configured to send query and command messages to the device and to receive reply messages from the device. A query message from the controller can request information about the device. In response to receiving the reply message, the controller can generate a command message and send the command message to the device. The services available to the device may include network discovery, device health, device status, software versioning, and lighting command and control.

Abstract: A connected lighting fixture network system has a plurality of multi-channel lighting fixtures. Each lighting fixture (device) has a plurality of services that reside within an application layer of the device. A controller is coupled to the device and configured to send query and command message to the device and to receive reply messages from the device. One service available to the device is a lighting command and control service. The device is configured to receive a query message from the controller. The controller is configured to generate a lighting control and command message, which can include a channel illumination field (CIF) and an illumination payload. The CIF indicates the channels of the device to be commanded based on the status of the channels received in the first reply message. The illumination payload indicates the intended illumination level for the corresponding channel.

Abstract: Metalenses and technologies incorporating the same are disclosed. In some embodiments, the metalenses are in the form of a hybrid multiregion collimating metalens that includes a first region and a second region, wherein the hybrid multiregion collimating metalens is configured to collimate (e.g., visible) light incident thereon. In some instances the first region includes an array of first unit cells that contain subwavelength spaced nanostructures, such that the first region functions as a subwavelength high contrast grating (SWHCG), whereas the second region includes an array of second unit cell, wherein the array of second unit cells includes a near periodic annular arrangement of nanostructures such that the second region approximates the functionality of a locally periodic radial diffraction grating. Lighting devices including such metalenses are also disclosed.

Abstract: In at least one embodiment, the semiconductor layering sequence (1) is designed for generating light and comprises semiconductor columns (2). The semiconductor columns (2) have a respective core (21) made of a semiconductor material of a first conductivity type, and a core shell (23) surrounding the core (21) made of a semiconductor material of a second conductivity type. There is an active zone (22) between the core (21) and the core shell (23) for generating a primary radiation by means of electroluminescence. A respective conversion shell (4) is placed onto the semiconductor columns (2), which conversion shell at least partially interlockingly surrounds the corresponding core shell (23), and which at least partially absorbs the primary radiation and converts same into a secondary radiation of a longer wavelength by means of photoluminescence. The conversion shells (4) which are applied to adjacent semiconductor columns (2), only incompletely fill an intermediate space between the semiconductor columns (2).

Abstract: Techniques are disclosed for making a flexible laminated circuit board using a metal conductor onto which a SMD may be attached. Conductive metal strips may be laminated to form a flexible substrate and the metal strips may then be perforated for the placement of LED package leads. The LED packages may be attached to the conductive strips using solder or a conductive epoxy and the upper laminate layer may include perforations exposing portions of the metal strips for the attachment of the LED packages. Alternatively, strings of LED packages may be fabricated by attaching LED packages to conductive strips and these strings may be laminated between flexible sheets to form a laminated LED circuit. Plastic housings may aid in attaching the LED packages to the conductive strips. The plastic housings and/or the laminate sheets may be made of a reflective material.

Abstract: A surface-mountable optoelectronic semiconductor component is specified. The surface-mountable optoelectronic semiconductor component includes an optoelectronic semiconductor chip, a radiation-transmissive growth substrate, a housing body and an electrically conductive connection. The housing body is arranged at least in places between a side surface of the growth substrate and the electrically conductive connection. The housing body completely covers all of the side surfaces of the growth substrate, and the housing body has, on a surface facing away from the side surface of the growth substrate, traces of material removal or traces of a form tool.

Abstract: A lighting device includes a light source, a reflector having an ellipsoidal reflection surface, an aspherical lens, and an exit pupil. The source is arranged at a first focal point of the reflection surface and a part of the emitted light is reflected from the reflection surface in the direction of a second focal point. The pupil is arranged offset with respect to the second focal point. The lens is arranged between the reflection surface and the pupil in a beam path with the reflected light and is shaped such that a first part of the reflected light passes through the lens with an aperture angle altered by not more than 5° in a central region and passes through the pupil and a second part of the reflected light penetrates through the lens in an outer region and is deflected by the lens and is consequently guided through the pupil.

Abstract: A lighting device provides a lighting unit for emitting useful light and a sensor. The unit includes a laser diode for emitting pump radiation and a phosphor element, which during operation is irradiated by the laser diode and thereby excited and serves for converting the pump radiation into conversion light, which conversion light at least proportionally forms the useful light. The sensor monitors the pump radiation conversion and at the same time detects a conversion light intensity, and is arranged with respect to the phosphor element of the unit so that a portion of the useful light and a measurement portion of the conversion light is incident on the sensor. The lighting device operates so that the phosphor element at least at times is irradiated in a pulsed manner and thereby excited so that between two pulses the conversion light intensity detected by the sensor decreases by at least 10%.

Abstract: A method can be used for measuring at least one optoelectronic component arranged on a connection carrier. The method includes exciting an electromagnetic oscillating circuit, which is formed by the optoelectronic component and the connection carrier, thus exciting the optoelectronic component in such a way that the optoelectronic component emits electromagnetic radiation, and measuring at least one electro-optical property of the optoelectronic component.