Abstract: A method for inspecting an object and detecting defects is taught (BGA and Flip-Chip solder joints on a PCB particularly). The method comprises injecting a thermal stimulation on the object; capturing a sequence of consecutive infrared images of the object to record heat diffusion resulting from the heat pulse; comparing the heat diffusion on said object to a reference; and determining whether the object comprises any defects. Also described is a system comprising a mounting for mounting the object; a thermal stimulation module for applying a thermal stimulation to the bottom surface of the object; an infrared camera for capturing infrared images of the object on the top surface of the object to record a change in infrared radiation from the top surface resulting from the thermal stimulation; and a computer for comparing the change in infrared radiation within a region on the top surface to a reference and determining whether the object comprises any defects.

Abstract: A method and apparatus for optically inspecting a display employs sub-pixel accuracy for each primary color to take into account angle of rotation. The method includes capturing images of a display with R×S sensors; determining sets of sensor coordinates mapping to a pixel, determining multiple misalignment angles between the pixel on the display and the R×S sensors, determining multiple x scaling ratios, determining multiple weighting factors associated with R×S sensors in response to the corresponding multiple misalignment angle and the corresponding multiple x and y scaling ratios, determining multiple luminance values for R×S sensors, determining multiple total luminance values in response to the weighting factors and the luminance values, forming scaled images including first and second luminance values, and inspecting the scaled image to identify potential defects of the pixel on the display.

Abstract: In an inspection system for planar objects having periodic structures, programmable optical Fourier filtering in the focal plane of a telecentric lens system is used to directly identify physical phenomena indicative of non-periodic defects. Lens assemblies and a coherent optical source are used to generate and observe a spatial Fourier transform of a periodic structure in the Fourier plane. Optical Fourier filtering (OFF) is performed in the focal plane using an electrically programmable and electrically alignable spatial light modulator. The spatial light modulator with high signal to noise ratio is electrically reconfigurable according to a feedback-driven, filter construction and alignment algorithm. The OFF enhances any non-periodic components present in the Fourier plane and final image plane of the object. A system having a plurality of inspection channels provides high-throughput inspection of objects with small non-periodic defects while maintaining high detection sensitivity.

Abstract: A concurrent low resolution/high resolution parallel scanning system and method are provided as an improvement in the scanning process of an inspection system for planar objects, such as large flat plates employed in panel displays, whereby lower resolution defect detection efficiently overlaps and parallels higher resolution defect review and classification stages in which defects are automatically defined and resolved. Although the invention is a valid solution for the more general problem of optically inspecting the surface of a flat article for defects, the invention is particularly useful for detecting pattern defects on large glass plates deposited with integrated-circuits for forming LCD flat panel displays.

Abstract: A mechanical system for handling large and thin glass plates of dimensions as much as 2 m by 2 m by 0.5 mm, such as used to manufacture LCD panels in LCD panel testers, provides for positioning of the repair and inspection equipment by using lightweight hollow chucklets in air-bearing and vacuum contact with the glass plate under test, balanced on a rail along the center of mass for translation without warping. The elimination of a heavy rigid platform results in significantly reduced hardware costs, flexibility in processing and improved positioning performance.

Abstract: A concurrent low resolution/high resolution parallel scanning system is provided as an improvement in the scanning process of an inspection system for planar objects, such as large flat plates employed in panel displays, whereby lower resolution defect detection efficiently overlaps and parallels higher resolution defect review and classification stages in which defects are automatically defined and resolved. Although the invention is a valid solution for the more general problem of optically inspecting the surface of a flat article for defects, the invention is particularly useful for detecting pattern defects on large glass plates deposited with integrated-circuits for forming LCD flat panel displays.

Abstract: A method for inspecting an object and detecting defects is taught (BGA and Flip-Chip solder joints on a PCB particularly). The method comprises injecting a thermal stimulation on the object; capturing a sequence of consecutive infrared images of the object to record heat diffusion resulting from the heat pulse; comparing the heat diffusion on said object to a reference; and determining whether the object comprises any defects. Also described is a system comprising a mounting for mounting the object; a thermal stimulation module for applying a thermal stimulation to the bottom surface of the object; an infrared camera for capturing infrared images of the object on the top surface of the object to record a change in infrared radiation from the top surface resulting from the thermal stimulation; and a computer for comparing the change in infrared radiation within a region on the top surface to a reference and determining whether the object comprises any defects.

Abstract: There is described an infrared (IR) verification system comprising an IR imaging system for capturing thermal signatures, an IR image comparison engine to determine whether a fault exists, a database for thermal failure patterns of printed circuit board assemblies (PCBA) and their proposed diagnosis, and a correlation module to correlate the failure pattern to the database. There is also described a method for using the described system.

Abstract: There is described an inspection system for inspecting an object, the system comprising: a structural inspection module for inspecting the object structurally; a functional test module for testing the object functionally; a support device for supporting the object to be inspected structurally and tested functionally; and a common controller for the structural inspection module and the functional test module. A method for use with the system is also described.

Abstract: A color optical inspection system extracts only such luma and chroma spatial features as are necessary for detection of defects related to the physical characteristics of devices populating the surface of a board. During the training phase, the features of each device present on each of a number of golden boards is extracted and compared against a set of established criteria, thereby to select one or more spatial features to be extracted for the associated devices during the inspection phase. A match region whose boundaries are defined by the selected features of the devices on the golden boards is established during the training phase. During the inspection phase, the selected features of each associated device are extracted to determine whether they fall inside the match region. If the extracted features falls outside the corresponding match region, then a defect is reported.

Abstract: A method for inspecting a display panel includes capturing images of a portion of a plurality of display panels having display elements with an image acquisition device having sensor elements, each image comprising an image of approximately a first number of display elements captured with approximately a second number of sensor elements, the first number different from the second number, each image including a Moiré artifact pattern, combining the images of the portion of the plurality of display panels to form a reference image including a Moiré artifact pattern reference, capturing a sample image of a portion of a sample display panel having display elements with the image acquisition device, the sample image comprising an image of approximately the first number of display elements on the sample display captured with approximately the second number of sensor elements, the sample image including a sample Moiré artifact pattern, combining the sample image with the reference image to inhib

Abstract: Inspection systems with rho-theata x-ray source motion for inspection of populated printed circuit boards and the like. The inspection systems include a transport system for transporting articles to be inspected into and out of the inspection system. An x-ray source is mounted on a first radial translation system adjacent one side of the article to be inspected for translation along an axis parallel to the article to be inspected. The first translation system is rotatably mounted about an axis perpendicular to the article to be inspected so that the x-ray source may be positioned and moved anywhere within an area by proper coordination of the angle of rotation of the rotary transport system and the translational position of the first translational system. The exemplary embodiment disclosed also includes a second translational system supported on the first translational system for movement of the x-ray source in a direction parallel to the axis of rotation of the rotary transport system.

Abstract: An improved method and resulting device 10 for fabricating an electro-optical modulator material. The technique includes providing a substrate 509, which has a top surface. A first layer of electrode material 501 is defined overlying the top surface. The method also includes applying a transfer sheet 400, having an electro-optical material 405, to the first layer of electrode material 501, where the electro-optical material is affixed to the first layer of electrode material. A step of removing (e.g., peeling) 801 the transfer sheet from the electro-optical material is included. The removing step leaves a substantial portion of the electro-optical modulator material intact and affixed to the first layer of electrode material. This method generally uses less steps and provides a higher quality element than pre-existing techniques.

Abstract: A method for locating blobs in an image, includes the steps of: forming a blob reference mask from the image, the blob reference mask including a portion indicating a portion of the image containing a first blob, if any, and forming a reference image from the image, the reference image corresponding to the image. The method also includes the steps of forming a modified image from the image by replacing the portion of the image containing the first blob, if any, with a portion of the reference image corresponding to the portion of the image, and locating a second blob in the image in response to the modified image.

Abstract: A technique for fabricating an electro-optic modulator material 1009 onto a transfer substrate 1001. The technique includes a method, which provides a first transfer substrate 1001. The method includes a step of forming an electro-optic material 1009 onto a surface of the first transfer substrate 1001 to attach the electro-optic material 1009 to the first transfer substrate 1001. A step of applying or forming a second transfer substrate 1008 overlying the electro-optic material 1009 is included. The second transfer substrate 1008 is attached using an adhesive to the electro-optic material at lower strength than the attachment of the first transfer substrate to the electro-optic material. To use the electro-optic material, a step of removing 1017 the second transfer substrate 1008 from the electro-optic modulator material 1009, which leaves the electro-optic material substantially affixed to the first transfer material, is also included.

Abstract: A technique including a method 300, 400 and apparatus 200 for repairing a color filter assembly 1 for a flat panel display using a high intensity light source means. The technique provides a color filter assembly having an anomaly. The technique uses a step of directing a high intensity light source 203 through an aperture opening at the anomaly to selectively ablate a portion of the anomaly. These features remove the portion of the anomaly while preventing a possibility of substantial damage to other portions of the color filter assembly surrounding the anomaly.

Abstract: A method and apparatus for identifying and classifying pixel defects, and in particular Mura defects using digital processing techniques. The present method includes steps of acquiring an image with a Mura defect, and performing a Laplacian convolution on the image to enhance the Mura defect against background illumination. A step of thresholding the Mura defect against the background illumination is also provided. The thresholded Mura defect is compared against the original Mura defect to define statistical parameters of the original Mura defect. An annular region is defined around the periphery of the Mura defect. Statistics of the annular region defines statistics for background illumination as compared to the original Mura defect. The statistics from the Mura defect are then compared to the background illumination statistics for Mura defect classification and analysis.

Abstract: A method and resulting system for directing generally collimated illumination from a source at an oblique angle to a surface under inspection (SUS) to produce scattered nonspecular energy substantially normal to the SUS and for observing the scattered nonspecular energy in one of a plurality of fractional windows of a viewed image of the SUS via a plurality of focussing elements. Such arrangement results in simultaneous and significant throughput and sensitivity enhancement over existing art. The method can be enhanced further wherein the observing step is performed through suitable relative motion of the scattering image over the imaging plane to permit over sampling. Furthermore, the DMT is significantly simplified because imaging is utilized to electronically scan the wafer instead of using opto-mechanical scanning means. Imaging sensors with an aggregate 2000.times.2000 pixel resolution could image a 200 mm wafer to 100 microns pitch.

Abstract: A method (500) for inspecting anomalies, which are likely defects of several types, namely, particles on the surface, scratches into surface, and defects in bulk material, is provided. This inspection method involves two types of illumination, which can be used separately or together. These two types highlight anomalies sufficiently differently to enable the defect monitoring tool to distinguish between defect type and defect location along an inspection axis. The illumination methods are direct internal side illumination (114) where the plate is used as light pipe, and external front-side illumination (117). In direct internal side illumination, a fiber optic feed (115) with flared end arranged as a line source is abutted to an edge (123) of the plate (102). In external side illumination, the source is light directed at an acute angle, preferably a grazing angle, to one of the surfaces (121).

Abstract: Final testing of an LCD panel or the like is performed after preliminary testing for short circuit defects. During final testing, the panel is exposed to signals at the shorting bars and the resulting display pattern is imaged. The resulting image data then is processed at a computer system to determine whether the resulting display pattern differs from an expected display pattern. If differences are present then an open circuit or pixel defect is present. The applied test signals and the pattern or differences determine the type of defect present. For an open circuit defect along a gate line, a partial row (column) of the resulting display pattern does not activate. For an open circuit along a drive line, a partial column (row) of the resulting display does not activate. Pixel shorts are identified by applying test signals to the shorting bars during a first test cycle, then imaging the display during a second test cycle after at least one of the test signals is removed.