Abstract: Inspection systems with rho-theata x-ray source motion for inspection of populated printed circuit boards and the like. The inspection systems include a transport system for transporting articles to be inspected into and out of the inspection system. An x-ray source is mounted on a first radial translation system adjacent one side of the article to be inspected for translation along an axis parallel to the article to be inspected. The first translation system is rotatably mounted about an axis perpendicular to the article to be inspected so that the x-ray source may be positioned and moved anywhere within an area by proper coordination of the angle of rotation of the rotary transport system and the translational position of the first translational system. The exemplary embodiment disclosed also includes a second translational system supported on the first translational system for movement of the x-ray source in a direction parallel to the axis of rotation of the rotary transport system.

Abstract: An improved method and resulting device 10 for fabricating an electro-optical modulator material. The technique includes providing a substrate 509, which has a top surface. A first layer of electrode material 501 is defined overlying the top surface. The method also includes applying a transfer sheet 400, having an electro-optical material 405, to the first layer of electrode material 501, where the electro-optical material is affixed to the first layer of electrode material. A step of removing (e.g., peeling) 801 the transfer sheet from the electro-optical material is included. The removing step leaves a substantial portion of the electro-optical modulator material intact and affixed to the first layer of electrode material. This method generally uses less steps and provides a higher quality element than pre-existing techniques.

Abstract: A method for locating blobs in an image, includes the steps of: forming a blob reference mask from the image, the blob reference mask including a portion indicating a portion of the image containing a first blob, if any, and forming a reference image from the image, the reference image corresponding to the image. The method also includes the steps of forming a modified image from the image by replacing the portion of the image containing the first blob, if any, with a portion of the reference image corresponding to the portion of the image, and locating a second blob in the image in response to the modified image.

Abstract: A technique for fabricating an electro-optic modulator material 1009 onto a transfer substrate 1001. The technique includes a method, which provides a first transfer substrate 1001. The method includes a step of forming an electro-optic material 1009 onto a surface of the first transfer substrate 1001 to attach the electro-optic material 1009 to the first transfer substrate 1001. A step of applying or forming a second transfer substrate 1008 overlying the electro-optic material 1009 is included. The second transfer substrate 1008 is attached using an adhesive to the electro-optic material at lower strength than the attachment of the first transfer substrate to the electro-optic material. To use the electro-optic material, a step of removing 1017 the second transfer substrate 1008 from the electro-optic modulator material 1009, which leaves the electro-optic material substantially affixed to the first transfer material, is also included.

Abstract: A technique including a method 300, 400 and apparatus 200 for repairing a color filter assembly 1 for a flat panel display using a high intensity light source means. The technique provides a color filter assembly having an anomaly. The technique uses a step of directing a high intensity light source 203 through an aperture opening at the anomaly to selectively ablate a portion of the anomaly. These features remove the portion of the anomaly while preventing a possibility of substantial damage to other portions of the color filter assembly surrounding the anomaly.

Abstract: A method and apparatus for identifying and classifying pixel defects, and in particular Mura defects using digital processing techniques. The present method includes steps of acquiring an image with a Mura defect, and performing a Laplacian convolution on the image to enhance the Mura defect against background illumination. A step of thresholding the Mura defect against the background illumination is also provided. The thresholded Mura defect is compared against the original Mura defect to define statistical parameters of the original Mura defect. An annular region is defined around the periphery of the Mura defect. Statistics of the annular region defines statistics for background illumination as compared to the original Mura defect. The statistics from the Mura defect are then compared to the background illumination statistics for Mura defect classification and analysis.

Abstract: A method and resulting system for directing generally collimated illumination from a source at an oblique angle to a surface under inspection (SUS) to produce scattered nonspecular energy substantially normal to the SUS and for observing the scattered nonspecular energy in one of a plurality of fractional windows of a viewed image of the SUS via a plurality of focussing elements. Such arrangement results in simultaneous and significant throughput and sensitivity enhancement over existing art. The method can be enhanced further wherein the observing step is performed through suitable relative motion of the scattering image over the imaging plane to permit over sampling. Furthermore, the DMT is significantly simplified because imaging is utilized to electronically scan the wafer instead of using opto-mechanical scanning means. Imaging sensors with an aggregate 2000.times.2000 pixel resolution could image a 200 mm wafer to 100 microns pitch.

Abstract: A method (500) for inspecting anomalies, which are likely defects of several types, namely, particles on the surface, scratches into surface, and defects in bulk material, is provided. This inspection method involves two types of illumination, which can be used separately or together. These two types highlight anomalies sufficiently differently to enable the defect monitoring tool to distinguish between defect type and defect location along an inspection axis. The illumination methods are direct internal side illumination (114) where the plate is used as light pipe, and external front-side illumination (117). In direct internal side illumination, a fiber optic feed (115) with flared end arranged as a line source is abutted to an edge (123) of the plate (102). In external side illumination, the source is light directed at an acute angle, preferably a grazing angle, to one of the surfaces (121).

Abstract: An improved testing system and method for testing a flat-panel display is disclosed herein. A display is positioned under a high resolution camera for detection of, for example, brightness uniformity across the display. Errors in the detected image due to aliasing are avoided in the present invention by incrementally shifting the displayed image relative to the camera and detecting the displayed image at various shifted positions. A resulting accurate display can then be reconstructed by identifying those detector pixels generating a maximum signal. A single image may then be reconstructed using only those detected maximum pixel signals. The reconstructed image will be free of aliasing. The reconstructed image may then be analyzed electronically, and any anomalies in the pixels forming the display panel can then be accurately detected.

Abstract: A method for inspecting a substrate having a plurality of output pixels using an image sensing device having a plurality of input pixels includes the steps of capturing an input image of a plurality of groups of output pixels with a plurality of groups of input pixels, each group of input pixels capturing a group of output pixels, each input pixel in a group of input pixels having a position, inhibiting modulation contributions from input pixels in the input image, forming a plurality of images from the plurality of groups of input pixels in the input image, each image including input pixels from a similar position in each group of input pixels, detecting defects in each of the plurality of images, and determining defects in sub-pixels of the substrate in response to the defects detected in each of the plurality of images.

Abstract: A method and resulting system for directing generally collimated illumination from a source at an oblique angle to a surface under inspection (SUS) to produce scattered nonspecular energy substantially normal to the SUS and for observing the scattered nonspecular energy in one of a plurality of fractional windows of a viewed image of the SUS via a plurality of focussing elements. Such arrangement results in simultaneous and significant throughput and sensitivity enhancement over existing art. The method can be enhanced further wherein the observing step is performed through suitable relative motion of the scattering image over the imaging plane to permit over sampling. Furthermore, the DMT is significantly simplified because imaging is utilized to electronically scan the wafer instead of using opto-mechanical scanning means. Imaging sensors with an aggregate 2000.times.2000 pixel resolution could image a 200 mm wafer to 100 microns pitch.

Abstract: The present invention provides an electro-optical element and its manufacturing method ideal for use in defect inspection devices for liquid crystal display substrates used in liquid crystal display panels. The electro-optical element of this invention possesses an electro-optical element, dielectric reflective film, transparent electrode, and transparent supporting substrate. These are united together by adhering the dielectric reflective film and transparent electrode edge to the electro-optical element. The electro-optical element is manufactured by consecutively affixing the transparent sheet with the transparent electrode, the electro-optical element, and transparent film with the dielectric reflective film to the transparent supporting substrate.

Abstract: An array of circuit elements which when excited produces voltages is analyzed by examining successive voltage images produced by the circuit elements. Specifically, the array of circuit elements is repeatedly excited at high speed while the voltage image produced by the array is electro-optically sampled at a succession of clock times using a relatively slow-speed electro-optic image sampling technique using a burst clock, thereby to capture a succession of voltage images. The successive voltage images can be viewed on a display device directly individually, or they can be processed by an image processor which compares the successive voltage images with stored representations of voltage images to yield information regarding the condition of the array. Maximum permissible device operating speed can also be determined without examination of individual cells.

Abstract: An elastic member is wrapped with wire or a wire mesh to provide uniform electrical contact with a substrate. The elastic member is compressible, allowing pressure to be applied, and a firmer contact established without damaging the contact points on the substrate.

Abstract: A method for testing liquid crystal display substrates with use of a testing apparatus which includes an electro-optical element. The test protocol includes applying a voltage between the circuitry on the liquid crystal display and the electro-optical element, irradiating the electro-optical element, evaluating performance under a variety of voltage conditions, and evaluating the corresponding response characteristics of the electro-optical element. The response characteristics are recorded by a plurality of CCD devices, each recording a different section of the panel. The changes in the magnitude of impressed voltage and polarity are synchronized with the recording timing. The recorded data is stored as frame memory which is subjected to frame by frame analysis to obtain quantitative information regarding the status of defective pixels.

Abstract: Construction defects in liquid crystal display base plates are detected by placing an electro-optical element, in which the optical properties change when an electric field is applied thereto, over and facing a liquid crystal display base plate, energizing the leads of said display base plate, irradiating the base plate with a light beam through the electro-optical element, and converting the optical changes detected for each pixel element electrode into a voltage distribution. The testing method in this invention is capable of identifying not only whether or not a pixel element electrode is functional, but also if a functional pixel element electrode is functioning as desired or not. Application of the testing method of this invention is able to test liquid crystal display base plates, including those which show ambiguous display irregularities. Electro-optical elements change their optical properties when an electrical field is applied thereto.

Abstract: The present invention provides an electro-optical element arranged to face a liquid crystal base plate, an electric source to impress an electric voltage between them, a source of light for irradiating light on the electro-optical element, a light detector to receive the reflected light from the electro-optical element, and a mounting device for fixing the liquid crystal base plate in a fixed position. The mounting device has a highly flat surface, groove thereon and vacuum attaches the liquid crystal base plate on the surface of the base platform. Light irradiates a reflective layer located on the lower surface of an electro-optical element which is in close proximity to the liquid crystal display base plate. A voltage is applied across the electro-optical element and the light reflected by the electro-optical element are measured. The optical characteristics of the electro-optical element is measured.

Abstract: LCD panels are inspected in-process to measure pixel decay, turn-on time and parasitic capacitance and/or identify pixel defects and line defects. Prior to final assembly, panels identified as having sufficiently few repairable defects are repaired. Line defects may be repaired. Further pixel defects may be repaired when redundant structures are included by splicing out the defective TFT or storage capacitor and splicing in a redundant, built-in TFT or storage capacitor. The inspection and repair systems are linked through a repair file. The inspection system identifies each defect by type and location and includes such information in the repair file. The repair system accesses such file and follows a prescribed repair method for a given type of defect at the location of such defect. The inspection system includes an automated non-contact voltage imaging system. The repair system includes lasers and means for repairing defects by adding metallization.

Abstract: A display panel testing apparatus, for observing large areas of a test panel, including an electro-optical element having optical properties that change to form images when an electric field is impressed thereon. The electro-optical element has a first surface facing a test panel that forms the electric field. The first surface and the test panel having a gap therebetween. The display panel testing apparatus also includes a light receptor for receiving the images from the electro-optical element and in particular a second surface of the electro-optical element. The display panel testing apparatus further includes a movable stage and movable mirrors coupled to the movable stage. The movable mirrors are adjustable to direct desired portions of the images onto the light receptor from desired positions of the electro-optical element. The movable stage also allows the movable mirrors to be positioned over the desired portions of the electro-optical element to receive the images portions therefrom.

Abstract: Final testing of an LCD panel or the like is performed after preliminary testing for short circuit defects. During final testing, the panel is exposed to signals at the shorting bars and the resulting display pattern is imaged. The resulting image data then is processed at a computer system to determine whether the resulting display pattern differs from an expected display pattern. If differences are present then an open circuit or pixel defect is present. The applied test signals and the pattern or differences determine the type of defect present. For an open circuit defect along a gate line, a partial row (column) of the resulting display pattern does not activate. For an open circuit along a drive line, a partial column (row) of the resulting display does not activate. Pixel shorts are identified by applying test signals to the shorting bars during a first test cycle, then imaging the display during a second test cycle after at least one of the test signals is removed.