Abstract: Exemplary embodiments described herein include a bi-directional Free Space Optical (FSO) communication unit that may be used in a multi-node FSO communication system. The bi-directional FSO unit may include a co-boresighted optical unit such that received and transmitted beams are coincident through a common aperture. Embodiments described herein may be used to correct or accommodate the alignment errors of the received and transmitted beams.

Abstract: A light emitting component includes an epitaxial structure, an adhesive layer, a first reflective layer, a second reflective layer, a block layer, a first electrode and a second electrode. The epitaxial structure includes a substrate, a first semiconductor layer, a light emitting layer and a second semiconductor layer. The adhesive layer is disposed on the second semiconductor layer of the epitaxial structure. The first reflective layer is disposed on the adhesive layer. The second reflective layer is disposed on the first reflective layer and extended onto the adhesive layer. A projection area of the second reflective layer is larger than a projection area of the first reflective layer. The block layer is disposed on the second reflective layer. The first electrode is electrically connected to the first semiconductor layer. The second electrode is electrically connected to the second semiconductor layer.

Abstract: A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate.

Abstract: Methods and apparatus for multi-probe photonic time-stretch spectral measurements are described. Methods allow for capturing real-time and single-shot non-overlapping spectral bands from multiple probes simultaneously, using Time-Stretch Dispersive Fourier Transform (TS-DFT) systems combined with Wavelength Division Multiplexing (WDM) device.

Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.

Abstract: A semiconductor structure includes a silicon substrate, an aluminum nitride layer and a plurality of grading stress buffer layers. The aluminum nitride layer is disposed on the silicon substrate. The grading stress buffer layers are disposed on the aluminum nitride layer. Each grading stress buffer layer includes a grading layer and a transition layer stacked up sequentially. A chemical formula of the grading layer is Al1-xGaxN, wherein the x value is increased from one side near the silicon substrate to a side away from the silicon substrate, and 0?x?1. A chemical formula of the transition layer is the same as the chemical formula of a side surface of the grading layer away from the silicon substrate. The chemical formula of the transition layer of the grading stress buffer layer furthest from the silicon substrate is GaN.

Abstract: The optical device includes a waveguide positioned on a base and a modulator positioned on the base. The modulator includes an electro-absorption medium. The waveguide is configured to guide a light signal through the modulator such that the light signal is guided through the electro-absorption medium. A heater is positioned on the electro-absorption medium such that the electro-absorption medium is between the base and the heater.

Abstract: The inventive optical component assembly advantageously enables a multi-waveguide optical component (such as the inventive optical fiber coupler array, a multi-core optical fiber, etc.), to be coupled to at least one waveguide of an optical device at a predefined coupling angle. The optical component assembly of the present invention comprises a multi-waveguide optical component with an output end, a prism having an input surface, an output surface, and an internal reflective surface with a predefined reflection angle, and a GRIN lens, positioned between the component output end and the prism input surface, along a longitudinal axis of the multi-waveguide optical component.

Abstract: The inventive configurable optical fiber polarization mode coupler is capable of providing a low-loss, high-coupling coefficient interface with high accuracy and easy alignment between a plurality of optical fibers (or other optical devices) with a first channel-to-channel spacing, and an optical device having a plurality of closely-spaced waveguide interfaces with a second channel-to-channel spacing, where each end of the optical fiber coupler array is configurable to have different channel-to-channel spacing, each matched to a corresponding one of the first and second channel-to-channel spacing, and that are preferably optimized for use with photonic integrated circuits, such as coupling to dense optical input/output interfaces, wafer-level testing, etc.

Abstract: This invention relates to a system and methods including their manufacturing technologies for enhanced sensing capability of one or more bioagents covering from HIV, Pathogens, virus, to cells detection. More particularly, this invention is related to HIV and pathogen diagnosis system and methods which may increase its sensitivity and may reduce the diagnosis time. Furthermore, the diagnosis system and method may be applicable to all early stage patients with various age groups, where early and accuracy in diagnosis, are required.

Abstract: A method of forming an optical device includes forming a waveguide mask on a device precursor. The device precursor includes a waveguide positioned on a base. The method also includes forming a facet mask on the device precursor such that at least a portion of the waveguide mask is between the facet mask and the base. The method also includes removing a portion of the base while the facet mask protects a facet of the waveguide.

Abstract: A hydro-thermal exchange unit (HTEU) for desalinating feed water in accordance with a humidification-dehumidification includes feed water, fresh water and gas conduit circuits for transporting feed water, fresh water, and gas, respectively. The unit also includes an evaporator through which a portion of the feed water conduit and the gas conduit pass. The evaporator causes evaporation of a portion of the feed water to produce vapor that is transported through the gas conduit. The unit also includes a condenser through which a portion of the gas conduit and the fresh water conduit pass. The condenser has input and output ports for coupling the gas and fresh water conduit circuits. The condenser extracts moisture from the vapor transported therethrough by the gas conduit. The extracted moisture is discharged through the fresh water conduit.

Abstract: A hydro-thermal exchange unit (HTEU) for desalinating feed water in accordance with a humidification-dehumidification includes feed water, fresh water and gas conduit circuits for transporting feed water, fresh water, and gas, respectively. The unit also includes an evaporator through which a portion of the feed water conduit and the gas conduit pass. The evaporator causes evaporation of a portion of the feed water to produce vapor that is transported through the gas conduit. The unit also includes a condenser through which a portion of the gas conduit and the fresh water conduit pass. The condenser has input and output ports for coupling the gas and fresh water conduit circuits. The condenser extracts moisture from the vapor transported therethrough by the gas conduit. The extracted moisture is discharged through the fresh water conduit.

Abstract: An optoelectronics chip-to-chip interconnects system is provided, including at least one packaged chip to be connected on the printed-circuit-board with at least one other packaged chip, optical-electrical (O-E) conversion mean, waveguide-board, and (PCB). Single to multiple chips interconnects can be interconnected provided using the technique disclosed in this invention. The packaged chip includes semiconductor die and its package based on the ball-grid array or chip-scale-package. The O-E board includes the optoelectronics components and multiple electrical contacts on both sides of the O-E substrate. The waveguide board includes the electrical conductor transferring the signal from O-E board to PCB and the flex optical waveguide easily stackable onto the PCB to guide optical signal from one chip-to-other chip. Alternatively, the electrode can be directly connected to the PCB instead of including in the waveguide board. The chip-to-chip interconnections system is pin-free and compatible with the PCB.

Abstract: Length metrology apparatuses and methods are disclosed for measuring both specular and non-specular surfaces with high accuracy and precision, and with suppressed phase induced distance errors. In one embodiment, a system includes a laser source exhibiting a first and second laser outputs with optical frequencies that are modulated linearly over large frequency ranges. The system further includes calibration and signal processing portions configured to determine a calibrated distance to at least one sample.

Abstract: A light emitting component includes a light emitting unit, a molding compound and a wavelength converting layer. The light emitting unit has a forward light emitting surface. The molding compound covers the light emitting unit. The wavelength converting layer is disposed above the molding compound. The wavelength converting layer has a first surface and a second surface opposite to the first surface, wherein the first surface is located between the forward light emitting surface and the second surface, and at least one of the first and second surfaces is non-planar.

Abstract: An optical multiplexer and methods of making and calibrating the same are disclosed. A method of aligning components in a multichannel optical/optoelectronic transmitter includes passively fixing a plurality of light emitters in place on a substrate; adjusting positions of a first lens passing light from a first light emitter and an optical signal transmission medium receiving the light from the first light emitter until a far field spot of the light from the first light emitter is at or near an end of the transmission medium; fixing one or more optical subassemblies on the substrate; and adjusting positions of the optical subassembly(ies) to align light from the remaining light emitters with the far field spot. Some embodiments include multiple optical subassemblies, each including a lens and a filter. Other embodiments include one optical subassembly including a mirror and a beam combiner.

Abstract: A multichannel optical coupler array comprises a coupler housing structure and longitudinal waveguides. At least one of the longitudinal waveguides is a vanishing core waveguide. The coupler housing structure at a proximity to a first end has one of the following cross sectional configurations: a ring surrounding the longitudinal waveguides, or a structure with holes, at least one hole containing at least one of the longitudinal waveguides.

Abstract: Disclosed herein is a monolithically integrated coherent receiver chip which has a geometric arrangement of the on-chip components that significantly improves the performance and the manufacturability of a coherent receiver module for Dual Polarization Quadrature Phase Shift Keyed (DP-QPSK) applications and other optical coherent detection systems. The coherent receiver chip comprises two optical hybrids, three optical inputs and eight electrical outputs with the two optical hybrids oriented perpendicular to the optical inputs and the electrical outputs which are widely spaced and arranged in a co-linear fashion that simplifies module design and assembly. The proposed geometric arrangement also replaces any optical waveguide crossings with vertical electrical-optical crossings and includes electrical transmissions which are used to minimize channel skew. The proposed configuration also has the additional benefit of improved thermal management by separating the module's trans-impedance amplifiers.

Abstract: The invention describes an integrated photonics platform comprising a plurality of at least three vertically-stacked waveguides which enables light transfer from one waveguide of the photonic structure into another waveguide by means of controlled tunneling method. The light transfer involves at least three waveguides wherein light power flows from initial waveguide into the final waveguide while tunneling through the intermediate ones. As an exemplary realization of the controlled tunneling waveguide integration, the invention describes a photonic integrated structure consisting of laser guide as upper waveguide, passive guide as middle waveguide, and modulator guide as lower waveguides. Controlled tunneling is enabled by the overlapped lateral tapers formed on the same or different vertical waveguide levels. In the further embodiments, the controlled tunneling platform is modified to implement wavelength-(de)multiplexing, polarization-splitting and beam-splitting functions.